JP2009507378A5 - - Google Patents

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Publication number
JP2009507378A5
JP2009507378A5 JP2008529307A JP2008529307A JP2009507378A5 JP 2009507378 A5 JP2009507378 A5 JP 2009507378A5 JP 2008529307 A JP2008529307 A JP 2008529307A JP 2008529307 A JP2008529307 A JP 2008529307A JP 2009507378 A5 JP2009507378 A5 JP 2009507378A5
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JP
Japan
Prior art keywords
doped
conductivity type
region
forming
emitter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008529307A
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English (en)
Japanese (ja)
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JP2009507378A (ja
Filing date
Publication date
Priority claimed from US11/217,304 external-priority patent/US7285469B2/en
Application filed filed Critical
Publication of JP2009507378A publication Critical patent/JP2009507378A/ja
Publication of JP2009507378A5 publication Critical patent/JP2009507378A5/ja
Pending legal-status Critical Current

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JP2008529307A 2005-09-02 2006-09-01 空乏可能コレクタ列を備えた改良されたbvceo/rcs相殺を有するバイポーラ構造 Pending JP2009507378A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/217,304 US7285469B2 (en) 2005-09-02 2005-09-02 Bipolar method and structure having improved BVCEO/RCS trade-off made with depletable collector columns
PCT/US2006/034224 WO2007028016A2 (en) 2005-09-02 2006-09-01 Bipolar method and structure with depletable collector colums

Publications (2)

Publication Number Publication Date
JP2009507378A JP2009507378A (ja) 2009-02-19
JP2009507378A5 true JP2009507378A5 (enExample) 2012-04-12

Family

ID=37690563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008529307A Pending JP2009507378A (ja) 2005-09-02 2006-09-01 空乏可能コレクタ列を備えた改良されたbvceo/rcs相殺を有するバイポーラ構造

Country Status (7)

Country Link
US (4) US7285469B2 (enExample)
EP (1) EP1922758B1 (enExample)
JP (1) JP2009507378A (enExample)
KR (1) KR100956241B1 (enExample)
CN (1) CN101258601B (enExample)
TW (1) TWI356492B (enExample)
WO (1) WO2007028016A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7482672B2 (en) * 2006-06-30 2009-01-27 International Business Machines Corporation Semiconductor device structures for bipolar junction transistors
KR100812079B1 (ko) * 2006-08-22 2008-03-07 동부일렉트로닉스 주식회사 수직형 바이폴라 접합 트랜지스터 및 그 제조 방법, 이를갖는 씨모스 이미지 센서 및 그 제조 방법
JP5217257B2 (ja) * 2007-06-06 2013-06-19 株式会社デンソー 半導体装置およびその製造方法
US7847373B2 (en) * 2008-12-22 2010-12-07 Agostino Pirovano Fabricating bipolar junction select transistors for semiconductor memories
WO2010118215A1 (en) * 2009-04-09 2010-10-14 Georgia Tech Research Corporation Superjunction collectors for transistors & semiconductor devices
US12426286B2 (en) 2016-06-25 2025-09-23 Texas Instruments Incorporated Radiation enhanced bipolar transistor
CN110010693B (zh) * 2019-05-07 2024-03-12 无锡紫光微电子有限公司 一种高压深沟槽型超结mosfet的结构及其制作方法
DE112020005498T5 (de) * 2019-11-08 2022-09-15 Nisshinbo Micro Devices Inc. Halbleiterbauelement
CN118825062B (zh) * 2024-09-13 2024-12-27 芯联先锋集成电路制造(绍兴)有限公司 半导体器件、双极型晶体管及其制备方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3131611A1 (de) * 1981-08-10 1983-02-24 Siemens AG, 1000 Berlin und 8000 München Epitaxialer transistor
US4532003A (en) 1982-08-09 1985-07-30 Harris Corporation Method of fabrication bipolar transistor with improved base collector breakdown voltage and collector series resistance
US4729008A (en) 1982-12-08 1988-03-01 Harris Corporation High voltage IC bipolar transistors operable to BVCBO and method of fabrication
US5344785A (en) * 1992-03-13 1994-09-06 United Technologies Corporation Method of forming high speed, high voltage fully isolated bipolar transistors on a SOI substrate
US5428233A (en) * 1994-04-04 1995-06-27 Motorola Inc. Voltage controlled resistive device
US5633180A (en) 1995-06-01 1997-05-27 Harris Corporation Method of forming P-type islands over P-type buried layer
US6423990B1 (en) * 1997-09-29 2002-07-23 National Scientific Corporation Vertical heterojunction bipolar transistor
JP4447065B2 (ja) * 1999-01-11 2010-04-07 富士電機システムズ株式会社 超接合半導体素子の製造方法
US6475864B1 (en) 1999-10-21 2002-11-05 Fuji Electric Co., Ltd. Method of manufacturing a super-junction semiconductor device with an conductivity type layer
US6559517B2 (en) 2000-04-27 2003-05-06 En Jun Zhu Structure for a semiconductor device
JP4534303B2 (ja) 2000-04-27 2010-09-01 富士電機システムズ株式会社 横型超接合半導体素子
DE10106073C2 (de) 2001-02-09 2003-01-30 Infineon Technologies Ag SOI-Bauelement
US6822292B2 (en) * 2001-11-21 2004-11-23 Intersil Americas Inc. Lateral MOSFET structure of an integrated circuit having separated device regions
JP4166627B2 (ja) * 2003-05-30 2008-10-15 株式会社デンソー 半導体装置
CN1823421B (zh) * 2003-08-20 2010-04-28 株式会社电装 垂直型半导体装置
US6740563B1 (en) * 2003-10-02 2004-05-25 Taiwan Semiconductor Manufacturing Co., Ltd. Amorphizing ion implant method for forming polysilicon emitter bipolar transistor
JP4904673B2 (ja) * 2004-02-09 2012-03-28 富士電機株式会社 半導体装置および半導体装置の製造方法

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