TW495062U - Structure improvement of heat dissipation plate - Google Patents

Structure improvement of heat dissipation plate

Info

Publication number
TW495062U
TW495062U TW86214680U TW86214680U TW495062U TW 495062 U TW495062 U TW 495062U TW 86214680 U TW86214680 U TW 86214680U TW 86214680 U TW86214680 U TW 86214680U TW 495062 U TW495062 U TW 495062U
Authority
TW
Taiwan
Prior art keywords
heat dissipation
dissipation plate
structure improvement
improvement
plate
Prior art date
Application number
TW86214680U
Other languages
Chinese (zh)
Inventor
Wen-Liang Huang
Original Assignee
Wen-Liang Huang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wen-Liang Huang filed Critical Wen-Liang Huang
Priority to TW86214680U priority Critical patent/TW495062U/en
Publication of TW495062U publication Critical patent/TW495062U/en

Links

TW86214680U 1997-08-28 1997-08-28 Structure improvement of heat dissipation plate TW495062U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW86214680U TW495062U (en) 1997-08-28 1997-08-28 Structure improvement of heat dissipation plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW86214680U TW495062U (en) 1997-08-28 1997-08-28 Structure improvement of heat dissipation plate

Publications (1)

Publication Number Publication Date
TW495062U true TW495062U (en) 2002-07-11

Family

ID=21628513

Family Applications (1)

Application Number Title Priority Date Filing Date
TW86214680U TW495062U (en) 1997-08-28 1997-08-28 Structure improvement of heat dissipation plate

Country Status (1)

Country Link
TW (1) TW495062U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7836597B2 (en) 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US8602092B2 (en) 2003-07-23 2013-12-10 Cooligy, Inc. Pump and fan control concepts in a cooling system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7836597B2 (en) 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US8602092B2 (en) 2003-07-23 2013-12-10 Cooligy, Inc. Pump and fan control concepts in a cooling system

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