JP2009266979A - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP2009266979A
JP2009266979A JP2008113333A JP2008113333A JP2009266979A JP 2009266979 A JP2009266979 A JP 2009266979A JP 2008113333 A JP2008113333 A JP 2008113333A JP 2008113333 A JP2008113333 A JP 2008113333A JP 2009266979 A JP2009266979 A JP 2009266979A
Authority
JP
Japan
Prior art keywords
silicon substrate
semiconductor device
surface side
substrate
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008113333A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009266979A5 (https=
Inventor
Tomoji Fujii
朋治 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2008113333A priority Critical patent/JP2009266979A/ja
Priority to TW098113278A priority patent/TW200945546A/zh
Priority to US12/428,594 priority patent/US20090267221A1/en
Publication of JP2009266979A publication Critical patent/JP2009266979A/ja
Publication of JP2009266979A5 publication Critical patent/JP2009266979A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/698—Semiconductor materials that are electrically insulating, e.g. undoped silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Transceivers (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Waveguide Aerials (AREA)
JP2008113333A 2008-04-24 2008-04-24 半導体装置 Pending JP2009266979A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008113333A JP2009266979A (ja) 2008-04-24 2008-04-24 半導体装置
TW098113278A TW200945546A (en) 2008-04-24 2009-04-22 Semiconductor device
US12/428,594 US20090267221A1 (en) 2008-04-24 2009-04-23 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008113333A JP2009266979A (ja) 2008-04-24 2008-04-24 半導体装置

Publications (2)

Publication Number Publication Date
JP2009266979A true JP2009266979A (ja) 2009-11-12
JP2009266979A5 JP2009266979A5 (https=) 2011-03-17

Family

ID=41214190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008113333A Pending JP2009266979A (ja) 2008-04-24 2008-04-24 半導体装置

Country Status (3)

Country Link
US (1) US20090267221A1 (https=)
JP (1) JP2009266979A (https=)
TW (1) TW200945546A (https=)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013021628A (ja) * 2011-07-14 2013-01-31 Fujitsu Semiconductor Ltd 半導体装置及びその製造方法
WO2013080560A1 (ja) * 2011-12-02 2013-06-06 パナソニック株式会社 無線モジュール
WO2014119302A1 (ja) * 2013-01-29 2014-08-07 パナソニック株式会社 無線モジュール及び無線モジュールの製造方法
JP2014150154A (ja) * 2013-01-31 2014-08-21 Shinko Electric Ind Co Ltd 電子部品内蔵基板及びその製造方法
JPWO2013084479A1 (ja) * 2011-12-05 2015-04-27 パナソニックＩｐマネジメント株式会社 無線モジュール
JPWO2013084496A1 (ja) * 2011-12-07 2015-04-27 パナソニックＩｐマネジメント株式会社 無線モジュール
JP2016506675A (ja) * 2013-01-14 2016-03-03 インテル・コーポレーション 裏面再配線層パッチアンテナ
JPWO2016056387A1 (ja) * 2014-10-07 2017-07-20 株式会社村田製作所 高周波通信モジュール及び高周波通信装置
WO2018101767A1 (ko) * 2016-12-01 2018-06-07 주식회사 네패스 Ems 안테나 모듈 및 그 제조방법과 이를 포함하는 반도체 패키지
JP6474879B1 (ja) * 2017-11-29 2019-02-27 株式会社フジクラ 配線基板、及び、配線基板の製造方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI370530B (en) * 2008-05-21 2012-08-11 Advanced Semiconductor Eng Semiconductor package having an antenna
TWI553732B (zh) * 2013-01-25 2016-10-11 矽品精密工業股份有限公司 電子封裝件
JP6027905B2 (ja) * 2013-01-31 2016-11-16 新光電気工業株式会社 半導体装置
WO2014196143A1 (ja) * 2013-06-04 2014-12-11 パナソニックＩｐマネジメント株式会社 無線モジュール
US10784206B2 (en) 2015-09-21 2020-09-22 Mediatek Inc. Semiconductor package
US10130302B2 (en) * 2016-06-29 2018-11-20 International Business Machines Corporation Via and trench filling using injection molded soldering
TWI663701B (zh) * 2017-04-28 2019-06-21 Siliconware Precision Industries Co., Ltd. 電子封裝件及其製法
TWI684260B (zh) * 2017-05-11 2020-02-01 矽品精密工業股份有限公司 電子封裝件及其製法
EP3486943A1 (en) * 2017-11-17 2019-05-22 MediaTek Inc Semiconductor package
TWI668831B (zh) * 2018-04-17 2019-08-11 Siliconware Precision Industries Co., Ltd. 電子裝置與電子封裝件

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10233621A (ja) * 1997-02-20 1998-09-02 Sharp Corp アンテナ一体化マイクロ波・ミリ波回路
JP2005176366A (ja) * 2003-12-09 2005-06-30 Internatl Business Mach Corp <Ibm> 基板内に放射素子として形成されたビアを使用してアンテナを構成する装置および方法
JP2007042978A (ja) * 2005-08-05 2007-02-15 Shinko Electric Ind Co Ltd 半導体装置
JP2007067215A (ja) * 2005-08-31 2007-03-15 Sanyo Electric Co Ltd 回路基板、回路基板の製造方法および回路装置
JP2007073849A (ja) * 2005-09-08 2007-03-22 Sharp Corp 電子回路モジュールとその製造方法

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US6303878B1 (en) * 1997-07-24 2001-10-16 Denso Corporation Mounting structure of electronic component on substrate board
US6833613B1 (en) * 1997-12-18 2004-12-21 Micron Technology, Inc. Stacked semiconductor package having laser machined contacts
JP4381191B2 (ja) * 2004-03-19 2009-12-09 Ｏｋｉセミコンダクタ株式会社 半導体パッケージ及び半導体装置の製造方法
JP2006253631A (ja) * 2005-02-14 2006-09-21 Fujitsu Ltd 半導体装置及びその製造方法、キャパシタ構造体及びその製造方法
JP2007036571A (ja) * 2005-07-26 2007-02-08 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
US20080023824A1 (en) * 2006-07-28 2008-01-31 Texas Instruments Double-sided die
US7553752B2 (en) * 2007-06-20 2009-06-30 Stats Chippac, Ltd. Method of making a wafer level integration package

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10233621A (ja) * 1997-02-20 1998-09-02 Sharp Corp アンテナ一体化マイクロ波・ミリ波回路
JP2005176366A (ja) * 2003-12-09 2005-06-30 Internatl Business Mach Corp <Ibm> 基板内に放射素子として形成されたビアを使用してアンテナを構成する装置および方法
JP2007042978A (ja) * 2005-08-05 2007-02-15 Shinko Electric Ind Co Ltd 半導体装置
JP2007067215A (ja) * 2005-08-31 2007-03-15 Sanyo Electric Co Ltd 回路基板、回路基板の製造方法および回路装置
JP2007073849A (ja) * 2005-09-08 2007-03-22 Sharp Corp 電子回路モジュールとその製造方法

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013021628A (ja) * 2011-07-14 2013-01-31 Fujitsu Semiconductor Ltd 半導体装置及びその製造方法
US8994153B2 (en) 2011-07-14 2015-03-31 Fujitsu Semiconductor Limited Semiconductor device having antenna element and method of manufacturing same
WO2013080560A1 (ja) * 2011-12-02 2013-06-06 パナソニック株式会社 無線モジュール
JPWO2013080560A1 (ja) * 2011-12-02 2015-04-27 パナソニックＩｐマネジメント株式会社 無線モジュール
JPWO2013084479A1 (ja) * 2011-12-05 2015-04-27 パナソニックＩｐマネジメント株式会社 無線モジュール
US9245859B2 (en) 2011-12-05 2016-01-26 Panasonic Intellectual Property Management Co., Ltd. Wireless module
JPWO2013084496A1 (ja) * 2011-12-07 2015-04-27 パナソニックＩｐマネジメント株式会社 無線モジュール
US10403511B2 (en) 2013-01-14 2019-09-03 Intel Corporation Backside redistribution layer patch antenna
JP2016506675A (ja) * 2013-01-14 2016-03-03 インテル・コーポレーション 裏面再配線層パッチアンテナ
WO2014119302A1 (ja) * 2013-01-29 2014-08-07 パナソニック株式会社 無線モジュール及び無線モジュールの製造方法
JP2014146982A (ja) * 2013-01-29 2014-08-14 Panasonic Corp 無線モジュール及び無線モジュールの製造方法
US9437535B2 (en) 2013-01-29 2016-09-06 Panasonic Intellectual Property Management Co., Ltd. Wireless module and production method for wireless module
JP2014150154A (ja) * 2013-01-31 2014-08-21 Shinko Electric Ind Co Ltd 電子部品内蔵基板及びその製造方法
JPWO2016056387A1 (ja) * 2014-10-07 2017-07-20 株式会社村田製作所 高周波通信モジュール及び高周波通信装置
WO2018101767A1 (ko) * 2016-12-01 2018-06-07 주식회사 네패스 Ems 안테나 모듈 및 그 제조방법과 이를 포함하는 반도체 패키지
JP6474879B1 (ja) * 2017-11-29 2019-02-27 株式会社フジクラ 配線基板、及び、配線基板の製造方法
WO2019107183A1 (ja) * 2017-11-29 2019-06-06 株式会社フジクラ 配線基板、及び、配線基板の製造方法
JP2019102549A (ja) * 2017-11-29 2019-06-24 株式会社フジクラ 配線基板、及び、配線基板の製造方法

Also Published As

Publication number Publication date
TW200945546A (en) 2009-11-01
US20090267221A1 (en) 2009-10-29

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