TW495062U - Structure improvement of heat dissipation plate - Google Patents
Structure improvement of heat dissipation plateInfo
- Publication number
- TW495062U TW495062U TW86214680U TW86214680U TW495062U TW 495062 U TW495062 U TW 495062U TW 86214680 U TW86214680 U TW 86214680U TW 86214680 U TW86214680 U TW 86214680U TW 495062 U TW495062 U TW 495062U
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipation
- dissipation plate
- structure improvement
- improvement
- plate
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW86214680U TW495062U (en) | 1997-08-28 | 1997-08-28 | Structure improvement of heat dissipation plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW86214680U TW495062U (en) | 1997-08-28 | 1997-08-28 | Structure improvement of heat dissipation plate |
Publications (1)
Publication Number | Publication Date |
---|---|
TW495062U true TW495062U (en) | 2002-07-11 |
Family
ID=21628513
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW86214680U TW495062U (en) | 1997-08-28 | 1997-08-28 | Structure improvement of heat dissipation plate |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW495062U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7836597B2 (en) | 2002-11-01 | 2010-11-23 | Cooligy Inc. | Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system |
US8464781B2 (en) | 2002-11-01 | 2013-06-18 | Cooligy Inc. | Cooling systems incorporating heat exchangers and thermoelectric layers |
US8602092B2 (en) | 2003-07-23 | 2013-12-10 | Cooligy, Inc. | Pump and fan control concepts in a cooling system |
-
1997
- 1997-08-28 TW TW86214680U patent/TW495062U/en unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7836597B2 (en) | 2002-11-01 | 2010-11-23 | Cooligy Inc. | Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system |
US8464781B2 (en) | 2002-11-01 | 2013-06-18 | Cooligy Inc. | Cooling systems incorporating heat exchangers and thermoelectric layers |
US8602092B2 (en) | 2003-07-23 | 2013-12-10 | Cooligy, Inc. | Pump and fan control concepts in a cooling system |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB2325781B (en) | Heat sink | |
GB9918815D0 (en) | Heat sink | |
GB2330901B (en) | Heat dissipation device | |
TW422371U (en) | Auxiliary fixing apparatus of heat dissipation plate | |
GB2294286A8 (en) | Heat sink mounting structure | |
GB2323434B (en) | Heat sink | |
TW495062U (en) | Structure improvement of heat dissipation plate | |
EP1015836A4 (en) | Heat sink including pedestal | |
TW435722U (en) | Structure of heat dissipation plate | |
TW431616U (en) | Structure of heat dissipation plate | |
TW316432U (en) | Improved structure of heat dissipation device | |
TW481304U (en) | Heat sink device of protruded plate type | |
TW365411U (en) | Structure of combination heat dissipation fins | |
TW422357U (en) | CPU heat dissipation plate assembly structure | |
TW323816U (en) | Structure of down-blowing type heat dissipating device | |
TW371544U (en) | Improved structure of heat sink | |
TW433718U (en) | Sheet-assembled heat dissipation device | |
TW333234U (en) | Heat dissipation plate structure having air convection function | |
TW316367U (en) | Improved heat dissipation structure for lamp | |
GB9722655D0 (en) | Heat sink | |
TW441810U (en) | Fixing structure of microprocessor heat dissipation plate | |
TW458326U (en) | Fixing structure of heat dissipation plate for central processor | |
TW461538U (en) | Structure of heat dissipation device | |
TW309124U (en) | Improved microprocessor heat dissipation structure | |
TW325961U (en) | Structure of heat dissipating module |