JP2007042978A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2007042978A JP2007042978A JP2005227639A JP2005227639A JP2007042978A JP 2007042978 A JP2007042978 A JP 2007042978A JP 2005227639 A JP2005227639 A JP 2005227639A JP 2005227639 A JP2005227639 A JP 2005227639A JP 2007042978 A JP2007042978 A JP 2007042978A
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Abstract
【解決手段】給電層24とグラウンド用導電層27とを有する配線基板11を備え、配線基板11上に接続された半導体チップ12及びチップ部品13を覆う封止樹脂17上に逆F型アンテナ20を設けると共に、逆F型アンテナ20と給電層24及びグラウンド用導電層27とを電気的に接続した。
【選択図】図3
Description
図3は、本発明の第1の実施の形態に係る半導体装置の断面図である。
図22は、本発明の第2の実施の形態に係る半導体装置の断面図である。
11 配線基板
12 半導体チップ
13 チップ部品
14,15 端子
17 封止樹脂
17A,17B,52A〜52C,53A〜53C,59A,77A,77B 開口部
17C,23A 上面
20 逆F型アンテナ
21 保護膜
23 コア基板
23B,28A 下面
24 電源用導電層
25 上部樹脂層
27,75 グラウンド用導電層
28 下部樹脂層
29〜31 貫通ビア
32〜34 上部配線
32A,32B,33A,33B,34A,34B,36A,37A,38A 接続部
35,39 保護膜
36〜38 下部配線
41 外部接続端子
43 ワイヤ
44,45 ビア部
46 アンテナ部
48A〜48C 貫通孔
50,58 シード層
52,53,57,59 レジスト層
55,61 導電金属膜
71,72 ビア
74 パッド
77 絶縁層
B 半導体装置形成領域
C 切断位置
E 領域
Claims (3)
- 配線基板と、該配線基板の第1の主面に設けられ、前記配線基板と電気的に接続された電子部品と、受動回路と、前記電子部品を封止する封止樹脂とを備えた半導体装置であって、
前記受動回路を前記封止樹脂上に設けると共に、グラウンド用導電層を前記配線基板の内部または前記配線基板の第1の主面とは反対側の第2の主面に設けたことを特徴とする半導体装置。 - 配線基板と、該配線基板の第1の主面に設けられ、前記配線基板と電気的に接続された電子部品と、受動回路と、前記電子部品を封止する封止樹脂とを備えた半導体装置であって、
前記封止樹脂上にグラウンド用導電層と、該グラウンド用導電層上に絶縁層と、該絶縁層上に前記受動回路とを設けたことを特徴とする半導体装置。 - 前記配線基板は、該配線基板の内部に電源用導電層をさらに備え、
前記受動回路は、前記グラウンド用導電層及び前記電源用導電層と電気的に接続された逆F型アンテナであることを特徴とする請求項1または2記載の半導体装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2005227639A JP4749795B2 (ja) | 2005-08-05 | 2005-08-05 | 半導体装置 |
US11/462,188 US20070029667A1 (en) | 2005-08-05 | 2006-08-03 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005227639A JP4749795B2 (ja) | 2005-08-05 | 2005-08-05 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
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JP2007042978A true JP2007042978A (ja) | 2007-02-15 |
JP4749795B2 JP4749795B2 (ja) | 2011-08-17 |
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JP2005227639A Active JP4749795B2 (ja) | 2005-08-05 | 2005-08-05 | 半導体装置 |
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US (1) | US20070029667A1 (ja) |
JP (1) | JP4749795B2 (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008263263A (ja) * | 2007-04-10 | 2008-10-30 | Shinko Electric Ind Co Ltd | アンテナ素子及び半導体装置 |
JP2009266979A (ja) * | 2008-04-24 | 2009-11-12 | Shinko Electric Ind Co Ltd | 半導体装置 |
JP2013141211A (ja) * | 2011-12-28 | 2013-07-18 | Freescale Semiconductor Inc | 伸張可能アームアンテナ、ならびにそれらアンテナが一体化されるモジュールおよびシステム |
JPWO2013084479A1 (ja) * | 2011-12-05 | 2015-04-27 | パナソニックIpマネジメント株式会社 | 無線モジュール |
WO2017013938A1 (ja) * | 2015-07-22 | 2017-01-26 | アルプス電気株式会社 | 高周波モジュール |
KR20170021414A (ko) * | 2015-08-17 | 2017-02-28 | 한국전자통신연구원 | 송수신 패키지 |
US20190319347A1 (en) * | 2018-04-17 | 2019-10-17 | Siliconware Precision Industries Co., Ltd. | Electronic package and electronic device having the electronic package |
JP2021007250A (ja) * | 2018-01-10 | 2021-01-21 | 株式会社東芝 | 無線通信モジュール、プリント基板、および製造方法 |
JP2021027308A (ja) * | 2019-07-31 | 2021-02-22 | 日月光半導体製造股▲ふん▼有限公司 | 半導体デバイスパッケージおよびそれを有する音響デバイス |
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US8278749B2 (en) | 2009-01-30 | 2012-10-02 | Infineon Technologies Ag | Integrated antennas in wafer level package |
US8451618B2 (en) | 2010-10-28 | 2013-05-28 | Infineon Technologies Ag | Integrated antennas in wafer level package |
US9837701B2 (en) * | 2013-03-04 | 2017-12-05 | Advanced Semiconductor Engineering, Inc. | Semiconductor package including antenna substrate and manufacturing method thereof |
US20170040266A1 (en) | 2015-05-05 | 2017-02-09 | Mediatek Inc. | Fan-out package structure including antenna |
CN107393880A (zh) * | 2016-04-12 | 2017-11-24 | 联发科技股份有限公司 | 半导体封装结构 |
CN106847763A (zh) * | 2017-02-07 | 2017-06-13 | 苏州日月新半导体有限公司 | 半导体封装件及其制造方法 |
WO2019098011A1 (ja) * | 2017-11-16 | 2019-05-23 | 株式会社村田製作所 | 樹脂多層基板、電子部品およびその実装構造 |
KR102209123B1 (ko) | 2017-12-19 | 2021-01-28 | 삼성전자 주식회사 | 안테나와 rf 소자를 포함하는 모듈 및 이를 포함하는 기지국 |
US11024954B2 (en) | 2018-05-14 | 2021-06-01 | Mediatek Inc. | Semiconductor package with antenna and fabrication method thereof |
US20190348747A1 (en) | 2018-05-14 | 2019-11-14 | Mediatek Inc. | Innovative air gap for antenna fan out package |
US11043730B2 (en) | 2018-05-14 | 2021-06-22 | Mediatek Inc. | Fan-out package structure with integrated antenna |
US11503704B2 (en) * | 2019-12-30 | 2022-11-15 | General Electric Company | Systems and methods for hybrid glass and organic packaging for radio frequency electronics |
US11677152B2 (en) * | 2021-03-03 | 2023-06-13 | Texas Instruments Incorporated | Packaged electronic device with integral antenna |
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JP2008263263A (ja) * | 2007-04-10 | 2008-10-30 | Shinko Electric Ind Co Ltd | アンテナ素子及び半導体装置 |
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JPWO2017013938A1 (ja) * | 2015-07-22 | 2018-03-15 | アルプス電気株式会社 | 高周波モジュール |
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KR20170021414A (ko) * | 2015-08-17 | 2017-02-28 | 한국전자통신연구원 | 송수신 패키지 |
KR102037763B1 (ko) * | 2015-08-17 | 2019-10-30 | 한국전자통신연구원 | 송수신 패키지 |
JP2021007250A (ja) * | 2018-01-10 | 2021-01-21 | 株式会社東芝 | 無線通信モジュール、プリント基板、および製造方法 |
US20190319347A1 (en) * | 2018-04-17 | 2019-10-17 | Siliconware Precision Industries Co., Ltd. | Electronic package and electronic device having the electronic package |
US11223117B2 (en) * | 2018-04-17 | 2022-01-11 | Siliconware Precision Industries Co., Ltd. | Electronic package and electronic device having the electronic package |
JP2021027308A (ja) * | 2019-07-31 | 2021-02-22 | 日月光半導体製造股▲ふん▼有限公司 | 半導体デバイスパッケージおよびそれを有する音響デバイス |
JP7473322B2 (ja) | 2019-07-31 | 2024-04-23 | 日月光半導体製造股▲ふん▼有限公司 | 半導体デバイスパッケージおよびそれを有する音響デバイス |
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