|
US709843A
(en)
*
|
1902-05-22 |
1902-09-23 |
Darwin E Wright |
Locking mechanism for card-index systems or the like.
|
|
US2039593A
(en)
|
1935-06-20 |
1936-05-05 |
Theodore N Hubbuch |
Heat transfer coil
|
|
US3361195A
(en)
|
1966-09-23 |
1968-01-02 |
Westinghouse Electric Corp |
Heat sink member for a semiconductor device
|
|
US3524497A
(en)
|
1968-04-04 |
1970-08-18 |
Ibm |
Heat transfer in a liquid cooling system
|
|
US3771219A
(en)
|
1970-02-05 |
1973-11-13 |
Sharp Kk |
Method for manufacturing semiconductor device
|
|
DE2102254B2
(de)
|
1971-01-19 |
1973-05-30 |
Robert Bosch Gmbh, 7000 Stuttgart |
Kuehlvorrichtung fuer leistungshalbleiterbauelemente
|
|
IT959730B
(it)
*
|
1972-05-18 |
1973-11-10 |
Oronzio De Nura Impianti Elett |
Anodo per sviluppo di ossigeno
|
|
FR2216537B1
(enExample)
|
1973-02-06 |
1975-03-07 |
Gaz De France |
|
|
US3852806A
(en)
|
1973-05-02 |
1974-12-03 |
Gen Electric |
Nonwicked heat-pipe cooled power semiconductor device assembly having enhanced evaporated surface heat pipes
|
|
US3923426A
(en)
*
|
1974-08-15 |
1975-12-02 |
Alza Corp |
Electroosmotic pump and fluid dispenser including same
|
|
US4032415A
(en)
*
|
1974-08-16 |
1977-06-28 |
The Mead Corporation |
Method for promoting reduction oxidation of electrolytically produced gas
|
|
US4072188A
(en)
|
1975-07-02 |
1978-02-07 |
Honeywell Information Systems Inc. |
Fluid cooling systems for electronic systems
|
|
GB1521464A
(en)
*
|
1975-10-15 |
1978-08-16 |
Thorn Automation Ltd |
Mounting of electrical equipment for cooling
|
|
US3993123A
(en)
*
|
1975-10-28 |
1976-11-23 |
International Business Machines Corporation |
Gas encapsulated cooling module
|
|
US4312012A
(en)
|
1977-11-25 |
1982-01-19 |
International Business Machines Corp. |
Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant
|
|
US4203488A
(en)
|
1978-03-01 |
1980-05-20 |
Aavid Engineering, Inc. |
Self-fastened heat sinks
|
|
US4392362A
(en)
|
1979-03-23 |
1983-07-12 |
The Board Of Trustees Of The Leland Stanford Junior University |
Micro miniature refrigerators
|
|
US4235285A
(en)
|
1979-10-29 |
1980-11-25 |
Aavid Engineering, Inc. |
Self-fastened heat sinks
|
|
US4296455A
(en)
*
|
1979-11-23 |
1981-10-20 |
International Business Machines Corporation |
Slotted heat sinks for high powered air cooled modules
|
|
US4332291A
(en)
*
|
1979-12-21 |
1982-06-01 |
D. Mulock-Bentley And Associates (Proprietary) Limited |
Heat exchanger with slotted fin strips
|
|
US4345267A
(en)
|
1980-03-31 |
1982-08-17 |
Amp Incorporated |
Active device substrate connector having a heat sink
|
|
US4573067A
(en)
|
1981-03-02 |
1986-02-25 |
The Board Of Trustees Of The Leland Stanford Junior University |
Method and means for improved heat removal in compact semiconductor integrated circuits
|
|
US4450472A
(en)
|
1981-03-02 |
1984-05-22 |
The Board Of Trustees Of The Leland Stanford Junior University |
Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels
|
|
US4574876A
(en)
|
1981-05-11 |
1986-03-11 |
Extracorporeal Medical Specialties, Inc. |
Container with tapered walls for heating or cooling fluids
|
|
US4485429A
(en)
|
1982-06-09 |
1984-11-27 |
Sperry Corporation |
Apparatus for cooling integrated circuit chips
|
|
US4516632A
(en)
|
1982-08-31 |
1985-05-14 |
The United States Of America As Represented By The United States Deparment Of Energy |
Microchannel crossflow fluid heat exchanger and method for its fabrication
|
|
US4467861A
(en)
|
1982-10-04 |
1984-08-28 |
Otdel Fiziko-Tekhnicheskikh Problem Energetiki Uralskogo Nauchnogo Tsentra Akademii Nauk Sssr |
Heat-transporting device
|
|
GB8323065D0
(en)
|
1983-08-26 |
1983-09-28 |
Rca Corp |
Flux free photo-detector soldering
|
|
US4567505A
(en)
|
1983-10-27 |
1986-01-28 |
The Board Of Trustees Of The Leland Stanford Junior University |
Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like
|
|
US4561040A
(en)
|
1984-07-12 |
1985-12-24 |
Ibm Corporation |
Cooling system for VLSI circuit chips
|
|
US4568431A
(en)
|
1984-11-13 |
1986-02-04 |
Olin Corporation |
Process for producing electroplated and/or treated metal foil
|
|
FR2573731B1
(fr)
*
|
1984-11-29 |
1987-01-30 |
Eparco Sa |
Emballage pour produit pulverulent comportant une fermeture inviolable
|
|
JPS61106095U
(enExample)
*
|
1984-12-19 |
1986-07-05 |
|
|
|
ATE64808T1
(de)
*
|
1985-12-13 |
1991-07-15 |
Hasler Ag Ascom |
Verfahren und vorrichtung zum abfuehren der verlustwaerme wenigstens einer baugruppe elektrischer elemente.
|
|
US4758926A
(en)
|
1986-03-31 |
1988-07-19 |
Microelectronics And Computer Technology Corporation |
Fluid-cooled integrated circuit package
|
|
US4716494A
(en)
|
1986-11-07 |
1987-12-29 |
Amp Incorporated |
Retention system for removable heat sink
|
|
US4868712A
(en)
|
1987-02-04 |
1989-09-19 |
Woodman John K |
Three dimensional integrated circuit package
|
|
GB2204181B
(en)
*
|
1987-04-27 |
1990-03-21 |
Thermalloy Inc |
Heat sink apparatus and method of manufacture
|
|
US4903761A
(en)
|
1987-06-03 |
1990-02-27 |
Lockheed Missiles & Space Company, Inc. |
Wick assembly for self-regulated fluid management in a pumped two-phase heat transfer system
|
|
JPS6424447U
(enExample)
|
1987-08-04 |
1989-02-09 |
|
|
|
US4791983A
(en)
*
|
1987-10-13 |
1988-12-20 |
Unisys Corporation |
Self-aligning liquid-cooling assembly
|
|
US5016138A
(en)
|
1987-10-27 |
1991-05-14 |
Woodman John K |
Three dimensional integrated circuit package
|
|
US4894709A
(en)
|
1988-03-09 |
1990-01-16 |
Massachusetts Institute Of Technology |
Forced-convection, liquid-cooled, microchannel heat sinks
|
|
US4896719A
(en)
|
1988-05-11 |
1990-01-30 |
Mcdonnell Douglas Corporation |
Isothermal panel and plenum
|
|
US4908112A
(en)
|
1988-06-16 |
1990-03-13 |
E. I. Du Pont De Nemours & Co. |
Silicon semiconductor wafer for analyzing micronic biological samples
|
|
US4866570A
(en)
|
1988-08-05 |
1989-09-12 |
Ncr Corporation |
Apparatus and method for cooling an electronic device
|
|
US4938280A
(en)
|
1988-11-07 |
1990-07-03 |
Clark William E |
Liquid-cooled, flat plate heat exchanger
|
|
CA2002213C
(en)
|
1988-11-10 |
1999-03-30 |
Iwona Turlik |
High performance integrated circuit chip package and method of making same
|
|
US5009760A
(en)
|
1989-07-28 |
1991-04-23 |
Board Of Trustees Of The Leland Stanford Junior University |
System for measuring electrokinetic properties and for characterizing electrokinetic separations by monitoring current in electrophoresis
|
|
JPH0370197A
(ja)
*
|
1989-08-09 |
1991-03-26 |
Nec Commun Syst Ltd |
電子装置用冷却機構
|
|
US4978638A
(en)
|
1989-12-21 |
1990-12-18 |
International Business Machines Corporation |
Method for attaching heat sink to plastic packaged electronic component
|
|
US5083194A
(en)
|
1990-01-16 |
1992-01-21 |
Cray Research, Inc. |
Air jet impingement on miniature pin-fin heat sinks for cooling electronic components
|
|
US5858188A
(en)
|
1990-02-28 |
1999-01-12 |
Aclara Biosciences, Inc. |
Acrylic microchannels and their use in electrophoretic applications
|
|
US5070040A
(en)
|
1990-03-09 |
1991-12-03 |
University Of Colorado Foundation, Inc. |
Method and apparatus for semiconductor circuit chip cooling
|
|
US4987996A
(en)
|
1990-03-15 |
1991-01-29 |
Atco Rubber Products, Inc. |
Flexible duct and carton
|
|
US5016090A
(en)
|
1990-03-21 |
1991-05-14 |
International Business Machines Corporation |
Cross-hatch flow distribution and applications thereof
|
|
US5043797A
(en)
|
1990-04-03 |
1991-08-27 |
General Electric Company |
Cooling header connection for a thyristor stack
|
|
JPH07114250B2
(ja)
|
1990-04-27 |
1995-12-06 |
インターナショナル・ビジネス・マシーンズ・コーポレイション |
熱伝達システム
|
|
US5265670A
(en)
|
1990-04-27 |
1993-11-30 |
International Business Machines Corporation |
Convection transfer system
|
|
US5088005A
(en)
|
1990-05-08 |
1992-02-11 |
Sundstrand Corporation |
Cold plate for cooling electronics
|
|
US5161089A
(en)
|
1990-06-04 |
1992-11-03 |
International Business Machines Corporation |
Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same
|
|
US5203401A
(en)
|
1990-06-29 |
1993-04-20 |
Digital Equipment Corporation |
Wet micro-channel wafer chuck and cooling method
|
|
US5285347A
(en)
|
1990-07-02 |
1994-02-08 |
Digital Equipment Corporation |
Hybird cooling system for electronic components
|
|
US5057908A
(en)
|
1990-07-10 |
1991-10-15 |
Iowa State University Research Foundation, Inc. |
High power semiconductor device with integral heat sink
|
|
US5420067A
(en)
|
1990-09-28 |
1995-05-30 |
The United States Of America As Represented By The Secretary Of The Navy |
Method of fabricatring sub-half-micron trenches and holes
|
|
JPH0467399U
(enExample)
*
|
1990-10-22 |
1992-06-15 |
|
|
|
US5099910A
(en)
|
1991-01-15 |
1992-03-31 |
Massachusetts Institute Of Technology |
Microchannel heat sink with alternating flow directions
|
|
US5099311A
(en)
|
1991-01-17 |
1992-03-24 |
The United States Of America As Represented By The United States Department Of Energy |
Microchannel heat sink assembly
|
|
JPH06342990A
(ja)
|
1991-02-04 |
1994-12-13 |
Internatl Business Mach Corp <Ibm> |
統合冷却システム
|
|
US5131233A
(en)
|
1991-03-08 |
1992-07-21 |
Cray Computer Corporation |
Gas-liquid forced turbulence cooling
|
|
US5232047A
(en)
|
1991-04-02 |
1993-08-03 |
Microunity Systems Engineering, Inc. |
Heat exchanger for solid-state electronic devices
|
|
US5125451A
(en)
|
1991-04-02 |
1992-06-30 |
Microunity Systems Engineering, Inc. |
Heat exchanger for solid-state electronic devices
|
|
US5263251A
(en)
|
1991-04-02 |
1993-11-23 |
Microunity Systems Engineering |
Method of fabricating a heat exchanger for solid-state electronic devices
|
|
US5105430A
(en)
*
|
1991-04-09 |
1992-04-14 |
The United States Of America As Represented By The United States Department Of Energy |
Thin planar package for cooling an array of edge-emitting laser diodes
|
|
FR2679729B1
(fr)
|
1991-07-23 |
1994-04-29 |
Alcatel Telspace |
Dissipateur thermique.
|
|
US5239200A
(en)
|
1991-08-21 |
1993-08-24 |
International Business Machines Corporation |
Apparatus for cooling integrated circuit chips
|
|
US5228502A
(en)
|
1991-09-04 |
1993-07-20 |
International Business Machines Corporation |
Cooling by use of multiple parallel convective surfaces
|
|
JPH05217121A
(ja)
|
1991-11-22 |
1993-08-27 |
Internatl Business Mach Corp <Ibm> |
磁気変換器付きチップ等の感熱素子を結合する方法及び装置
|
|
DE69305667T2
(de)
*
|
1992-03-09 |
1997-05-28 |
Sumitomo Metal Ind |
Wärmesenke mit guten wärmezerstreuenden Eigenschaften und Herstellungsverfahren
|
|
US5218515A
(en)
|
1992-03-13 |
1993-06-08 |
The United States Of America As Represented By The United States Department Of Energy |
Microchannel cooling of face down bonded chips
|
|
US5239443A
(en)
|
1992-04-23 |
1993-08-24 |
International Business Machines Corporation |
Blind hole cold plate cooling system
|
|
US5317805A
(en)
|
1992-04-28 |
1994-06-07 |
Minnesota Mining And Manufacturing Company |
Method of making microchanneled heat exchangers utilizing sacrificial cores
|
|
US5294834A
(en)
|
1992-06-01 |
1994-03-15 |
Sverdrup Technology, Inc. |
Low resistance contacts for shallow junction semiconductors
|
|
US5247800A
(en)
*
|
1992-06-03 |
1993-09-28 |
General Electric Company |
Thermal connector with an embossed contact for a cryogenic apparatus
|
|
US5275237A
(en)
*
|
1992-06-12 |
1994-01-04 |
Micron Technology, Inc. |
Liquid filled hot plate for precise temperature control
|
|
US5308429A
(en)
|
1992-09-29 |
1994-05-03 |
Digital Equipment Corporation |
System for bonding a heatsink to a semiconductor chip package
|
|
DE69312628T2
(de)
*
|
1992-10-27 |
1998-02-12 |
Canon Kk |
Verfahren zum Fördern von Flüssigkeiten
|
|
DE4240082C1
(de)
|
1992-11-28 |
1994-04-21 |
Erno Raumfahrttechnik Gmbh |
Wärmerohr
|
|
US5316077A
(en)
|
1992-12-09 |
1994-05-31 |
Eaton Corporation |
Heat sink for electrical circuit components
|
|
US5520244A
(en)
|
1992-12-16 |
1996-05-28 |
Sdl, Inc. |
Micropost waste heat removal system
|
|
DE4242841C2
(de)
|
1992-12-17 |
1995-05-11 |
Litef Gmbh |
Verfahren und Regeleinrichtung zur Temperaturregelung für ein peltierbetriebenes Temperiergerät
|
|
US5269372A
(en)
|
1992-12-21 |
1993-12-14 |
International Business Machines Corporation |
Intersecting flow network for a cold plate cooling system
|
|
US5397919A
(en)
|
1993-03-04 |
1995-03-14 |
Square Head, Inc. |
Heat sink assembly for solid state devices
|
|
US5299635A
(en)
|
1993-03-05 |
1994-04-05 |
Wynn's Climate Systems, Inc. |
Parallel flow condenser baffle
|
|
JPH06326226A
(ja)
|
1993-03-15 |
1994-11-25 |
Toshiba Corp |
冷却装置
|
|
US5534328A
(en)
|
1993-12-02 |
1996-07-09 |
E. I. Du Pont De Nemours And Company |
Integrated chemical processing apparatus and processes for the preparation thereof
|
|
JP3477781B2
(ja)
|
1993-03-23 |
2003-12-10 |
セイコーエプソン株式会社 |
Icカード
|
|
US5436793A
(en)
|
1993-03-31 |
1995-07-25 |
Ncr Corporation |
Apparatus for containing and cooling an integrated circuit device having a thermally insulative positioning member
|
|
US5670033A
(en)
*
|
1993-04-19 |
1997-09-23 |
Electrocopper Products Limited |
Process for making copper metal powder, copper oxides and copper foil
|
|
US5427174A
(en)
|
1993-04-30 |
1995-06-27 |
Heat Transfer Devices, Inc. |
Method and apparatus for a self contained heat exchanger
|
|
US5380956A
(en)
|
1993-07-06 |
1995-01-10 |
Sun Microsystems, Inc. |
Multi-chip cooling module and method
|
|
US5727618A
(en)
|
1993-08-23 |
1998-03-17 |
Sdl Inc |
Modular microchannel heat exchanger
|
|
US5514906A
(en)
|
1993-11-10 |
1996-05-07 |
Fujitsu Limited |
Apparatus for cooling semiconductor chips in multichip modules
|
|
US5383340A
(en)
|
1994-03-24 |
1995-01-24 |
Aavid Laboratories, Inc. |
Two-phase cooling system for laptop computers
|
|
US5424918A
(en)
*
|
1994-03-31 |
1995-06-13 |
Hewlett-Packard Company |
Universal hybrid mounting system
|
|
WO1995026954A1
(de)
|
1994-04-05 |
1995-10-12 |
Bayer Aktiengesellschaft |
Alkoxy-alkyl-substituierte 1-h-3-aryl-pyrrolidin-2,4-dione als herbizide und pestizide
|
|
US5647429A
(en)
|
1994-06-16 |
1997-07-15 |
Oktay; Sevgin |
Coupled, flux transformer heat pipes
|
|
US5544696A
(en)
|
1994-07-01 |
1996-08-13 |
The United States Of America As Represented By The Secretary Of The Air Force |
Enhanced nucleate boiling heat transfer for electronic cooling and thermal energy transfer
|
|
US6129973A
(en)
|
1994-07-29 |
2000-10-10 |
Battelle Memorial Institute |
Microchannel laminated mass exchanger and method of making
|
|
US5811062A
(en)
|
1994-07-29 |
1998-09-22 |
Battelle Memorial Institute |
Microcomponent chemical process sheet architecture
|
|
US5641400A
(en)
|
1994-10-19 |
1997-06-24 |
Hewlett-Packard Company |
Use of temperature control devices in miniaturized planar column devices and miniaturized total analysis systems
|
|
US5508234A
(en)
|
1994-10-31 |
1996-04-16 |
International Business Machines Corporation |
Microcavity structures, fabrication processes, and applications thereof
|
|
US5585069A
(en)
|
1994-11-10 |
1996-12-17 |
David Sarnoff Research Center, Inc. |
Partitioned microelectronic and fluidic device array for clinical diagnostics and chemical synthesis
|
|
DE19514548C1
(de)
|
1995-04-20 |
1996-10-02 |
Daimler Benz Ag |
Verfahren zur Herstellung einer Mikrokühleinrichtung
|
|
US5548605A
(en)
|
1995-05-15 |
1996-08-20 |
The Regents Of The University Of California |
Monolithic microchannel heatsink
|
|
US5575929A
(en)
|
1995-06-05 |
1996-11-19 |
The Regents Of The University Of California |
Method for making circular tubular channels with two silicon wafers
|
|
JPH09102568A
(ja)
|
1995-10-05 |
1997-04-15 |
Mitsubishi Electric Corp |
プレート型ヒートシンク
|
|
US5696405A
(en)
|
1995-10-13 |
1997-12-09 |
Lucent Technologies Inc. |
Microelectronic package with device cooling
|
|
US5685966A
(en)
*
|
1995-10-20 |
1997-11-11 |
The United States Of America As Represented By The Secretary Of The Navy |
Bubble capture electrode configuration
|
|
JPH09129790A
(ja)
|
1995-11-07 |
1997-05-16 |
Toshiba Corp |
ヒートシンク装置
|
|
US5705018A
(en)
|
1995-12-13 |
1998-01-06 |
Hartley; Frank T. |
Micromachined peristaltic pump
|
|
JP3029792B2
(ja)
|
1995-12-28 |
2000-04-04 |
日本サーボ株式会社 |
多相永久磁石型回転電機
|
|
US5761037A
(en)
|
1996-02-12 |
1998-06-02 |
International Business Machines Corporation |
Orientation independent evaporator
|
|
US5768104A
(en)
|
1996-02-22 |
1998-06-16 |
Cray Research, Inc. |
Cooling approach for high power integrated circuits mounted on printed circuit boards
|
|
US5675473A
(en)
|
1996-02-23 |
1997-10-07 |
Motorola, Inc. |
Apparatus and method for shielding an electronic module from electromagnetic radiation
|
|
US5885470A
(en)
|
1997-04-14 |
1999-03-23 |
Caliper Technologies Corporation |
Controlled fluid transport in microfabricated polymeric substrates
|
|
US6016864A
(en)
|
1996-04-19 |
2000-01-25 |
Heatcraft Inc. |
Heat exchanger with relatively flat fluid conduits
|
|
JPH09298380A
(ja)
*
|
1996-05-02 |
1997-11-18 |
Fujitsu Ltd |
シェルフユニットの冷却構造
|
|
JP3329663B2
(ja)
*
|
1996-06-21 |
2002-09-30 |
株式会社日立製作所 |
電子装置用冷却装置
|
|
US5740013A
(en)
|
1996-07-03 |
1998-04-14 |
Hewlett-Packard Company |
Electronic device enclosure having electromagnetic energy containment and heat removal characteristics
|
|
US5800690A
(en)
|
1996-07-03 |
1998-09-01 |
Caliper Technologies Corporation |
Variable control of electroosmotic and/or electrophoretic forces within a fluid-containing structure via electrical forces
|
|
US5763951A
(en)
|
1996-07-22 |
1998-06-09 |
Northrop Grumman Corporation |
Non-mechanical magnetic pump for liquid cooling
|
|
US5692558A
(en)
|
1996-07-22 |
1997-12-02 |
Northrop Grumman Corporation |
Microchannel cooling using aviation fuels for airborne electronics
|
|
US5801442A
(en)
|
1996-07-22 |
1998-09-01 |
Northrop Grumman Corporation |
Microchannel cooling of high power semiconductor devices
|
|
US5731954A
(en)
|
1996-08-22 |
1998-03-24 |
Cheon; Kioan |
Cooling system for computer
|
|
JPH1084139A
(ja)
|
1996-09-09 |
1998-03-31 |
Technova:Kk |
熱電変換装置
|
|
US5835345A
(en)
|
1996-10-02 |
1998-11-10 |
Sdl, Inc. |
Cooler for removing heat from a heated region
|
|
US5983997A
(en)
|
1996-10-17 |
1999-11-16 |
Brazonics, Inc. |
Cold plate having uniform pressure drop and uniform flow rate
|
|
US5830806A
(en)
*
|
1996-10-18 |
1998-11-03 |
Micron Technology, Inc. |
Wafer backing member for mechanical and chemical-mechanical planarization of substrates
|
|
DE19643717A1
(de)
|
1996-10-23 |
1998-04-30 |
Asea Brown Boveri |
Flüssigkeits-Kühlvorrichtung für ein Hochleistungshalbleitermodul
|
|
US5726795A
(en)
|
1996-10-30 |
1998-03-10 |
Hughes Electronics |
Compact phase-conjugate mirror utilizing four-wave mixing in a loop configuration
|
|
US5774779A
(en)
|
1996-11-06 |
1998-06-30 |
Materials And Electrochemical Research (Mer) Corporation |
Multi-channel structures and processes for making such structures
|
|
US5870823A
(en)
|
1996-11-27 |
1999-02-16 |
International Business Machines Corporation |
Method of forming a multilayer electronic packaging substrate with integral cooling channels
|
|
US5927390A
(en)
*
|
1996-12-13 |
1999-07-27 |
Caterpillar Inc. |
Radiator arrangement with offset modular cores
|
|
US5964092A
(en)
|
1996-12-13 |
1999-10-12 |
Nippon Sigmax, Co., Ltd. |
Electronic cooling apparatus
|
|
JPH10190071A
(ja)
|
1996-12-20 |
1998-07-21 |
Aisin Seiki Co Ltd |
多段電子冷却装置
|
|
JPH10223811A
(ja)
|
1997-02-12 |
1998-08-21 |
Hitachi Metals Ltd |
ヒートスプレッダおよびこれを用いた半導体装置ならびにヒートスプレッダの製造方法
|
|
DE19710783C2
(de)
|
1997-03-17 |
2003-08-21 |
Curamik Electronics Gmbh |
Kühler zur Verwendung als Wärmesenke für elektrische Bauelemente oder Schaltkreise
|
|
JP2874684B2
(ja)
*
|
1997-03-27 |
1999-03-24 |
日本電気株式会社 |
プラグインユニットの放熱構造
|
|
US5993750A
(en)
|
1997-04-11 |
1999-11-30 |
Eastman Kodak Company |
Integrated ceramic micro-chemical plant
|
|
US5921087A
(en)
|
1997-04-22 |
1999-07-13 |
Intel Corporation |
Method and apparatus for cooling integrated circuits using a thermoelectric module
|
|
US5880524A
(en)
|
1997-05-05 |
1999-03-09 |
Intel Corporation |
Heat pipe lid for electronic packages
|
|
JP2002512737A
(ja)
|
1997-05-08 |
2002-04-23 |
ナノシステムズ,インコーポレイテッド |
マイクロチャンネルプレートを製造するためのシリコンエッチング方法
|
|
US5901037A
(en)
|
1997-06-18 |
1999-05-04 |
Northrop Grumman Corporation |
Closed loop liquid cooling for semiconductor RF amplifier modules
|
|
US6907921B2
(en)
|
1998-06-18 |
2005-06-21 |
3M Innovative Properties Company |
Microchanneled active fluid heat exchanger
|
|
US6069791A
(en)
|
1997-08-14 |
2000-05-30 |
Fujikura Ltd. |
Cooling device for notebook personal computer
|
|
TW495062U
(en)
|
1997-08-28 |
2002-07-11 |
Wen-Liang Huang |
Structure improvement of heat dissipation plate
|
|
US6012902A
(en)
|
1997-09-25 |
2000-01-11 |
Caliper Technologies Corp. |
Micropump
|
|
US5945217A
(en)
|
1997-10-14 |
1999-08-31 |
Gore Enterprise Holdings, Inc. |
Thermally conductive polytrafluoroethylene article
|
|
US5829514A
(en)
|
1997-10-29 |
1998-11-03 |
Eastman Kodak Company |
Bonded cast, pin-finned heat sink and method of manufacture
|
|
US6084178A
(en)
*
|
1998-02-27 |
2000-07-04 |
Hewlett-Packard Company |
Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU)
|
|
US6125902A
(en)
*
|
1998-04-17 |
2000-10-03 |
Guddal; Karl |
Apparatus for applying an improved adhesive to sheet insulation having drainage channels
|
|
US6019165A
(en)
|
1998-05-18 |
2000-02-01 |
Batchelder; John Samuel |
Heat exchange apparatus
|
|
US6227287B1
(en)
|
1998-05-25 |
2001-05-08 |
Denso Corporation |
Cooling apparatus by boiling and cooling refrigerant
|
|
EP1003006A1
(en)
|
1998-11-19 |
2000-05-24 |
Franz Isella S.p.A. |
Hybrid system of passive cooling using heat pipes
|
|
US6086330A
(en)
*
|
1998-12-21 |
2000-07-11 |
Motorola, Inc. |
Low-noise, high-performance fan
|
|
JP2000277540A
(ja)
|
1999-03-24 |
2000-10-06 |
Fuji Photo Film Co Ltd |
部品のボンディング装置
|
|
US6234240B1
(en)
|
1999-07-01 |
2001-05-22 |
Kioan Cheon |
Fanless cooling system for computer
|
|
US6396706B1
(en)
*
|
1999-07-30 |
2002-05-28 |
Credence Systems Corporation |
Self-heating circuit board
|
|
US6675875B1
(en)
|
1999-08-06 |
2004-01-13 |
The Ohio State University |
Multi-layered micro-channel heat sink, devices and systems incorporating same
|
|
US6457515B1
(en)
|
1999-08-06 |
2002-10-01 |
The Ohio State University |
Two-layered micro channel heat sink, devices and systems incorporating same
|
|
JP3518434B2
(ja)
*
|
1999-08-11 |
2004-04-12 |
株式会社日立製作所 |
マルチチップモジュールの冷却装置
|
|
US6360814B1
(en)
|
1999-08-31 |
2002-03-26 |
Denso Corporation |
Cooling device boiling and condensing refrigerant
|
|
US6293333B1
(en)
|
1999-09-02 |
2001-09-25 |
The United States Of America As Represented By The Secretary Of The Air Force |
Micro channel heat pipe having wire cloth wick and method of fabrication
|
|
GB9922124D0
(en)
|
1999-09-17 |
1999-11-17 |
Pfizer Ltd |
Phosphodiesterase enzymes
|
|
US6166907A
(en)
|
1999-11-26 |
2000-12-26 |
Chien; Chuan-Fu |
CPU cooling system
|
|
US6729383B1
(en)
|
1999-12-16 |
2004-05-04 |
The United States Of America As Represented By The Secretary Of The Navy |
Fluid-cooled heat sink with turbulence-enhancing support pins
|
|
US6324075B1
(en)
|
1999-12-20 |
2001-11-27 |
Intel Corporation |
Partially covered motherboard with EMI partition gateway
|
|
JP2001185306A
(ja)
|
1999-12-28 |
2001-07-06 |
Jst Mfg Co Ltd |
モジュール用コネクタ
|
|
US6570764B2
(en)
*
|
1999-12-29 |
2003-05-27 |
Intel Corporation |
Low thermal resistance interface for attachment of thermal materials to a processor die
|
|
US6272012B1
(en)
|
2000-02-03 |
2001-08-07 |
Crystal Group Inc. |
System and method for cooling compact PCI circuit cards in a computer
|
|
EP1266548B2
(en)
|
2000-03-21 |
2015-07-29 |
Liebert Corporation |
Method and apparatus for cooling electronic enclosures
|
|
JP2002028775A
(ja)
|
2000-05-10 |
2002-01-29 |
Denso Corp |
耐腐食性熱交換器の製造方法
|
|
US6407916B1
(en)
|
2000-06-12 |
2002-06-18 |
Intel Corporation |
Computer assembly for cooling high powered microprocessors
|
|
US6787052B1
(en)
|
2000-06-19 |
2004-09-07 |
Vladimir Vaganov |
Method for fabricating microstructures with deep anisotropic etching of thick silicon wafers
|
|
TW449040U
(en)
|
2000-06-20 |
2001-08-01 |
Advanced Thermal Technologies |
Improved structure of planar heat tube
|
|
US6366462B1
(en)
|
2000-07-18 |
2002-04-02 |
International Business Machines Corporation |
Electronic module with integral refrigerant evaporator assembly and control system therefore
|
|
JP2002099356A
(ja)
|
2000-09-21 |
2002-04-05 |
Toshiba Corp |
電子機器用冷却装置および電子機器
|
|
US6469893B1
(en)
|
2000-09-29 |
2002-10-22 |
Intel Corporation |
Direct heatpipe attachment to die using center point loading
|
|
US6478258B1
(en)
*
|
2000-11-21 |
2002-11-12 |
Space Systems/Loral, Inc. |
Spacecraft multiple loop heat pipe thermal system for internal equipment panel applications
|
|
US6578626B1
(en)
|
2000-11-21 |
2003-06-17 |
Thermal Corp. |
Liquid cooled heat exchanger with enhanced flow
|
|
US6367544B1
(en)
*
|
2000-11-21 |
2002-04-09 |
Thermal Corp. |
Thermal jacket for reducing condensation and method for making same
|
|
US6367543B1
(en)
*
|
2000-12-11 |
2002-04-09 |
Thermal Corp. |
Liquid-cooled heat sink with thermal jacket
|
|
JP3607608B2
(ja)
|
2000-12-19 |
2005-01-05 |
株式会社日立製作所 |
ノート型パソコンの液冷システム
|
|
CA2329408C
(en)
|
2000-12-21 |
2007-12-04 |
Long Manufacturing Ltd. |
Finned plate heat exchanger
|
|
US6698924B2
(en)
*
|
2000-12-21 |
2004-03-02 |
Tank, Inc. |
Cooling system comprising a circular venturi
|
|
US6431260B1
(en)
|
2000-12-21 |
2002-08-13 |
International Business Machines Corporation |
Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof
|
|
US6563703B2
(en)
|
2000-12-27 |
2003-05-13 |
Intel Corporation |
Portable and plugable thermal and power solution for a notebook or handheld device
|
|
WO2002074032A1
(fr)
*
|
2001-03-02 |
2002-09-19 |
Sanyo Electric Co., Ltd. |
Dispositif electronique
|
|
US20020134543A1
(en)
*
|
2001-03-20 |
2002-09-26 |
Motorola, Inc |
Connecting device with local heating element and method for using same
|
|
US7462852B2
(en)
|
2001-12-17 |
2008-12-09 |
Tecomet, Inc. |
Devices, methods, and systems involving cast collimators
|
|
US6449162B1
(en)
*
|
2001-06-07 |
2002-09-10 |
International Business Machines Corporation |
Removable land grid array cooling solution
|
|
US6796372B2
(en)
*
|
2001-06-12 |
2004-09-28 |
Liebert Corporation |
Single or dual buss thermal transfer system
|
|
US6657121B2
(en)
*
|
2001-06-27 |
2003-12-02 |
Thermal Corp. |
Thermal management system and method for electronics system
|
|
US6536510B2
(en)
|
2001-07-10 |
2003-03-25 |
Thermal Corp. |
Thermal bus for cabinets housing high power electronics equipment
|
|
US6385044B1
(en)
|
2001-07-27 |
2002-05-07 |
International Business Machines Corporation |
Heat pipe heat sink assembly for cooling semiconductor chips
|
|
US6674643B2
(en)
*
|
2001-08-09 |
2004-01-06 |
International Business Machines Corporation |
Thermal connector for transferring heat between removable printed circuit boards
|
|
JP3636118B2
(ja)
*
|
2001-09-04 |
2005-04-06 |
株式会社日立製作所 |
電子装置用の水冷装置
|
|
US6981543B2
(en)
*
|
2001-09-20 |
2006-01-03 |
Intel Corporation |
Modular capillary pumped loop cooling system
|
|
US6942018B2
(en)
*
|
2001-09-28 |
2005-09-13 |
The Board Of Trustees Of The Leland Stanford Junior University |
Electroosmotic microchannel cooling system
|
|
US20030205363A1
(en)
|
2001-11-09 |
2003-11-06 |
International Business Machines Corporation |
Enhanced air cooling of electronic devices using fluid phase change heat transfer
|
|
US6581388B2
(en)
|
2001-11-27 |
2003-06-24 |
Sun Microsystems, Inc. |
Active temperature gradient reducer
|
|
US6693797B2
(en)
*
|
2002-01-04 |
2004-02-17 |
Intel Corporation |
Computer system having a chassis-level thermal interface component and a frame-level thermal interface component that are thermally engageable with and disengageable from one another
|
|
US7133283B2
(en)
*
|
2002-01-04 |
2006-11-07 |
Intel Corporation |
Frame-level thermal interface component for transfer of heat from an electronic component of a computer system
|
|
US6836407B2
(en)
*
|
2002-01-04 |
2004-12-28 |
Intel Corporation |
Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structure
|
|
US6700785B2
(en)
*
|
2002-01-04 |
2004-03-02 |
Intel Corporation |
Computer system which locks a server unit subassembly in a selected position in a support frame
|
|
US6643132B2
(en)
*
|
2002-01-04 |
2003-11-04 |
Intel Corporation |
Chassis-level thermal interface component for transfer of heat from an electronic component of a computer system
|
|
US6679315B2
(en)
|
2002-01-14 |
2004-01-20 |
Marconi Communications, Inc. |
Small scale chip cooler assembly
|
|
JP3961843B2
(ja)
|
2002-02-08 |
2007-08-22 |
株式会社日立製作所 |
液体冷却システムを有する小型電子計算機
|
|
TW510490U
(en)
|
2002-04-18 |
2002-11-11 |
Hon Hai Prec Ind Co Ltd |
Heat pipe
|
|
TWI234063B
(en)
*
|
2002-05-15 |
2005-06-11 |
Matsushita Electric Industrial Co Ltd |
Cooling apparatus for electronic equipment
|
|
US7209355B2
(en)
|
2002-05-15 |
2007-04-24 |
Matsushita Electric Industrial Co., Ltd. |
Cooling device and an electronic apparatus including the same
|
|
US6674642B1
(en)
|
2002-06-27 |
2004-01-06 |
International Business Machines Corporation |
Liquid-to-air cooling system for portable electronic and computer devices
|
|
US6988534B2
(en)
|
2002-11-01 |
2006-01-24 |
Cooligy, Inc. |
Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
|
|
US20040008483A1
(en)
*
|
2002-07-13 |
2004-01-15 |
Kioan Cheon |
Water cooling type cooling system for electronic device
|
|
US20040020225A1
(en)
|
2002-08-02 |
2004-02-05 |
Patel Chandrakant D. |
Cooling system
|
|
US6836131B2
(en)
|
2002-08-16 |
2004-12-28 |
Credence Systems Corp. |
Spray cooling and transparent cooling plate thermal management system
|
|
WO2004017698A1
(ja)
*
|
2002-08-16 |
2004-02-26 |
Nec Corporation |
電子機器の冷却装置
|
|
TW578992U
(en)
|
2002-09-09 |
2004-03-01 |
Hon Hai Prec Ind Co Ltd |
Heat sink assembly
|
|
DE10243026B3
(de)
*
|
2002-09-13 |
2004-06-03 |
Oliver Laing |
Vorrichtung zur lokalen Kühlung oder Erwärmung eines Gegenstandes
|
|
US6894899B2
(en)
*
|
2002-09-13 |
2005-05-17 |
Hong Kong Cheung Tat Electrical Co. Ltd. |
Integrated fluid cooling system for electronic components
|
|
US6714412B1
(en)
|
2002-09-13 |
2004-03-30 |
International Business Machines Corporation |
Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use
|
|
DE10242776B4
(de)
*
|
2002-09-14 |
2013-05-23 |
Alstom Technology Ltd. |
Verfahren zum Betrieb einer Abgasreinigungsanlage
|
|
US6881039B2
(en)
|
2002-09-23 |
2005-04-19 |
Cooligy, Inc. |
Micro-fabricated electrokinetic pump
|
|
AU2003270882A1
(en)
|
2002-09-23 |
2004-05-04 |
Cooligy, Inc. |
Micro-fabricated electrokinetic pump with on-frit electrode
|
|
US6807056B2
(en)
*
|
2002-09-24 |
2004-10-19 |
Hitachi, Ltd. |
Electronic equipment
|
|
DE10246990A1
(de)
|
2002-10-02 |
2004-04-22 |
Atotech Deutschland Gmbh |
Mikrostrukturkühler und dessen Verwendung
|
|
US6994151B2
(en)
|
2002-10-22 |
2006-02-07 |
Cooligy, Inc. |
Vapor escape microchannel heat exchanger
|
|
US6829142B2
(en)
*
|
2002-10-25 |
2004-12-07 |
Hewlett-Packard Development Company, L.P. |
Cell thermal connector
|
|
US7156159B2
(en)
|
2003-03-17 |
2007-01-02 |
Cooligy, Inc. |
Multi-level microchannel heat exchangers
|
|
US7000684B2
(en)
*
|
2002-11-01 |
2006-02-21 |
Cooligy, Inc. |
Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
|
|
US6988535B2
(en)
|
2002-11-01 |
2006-01-24 |
Cooligy, Inc. |
Channeled flat plate fin heat exchange system, device and method
|
|
WO2004042306A2
(en)
|
2002-11-01 |
2004-05-21 |
Cooligy, Inc. |
Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device
|
|
US6986382B2
(en)
|
2002-11-01 |
2006-01-17 |
Cooligy Inc. |
Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
|
|
US20060060333A1
(en)
|
2002-11-05 |
2006-03-23 |
Lalit Chordia |
Methods and apparatuses for electronics cooling
|
|
US7210227B2
(en)
*
|
2002-11-26 |
2007-05-01 |
Intel Corporation |
Decreasing thermal contact resistance at a material interface
|
|
KR20040065626A
(ko)
|
2003-01-15 |
2004-07-23 |
엘지전자 주식회사 |
열 교환기
|
|
US7201012B2
(en)
|
2003-01-31 |
2007-04-10 |
Cooligy, Inc. |
Remedies to prevent cracking in a liquid system
|
|
US7044196B2
(en)
|
2003-01-31 |
2006-05-16 |
Cooligy,Inc |
Decoupled spring-loaded mounting apparatus and method of manufacturing thereof
|
|
JP4199018B2
(ja)
*
|
2003-02-14 |
2008-12-17 |
株式会社日立製作所 |
ラックマウントサーバシステム
|
|
US7017654B2
(en)
|
2003-03-17 |
2006-03-28 |
Cooligy, Inc. |
Apparatus and method of forming channels in a heat-exchanging device
|
|
US6903929B2
(en)
*
|
2003-03-31 |
2005-06-07 |
Intel Corporation |
Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink
|
|
US6934154B2
(en)
|
2003-03-31 |
2005-08-23 |
Intel Corporation |
Micro-channel heat exchangers and spreaders
|
|
US6992891B2
(en)
|
2003-04-02 |
2006-01-31 |
Intel Corporation |
Metal ball attachment of heat dissipation devices
|
|
JP2004363308A
(ja)
*
|
2003-06-04 |
2004-12-24 |
Hitachi Ltd |
ラックマウントサーバシステム
|
|
US6763880B1
(en)
*
|
2003-06-26 |
2004-07-20 |
Evserv Tech Corporation |
Liquid cooled radiation module for servers
|
|
CN100579348C
(zh)
*
|
2003-06-27 |
2010-01-06 |
日本电气株式会社 |
电子设备的冷却装置
|
|
US6819563B1
(en)
|
2003-07-02 |
2004-11-16 |
International Business Machines Corporation |
Method and system for cooling electronics racks using pre-cooled air
|
|
US7021369B2
(en)
|
2003-07-23 |
2006-04-04 |
Cooligy, Inc. |
Hermetic closed loop fluid system
|
|
US7508672B2
(en)
|
2003-09-10 |
2009-03-24 |
Qnx Cooling Systems Inc. |
Cooling system
|
|
JP4157451B2
(ja)
|
2003-09-30 |
2008-10-01 |
株式会社東芝 |
気液分離機構、リザーブタンク、及び電子機器
|
|
US7012807B2
(en)
*
|
2003-09-30 |
2006-03-14 |
International Business Machines Corporation |
Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack
|
|
TWM248227U
(en)
*
|
2003-10-17 |
2004-10-21 |
Hon Hai Prec Ind Co Ltd |
Liquid cooling apparatus
|
|
US6963490B2
(en)
*
|
2003-11-10 |
2005-11-08 |
Honeywell International Inc. |
Methods and apparatus for conductive cooling of electronic units
|
|
US7273088B2
(en)
|
2003-12-17 |
2007-09-25 |
Hewlett-Packard Development Company, L.P. |
One or more heat exchanger components in major part operably locatable outside computer chassis
|
|
US6980435B2
(en)
|
2004-01-28 |
2005-12-27 |
Hewlett-Packard Development Company, L.P. |
Modular electronic enclosure with cooling design
|
|
JP2005228216A
(ja)
*
|
2004-02-16 |
2005-08-25 |
Hitachi Ltd |
電子機器
|
|
US20050257532A1
(en)
|
2004-03-11 |
2005-11-24 |
Masami Ikeda |
Module for cooling semiconductor device
|
|
US6955212B1
(en)
*
|
2004-04-20 |
2005-10-18 |
Adda Corporation |
Water-cooler radiator module
|
|
US7325588B2
(en)
|
2004-04-29 |
2008-02-05 |
Hewlett-Packard Development Company, L.P. |
High serviceability liquid cooling loop using flexible bellows
|
|
US7011143B2
(en)
|
2004-05-04 |
2006-03-14 |
International Business Machines Corporation |
Method and apparatus for cooling electronic components
|
|
US7248472B2
(en)
*
|
2004-05-21 |
2007-07-24 |
Hewlett-Packard Development Company, L.P. |
Air distribution system
|
|
US7301773B2
(en)
*
|
2004-06-04 |
2007-11-27 |
Cooligy Inc. |
Semi-compliant joining mechanism for semiconductor cooling applications
|
|
US7154749B2
(en)
*
|
2004-06-08 |
2006-12-26 |
Nvidia Corporation |
System for efficiently cooling a processor
|
|
JP4056504B2
(ja)
|
2004-08-18 |
2008-03-05 |
Necディスプレイソリューションズ株式会社 |
冷却装置及びこれを備えた電子機器
|
|
US7239516B2
(en)
|
2004-09-10 |
2007-07-03 |
International Business Machines Corporation |
Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip
|
|
US20060067052A1
(en)
|
2004-09-30 |
2006-03-30 |
Llapitan David J |
Liquid cooling system
|
|
US7243704B2
(en)
|
2004-11-18 |
2007-07-17 |
Delta Design, Inc. |
Mechanical assembly for regulating the temperature of an electronic device, having a spring with one slideable end
|
|
US7397665B2
(en)
|
2004-12-08 |
2008-07-08 |
Optherm - Thermal Solutions Ltd. |
Integral heat-dissipation system for electronic boards
|
|
US7184269B2
(en)
|
2004-12-09 |
2007-02-27 |
International Business Machines Company |
Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly
|
|
US7327570B2
(en)
|
2004-12-22 |
2008-02-05 |
Hewlett-Packard Development Company, L.P. |
Fluid cooled integrated circuit module
|
|
CN100371854C
(zh)
*
|
2004-12-24 |
2008-02-27 |
富准精密工业(深圳)有限公司 |
液冷式散热装置
|
|
US7280363B2
(en)
|
2005-01-21 |
2007-10-09 |
Delphi Technologies, Inc. |
Apparatus for controlling thermal interface between cold plate and integrated circuit chip
|
|
US7116552B2
(en)
|
2005-01-31 |
2006-10-03 |
Chaun-Choung Technology Corp. |
Heat-dissipation apparatus of portable computer
|
|
US7254957B2
(en)
|
2005-02-15 |
2007-08-14 |
Raytheon Company |
Method and apparatus for cooling with coolant at a subambient pressure
|
|
US20060187639A1
(en)
*
|
2005-02-23 |
2006-08-24 |
Lytron, Inc. |
Electronic component cooling and interface system
|
|
US7385810B2
(en)
|
2005-04-18 |
2008-06-10 |
International Business Machines Corporation |
Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack
|
|
US7342789B2
(en)
|
2005-06-30 |
2008-03-11 |
International Business Machines Corporation |
Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling
|
|
US7719837B2
(en)
|
2005-08-22 |
2010-05-18 |
Shan Ping Wu |
Method and apparatus for cooling a blade server
|
|
US7327571B2
(en)
|
2005-09-06 |
2008-02-05 |
Hewlett-Packard Development Company, L.P. |
Thermal load balancing systems and methods
|
|
US7382863B2
(en)
|
2005-10-31 |
2008-06-03 |
General Electric Company |
Anode cooling system for an X-ray tube
|
|
US7212409B1
(en)
*
|
2005-12-05 |
2007-05-01 |
Hewlett-Packard Development Company, L.P. |
Cam actuated cold plate
|
|
US7562696B2
(en)
|
2006-05-16 |
2009-07-21 |
Cpumate, Inc. |
Juxtaposing structure for heated ends of heat pipes
|
|
US20070297136A1
(en)
|
2006-06-23 |
2007-12-27 |
Sun Micosystems, Inc. |
Modular liquid cooling of electronic components while preserving data center integrity
|
|
US20080013283A1
(en)
*
|
2006-07-17 |
2008-01-17 |
Gilbert Gary L |
Mechanism for cooling electronic components
|
|
CN101517185B
(zh)
|
2006-07-18 |
2013-06-12 |
力博特公司 |
整体式旋转液压连接件、门铰链及其使用方法和系统
|
|
US7403384B2
(en)
|
2006-07-26 |
2008-07-22 |
Dell Products L.P. |
Thermal docking station for electronics
|