TW422357U - CPU heat dissipation plate assembly structure - Google Patents

CPU heat dissipation plate assembly structure

Info

Publication number
TW422357U
TW422357U TW87205800U TW87205800U TW422357U TW 422357 U TW422357 U TW 422357U TW 87205800 U TW87205800 U TW 87205800U TW 87205800 U TW87205800 U TW 87205800U TW 422357 U TW422357 U TW 422357U
Authority
TW
Taiwan
Prior art keywords
heat dissipation
plate assembly
assembly structure
dissipation plate
cpu heat
Prior art date
Application number
TW87205800U
Other languages
Chinese (zh)
Inventor
Jen-Yu Liou
Original Assignee
Pentalpha Internat Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pentalpha Internat Inc filed Critical Pentalpha Internat Inc
Priority to TW87205800U priority Critical patent/TW422357U/en
Publication of TW422357U publication Critical patent/TW422357U/en

Links

TW87205800U 1998-04-17 1998-04-17 CPU heat dissipation plate assembly structure TW422357U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW87205800U TW422357U (en) 1998-04-17 1998-04-17 CPU heat dissipation plate assembly structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW87205800U TW422357U (en) 1998-04-17 1998-04-17 CPU heat dissipation plate assembly structure

Publications (1)

Publication Number Publication Date
TW422357U true TW422357U (en) 2001-02-11

Family

ID=21633497

Family Applications (1)

Application Number Title Priority Date Filing Date
TW87205800U TW422357U (en) 1998-04-17 1998-04-17 CPU heat dissipation plate assembly structure

Country Status (1)

Country Link
TW (1) TW422357U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI694760B (en) * 2017-01-25 2020-05-21 雙鴻科技股份有限公司 Securing device and electronic device having the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI694760B (en) * 2017-01-25 2020-05-21 雙鴻科技股份有限公司 Securing device and electronic device having the same

Similar Documents

Publication Publication Date Title
TW477437U (en) Assembled-type CPU heat sink
GB9822370D0 (en) Heat dissipating device
GB2294286B (en) CPU heat sink mounting structure
TW422357U (en) CPU heat dissipation plate assembly structure
TW453470U (en) Heat dissipation structure
TW495062U (en) Structure improvement of heat dissipation plate
GB9800969D0 (en) Heat dissipating device
TW388605U (en) Heat dissipation device
TW470178U (en) CPU cassette combined with heat sink structure
TW433490U (en) Cartridge assembly heat dissipation plate structure for CPU
TW525800U (en) Structure improvement of CPU heat dissipation plate
TW433494U (en) Fastening device structure for press-rod type heat dissipation plate
TW364621U (en) CPU radiator with wind-guiding plate
TW416544U (en) CPU heat dissipation mechanism
TW440017U (en) Improved assembly structure of CPU heat dissipation device
TW362786U (en) Structure for heat dissipating device
TW391533U (en) Improved CPU heat sink structure
TW437998U (en) Easily disassembling heat dissipation module structure
TW406821U (en) Heat dissipation device
TW450380U (en) Fan fixed structure for heat sink
TW388603U (en) High-efficiency heat dissipation structure
TW484719U (en) Computer case heat dissipation structure
TW458328U (en) Structure of heat dissipation plate for the combination of CPU and cassette
TW369183U (en) Clipped set structure for microprocessor heat dissipation fins
TW500302U (en) Heat dissipation plate structure

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees