JP2009512346A - ウェハー基板付カメラモジュール及び製造方法 - Google Patents

ウェハー基板付カメラモジュール及び製造方法 Download PDF

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Publication number
JP2009512346A
JP2009512346A JP2008535619A JP2008535619A JP2009512346A JP 2009512346 A JP2009512346 A JP 2009512346A JP 2008535619 A JP2008535619 A JP 2008535619A JP 2008535619 A JP2008535619 A JP 2008535619A JP 2009512346 A JP2009512346 A JP 2009512346A
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Prior art keywords
lens
image pickup
camera module
chip
manufacturing
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Pending
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JP2008535619A
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Japanese (ja)
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JP2009512346A5 (enExample
Inventor
ドンカイ シャングアン
ビジャダール シタラム ケイル
サミュエル ワイジング タム
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フレックストロニクス エーピー エルエルシー
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Application filed by フレックストロニクス エーピー エルエルシー filed Critical フレックストロニクス エーピー エルエルシー
Publication of JP2009512346A publication Critical patent/JP2009512346A/ja
Publication of JP2009512346A5 publication Critical patent/JP2009512346A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Lens Barrels (AREA)
JP2008535619A 2005-10-11 2006-10-10 ウェハー基板付カメラモジュール及び製造方法 Pending JP2009512346A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/247,993 US7796187B2 (en) 2004-02-20 2005-10-11 Wafer based camera module and method of manufacture
PCT/US2006/039521 WO2007047254A2 (en) 2005-10-11 2006-10-10 Wafer based camera module and method of manufacture

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013057363A Division JP2013214964A (ja) 2005-10-11 2013-03-19 ウェハー基板付カメラモジュール及び製造方法

Publications (2)

Publication Number Publication Date
JP2009512346A true JP2009512346A (ja) 2009-03-19
JP2009512346A5 JP2009512346A5 (enExample) 2009-11-26

Family

ID=37963050

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008535619A Pending JP2009512346A (ja) 2005-10-11 2006-10-10 ウェハー基板付カメラモジュール及び製造方法
JP2013057363A Pending JP2013214964A (ja) 2005-10-11 2013-03-19 ウェハー基板付カメラモジュール及び製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2013057363A Pending JP2013214964A (ja) 2005-10-11 2013-03-19 ウェハー基板付カメラモジュール及び製造方法

Country Status (7)

Country Link
US (1) US7796187B2 (enExample)
EP (1) EP1943833B1 (enExample)
JP (2) JP2009512346A (enExample)
CN (2) CN102761697B (enExample)
CA (1) CA2625587A1 (enExample)
TW (1) TWI392337B (enExample)
WO (1) WO2007047254A2 (enExample)

Cited By (3)

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JP2014238596A (ja) * 2008-02-22 2014-12-18 デジタルオプティクス コーポレーション ウェハレベルの光学素子の取り付け
KR20190021378A (ko) * 2016-06-23 2019-03-05 닝보 써니 오포테크 코., 엘티디. 고정 초점 카메라 모듈 및 이의 제조 방법
JP2024522496A (ja) * 2021-05-27 2024-06-21 コノート、エレクトロニクス、リミテッド 専用レンズヒータを有する自動車用カメラ、ならびに自動車

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US20060132644A1 (en) 2006-06-22
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US7796187B2 (en) 2010-09-14
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