JP2010123708A - 実装基板及び半導体モジュール - Google Patents
実装基板及び半導体モジュール Download PDFInfo
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Abstract
【解決手段】本発明の実装基板1は、コア基板2の上面側に積層状態で形成された複数の配線層を含む積層配線部3を有するもので、複数の配線層のうち、最下層の配線層5の一部5aを、冷却構造体を実装する目的で、外部に露出する状態で配置している。
【選択図】図1
Description
[実装基板の構成]
図1は本発明の実施の形態に係る実装基板の構成例を示す断面図である。実装基板1は、大きくは、コア基板2と積層配線部3とを備えた構成となっている。コア基板2は、例えば、平板状の基材4の両面に配線層5,6を形成し、かつ当該配線層5,6を貫通導通路7で電気的に接続した構造となっている。基材4は、例えば、ガラスエポキシ等のリジッドな基材を用いて構成されている。配線層5,6は、例えば、銅等の配線材料を用いて構成されている。貫通導通路7は、基材4を貫通する貫通孔の側壁に導電膜を形成し、かつ当該貫通孔を樹脂で埋め込んだ構造になっている。
図3は本発明の実施の形態に係る実装基板の製造方法を示す概略図である。まず、図3(A)に示すように、基材4と配線層5,6を有するコア基板2を用意する。この段階のコア基板2は、最終的な製品サイズに応じて切り出される個片のコア基板を平面的に複数並べて一体化した大判の基板構造になっている。ここでは便宜上、個片に切り出される3つのコア基板を一体化した形態で、一つのコア基板2を表現している。
図4は本発明の実施の形態に係る半導体モジュールの構成例を示す断面図である。半導体モジュール20は、上記の実装基板1と、当該実装基板1に実装された半導体装置とを備えた構成となっている。半導体装置としては、半導体チップ21と半導体パッケージ22が実装されている。半導体チップ21及び半導体パッケージ22は、実装基板1の一方の面上に形成された複数の配線層の上に、チップ部品23とともに実装されている。
まず、図5に示すように、前述した製造方法で得られる実装基板1に半導体チップ21、半導体パッケージ22及びチップ部品23を実装する。次に、上記図4に示すように、外部に露出している内層の配線層5の一部5aに、接着層25を介して冷却フィン24を取り付ける。これにより、半導体モジュール20が得られる。この半導体モジュール20は、例えば図6に示すように、コア基板2の下面側に外部接続端子として形成されたバンプ(例えば、はんだバンプ)26を介してマザー基板27に実装される。
図7は本発明の実施の形態に係る実装基板及び半導体モジュールの第1の変形例を示す断面図である。図示した半導体モジュール20においては、最下層の配線層5の一部5aを外部に露出させ、当該露出部分を用いて冷却構造体28が実装基板1に実装されている。冷却構造体28は門型に形成されている。また、実装基板1上には3つの半導体パッケージ22が実装されている。各々の半導体パッケージ22のパッケージ面は、それぞれ熱伝導性の樹脂からなる樹脂層29を介して冷却構造体28に接着されている。
図8は本発明の実施の形態に係る実装基板及び半導体モジュールの第2の変形例を示す断面図である。図示した半導体モジュール20においては、最下層の配線層5の一部5aを外部に露出させ、当該露出部分を用いて冷却フィン24が実装基板1に実装されている。また、最上層の一つの下の配線層15の一部15aが外部に露出した状態で配置され、当該露出部分を用いて門型の冷却構造体16が実装基板1に実装されている。この冷却構造体16は、2つの半導体パッケージ22の間に実装された半導体パッケージ17を取り囲む状態で配置されている。また、半導体パッケージ17のパッケージ面は、熱伝導性の樹脂からなる樹脂層18を介して冷却構造体16に接着されている。このため、冷却構造体16は半導体パッケージ17と熱的に接続された状態になっている。
Claims (5)
- 一方の基板面上に積層状態で形成された複数の配線層を含む積層配線部を有し、
前記複数の配線層のうち、最上層の配線層を除く内層の配線層の一部を外部に露出する状態で配置してなる
実装基板。 - 前記積層配線部を島状に独立して形成してなる
請求項1記載の実装基板。 - 前記内層の配線層は、グラウンド用の配線層である
請求項1又は2記載の実装基板。 - 前記複数の配線層の層間に介在する絶縁層の端縁部を階段状に形成してなる
請求項1、2又は3記載の実装基板。 - 少なくとも一方の基板面上に積層状態で形成された複数の配線層を含む積層配線部を有し、前記複数の配線層のうち、最上層の配線層を除く内層の配線層の一部を外部に露出する状態で配置してなる実装基板と、
前記複数の配線層に電気的に接続する状態で前記実装基板に実装された半導体装置と、
前記内層の配線層の一部に熱的に接続する状態で前記実装基板に実装された冷却構造体と
を備える半導体モジュール。
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JP2008295195A JP4730426B2 (ja) | 2008-11-19 | 2008-11-19 | 実装基板及び半導体モジュール |
TW098136231A TWI402954B (zh) | 2008-11-19 | 2009-10-26 | Assembly board and semiconductor module |
KR1020090107967A KR101730650B1 (ko) | 2008-11-19 | 2009-11-10 | 실장 기판 및 반도체 모듈 |
US12/620,216 US8263871B2 (en) | 2008-11-19 | 2009-11-17 | Mount board and semiconductor module |
CN200910222812XA CN101742813B (zh) | 2008-11-19 | 2009-11-19 | 安装板和半导体模块 |
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JP (1) | JP4730426B2 (ja) |
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JP2015165533A (ja) * | 2014-03-03 | 2015-09-17 | 新光電気工業株式会社 | 配線基板及びその製造方法と半導体装置 |
JP6251420B1 (ja) * | 2016-05-30 | 2017-12-20 | 三菱電機株式会社 | 電子モジュールおよび電子モジュールの製造方法 |
WO2020149374A1 (ja) * | 2019-01-16 | 2020-07-23 | 凸版印刷株式会社 | パッケージ用基板、およびその製造方法 |
JP2021108320A (ja) * | 2019-12-27 | 2021-07-29 | 京セラ株式会社 | 印刷配線板及び印刷配線板の製造方法 |
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KR102173615B1 (ko) * | 2018-07-19 | 2020-11-03 | 스템코 주식회사 | 다층 회로 기판 및 그 제조 방법 |
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Also Published As
Publication number | Publication date |
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CN101742813A (zh) | 2010-06-16 |
TW201027697A (en) | 2010-07-16 |
KR101730650B1 (ko) | 2017-04-26 |
TWI402954B (zh) | 2013-07-21 |
JP4730426B2 (ja) | 2011-07-20 |
KR20100056376A (ko) | 2010-05-27 |
CN101742813B (zh) | 2013-02-13 |
US8263871B2 (en) | 2012-09-11 |
US20100122838A1 (en) | 2010-05-20 |
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