TW200945546A - Semiconductor device - Google Patents

Semiconductor device Download PDF

Info

Publication number
TW200945546A
TW200945546A TW098113278A TW98113278A TW200945546A TW 200945546 A TW200945546 A TW 200945546A TW 098113278 A TW098113278 A TW 098113278A TW 98113278 A TW98113278 A TW 98113278A TW 200945546 A TW200945546 A TW 200945546A
Authority
TW
Taiwan
Prior art keywords
wiring board
surface side
substrate
semiconductor device
disposed
Prior art date
Application number
TW098113278A
Other languages
English (en)
Chinese (zh)
Inventor
Tomoharu Fujii
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW200945546A publication Critical patent/TW200945546A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/698—Semiconductor materials that are electrically insulating, e.g. undoped silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Transceivers (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Waveguide Aerials (AREA)
TW098113278A 2008-04-24 2009-04-22 Semiconductor device TW200945546A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008113333A JP2009266979A (ja) 2008-04-24 2008-04-24 半導体装置

Publications (1)

Publication Number Publication Date
TW200945546A true TW200945546A (en) 2009-11-01

Family

ID=41214190

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098113278A TW200945546A (en) 2008-04-24 2009-04-22 Semiconductor device

Country Status (3)

Country Link
US (1) US20090267221A1 (https=)
JP (1) JP2009266979A (https=)
TW (1) TW200945546A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI684260B (zh) * 2017-05-11 2020-02-01 矽品精密工業股份有限公司 電子封裝件及其製法

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TWI370530B (en) * 2008-05-21 2012-08-11 Advanced Semiconductor Eng Semiconductor package having an antenna
JP5729186B2 (ja) 2011-07-14 2015-06-03 富士通セミコンダクター株式会社 半導体装置及びその製造方法
CN103703610B (zh) * 2011-12-02 2016-07-27 松下知识产权经营株式会社 无线模块
CN103650132B (zh) * 2011-12-05 2017-09-22 松下知识产权经营株式会社 无线模块
TWI593334B (zh) * 2011-12-07 2017-07-21 松下知識產權經營股份有限公司 Wireless module
US10403511B2 (en) 2013-01-14 2019-09-03 Intel Corporation Backside redistribution layer patch antenna
TWI553732B (zh) * 2013-01-25 2016-10-11 矽品精密工業股份有限公司 電子封裝件
JP5942273B2 (ja) * 2013-01-29 2016-06-29 パナソニックＩｐマネジメント株式会社 無線モジュール及び無線モジュールの製造方法
JP6230794B2 (ja) * 2013-01-31 2017-11-15 新光電気工業株式会社 電子部品内蔵基板及びその製造方法
JP6027905B2 (ja) * 2013-01-31 2016-11-16 新光電気工業株式会社 半導体装置
WO2014196143A1 (ja) * 2013-06-04 2014-12-11 パナソニックＩｐマネジメント株式会社 無線モジュール
WO2016056387A1 (ja) * 2014-10-07 2016-04-14 株式会社村田製作所 高周波通信モジュール及び高周波通信装置
US10784206B2 (en) 2015-09-21 2020-09-22 Mediatek Inc. Semiconductor package
US10130302B2 (en) * 2016-06-29 2018-11-20 International Business Machines Corporation Via and trench filling using injection molded soldering
KR101870421B1 (ko) * 2016-12-01 2018-06-26 주식회사 네패스 Ems 안테나 모듈 및 그 제조방법과 이를 포함하는 반도체 패키지
TWI663701B (zh) * 2017-04-28 2019-06-21 Siliconware Precision Industries Co., Ltd. 電子封裝件及其製法
EP3486943A1 (en) * 2017-11-17 2019-05-22 MediaTek Inc Semiconductor package
JP6474879B1 (ja) * 2017-11-29 2019-02-27 株式会社フジクラ 配線基板、及び、配線基板の製造方法
TWI668831B (zh) * 2018-04-17 2019-08-11 Siliconware Precision Industries Co., Ltd. 電子裝置與電子封裝件

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JP3472678B2 (ja) * 1997-02-20 2003-12-02 シャープ株式会社 アンテナ一体化マイクロ波・ミリ波回路
US6303878B1 (en) * 1997-07-24 2001-10-16 Denso Corporation Mounting structure of electronic component on substrate board
US6833613B1 (en) * 1997-12-18 2004-12-21 Micron Technology, Inc. Stacked semiconductor package having laser machined contacts
US7444734B2 (en) * 2003-12-09 2008-11-04 International Business Machines Corporation Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate
JP4381191B2 (ja) * 2004-03-19 2009-12-09 Ｏｋｉセミコンダクタ株式会社 半導体パッケージ及び半導体装置の製造方法
JP2006253631A (ja) * 2005-02-14 2006-09-21 Fujitsu Ltd 半導体装置及びその製造方法、キャパシタ構造体及びその製造方法
JP2007036571A (ja) * 2005-07-26 2007-02-08 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
JP4749795B2 (ja) * 2005-08-05 2011-08-17 新光電気工業株式会社 半導体装置
JP4979213B2 (ja) * 2005-08-31 2012-07-18 オンセミコンダクター・トレーディング・リミテッド 回路基板、回路基板の製造方法および回路装置
JP2007073849A (ja) * 2005-09-08 2007-03-22 Sharp Corp 電子回路モジュールとその製造方法
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US7553752B2 (en) * 2007-06-20 2009-06-30 Stats Chippac, Ltd. Method of making a wafer level integration package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI684260B (zh) * 2017-05-11 2020-02-01 矽品精密工業股份有限公司 電子封裝件及其製法

Also Published As

Publication number Publication date
JP2009266979A (ja) 2009-11-12
US20090267221A1 (en) 2009-10-29

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