TW500302U - Heat dissipation plate structure - Google Patents

Heat dissipation plate structure

Info

Publication number
TW500302U
TW500302U TW90201182U TW90201182U TW500302U TW 500302 U TW500302 U TW 500302U TW 90201182 U TW90201182 U TW 90201182U TW 90201182 U TW90201182 U TW 90201182U TW 500302 U TW500302 U TW 500302U
Authority
TW
Taiwan
Prior art keywords
heat dissipation
plate structure
dissipation plate
heat
plate
Prior art date
Application number
TW90201182U
Other languages
Chinese (zh)
Inventor
Bo-Bin Tsai
Original Assignee
Advanced Thermal Technologies
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Thermal Technologies filed Critical Advanced Thermal Technologies
Priority to TW90201182U priority Critical patent/TW500302U/en
Publication of TW500302U publication Critical patent/TW500302U/en

Links

TW90201182U 2001-01-19 2001-01-19 Heat dissipation plate structure TW500302U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90201182U TW500302U (en) 2001-01-19 2001-01-19 Heat dissipation plate structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90201182U TW500302U (en) 2001-01-19 2001-01-19 Heat dissipation plate structure

Publications (1)

Publication Number Publication Date
TW500302U true TW500302U (en) 2002-08-21

Family

ID=21680761

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90201182U TW500302U (en) 2001-01-19 2001-01-19 Heat dissipation plate structure

Country Status (1)

Country Link
TW (1) TW500302U (en)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees