TWI392337B - 晶圓為主之攝影機模組及其製造方法 - Google Patents

晶圓為主之攝影機模組及其製造方法 Download PDF

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Publication number
TWI392337B
TWI392337B TW095135550A TW95135550A TWI392337B TW I392337 B TWI392337 B TW I392337B TW 095135550 A TW095135550 A TW 095135550A TW 95135550 A TW95135550 A TW 95135550A TW I392337 B TWI392337 B TW I392337B
Authority
TW
Taiwan
Prior art keywords
lens
image capturing
wafer
camera module
integrated circuit
Prior art date
Application number
TW095135550A
Other languages
English (en)
Chinese (zh)
Other versions
TW200718185A (en
Inventor
東凱 上官
維迪阿達 西特拉姆 凱爾
山姆 威辛 譚
Original Assignee
帝歐希數位光學有限公司
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Publication date
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Application filed by 帝歐希數位光學有限公司 filed Critical 帝歐希數位光學有限公司
Publication of TW200718185A publication Critical patent/TW200718185A/zh
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Lens Barrels (AREA)
TW095135550A 2005-10-11 2006-09-26 晶圓為主之攝影機模組及其製造方法 TWI392337B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/247,993 US7796187B2 (en) 2004-02-20 2005-10-11 Wafer based camera module and method of manufacture

Publications (2)

Publication Number Publication Date
TW200718185A TW200718185A (en) 2007-05-01
TWI392337B true TWI392337B (zh) 2013-04-01

Family

ID=37963050

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095135550A TWI392337B (zh) 2005-10-11 2006-09-26 晶圓為主之攝影機模組及其製造方法

Country Status (7)

Country Link
US (1) US7796187B2 (enExample)
EP (1) EP1943833B1 (enExample)
JP (2) JP2009512346A (enExample)
CN (2) CN102761697B (enExample)
CA (1) CA2625587A1 (enExample)
TW (1) TWI392337B (enExample)
WO (1) WO2007047254A2 (enExample)

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Also Published As

Publication number Publication date
EP1943833A4 (en) 2010-04-07
CN101326811A (zh) 2008-12-17
EP1943833B1 (en) 2012-05-16
JP2009512346A (ja) 2009-03-19
JP2013214964A (ja) 2013-10-17
CN102761697A (zh) 2012-10-31
US20060132644A1 (en) 2006-06-22
WO2007047254A3 (en) 2007-10-11
CA2625587A1 (en) 2007-04-26
CN102761697B (zh) 2015-10-28
US7796187B2 (en) 2010-09-14
WO2007047254A2 (en) 2007-04-26
TW200718185A (en) 2007-05-01
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