JP2008263263A - アンテナ素子及び半導体装置 - Google Patents
アンテナ素子及び半導体装置 Download PDFInfo
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Abstract
小型化を図ることのできるアンテナ素子及び半導体装置を提供することを課題とする。
【解決手段】電磁波の送受信を行う電磁波送受信部62と、グラウンド層59と、電磁波送受信部62とグラウンド層59とを電気的に接続する接続部57とを有した逆F型アンテナ33を備えたアンテナ素子15であって、逆F型アンテナ33が形成されるシリコン基板31と、シリコン基板31と逆F型アンテナ33とを電気的に絶縁する絶縁膜32とを設け、シリコン基板31の上面31Aに、絶縁膜32を介して、電磁波送受信部62を配置すると共に、シリコン基板31の下面31Bに、絶縁膜32を介して、グラウンド層59を配置し、シリコン基板31を貫通するように接続部57を配置した。
【選択図】図4
Description
図3は、本発明の第1の実施の形態に係る半導体装置の断面図である。
図7は、本発明の第2の実施の形態に係る半導体装置の断面図である。図7において、第1の実施の形態の半導体装置10と同一構成部分には同一符号を付す。
図11は、本発明の第3の実施の形態に係る半導体装置の断面図である。図11において、第1の実施の形態の半導体装置10と同一構成部分には同一符号を付す。
図15は、本発明の第4の実施の形態に係る半導体装置の断面図である。図15において、第1の実施の形態の半導体装置10と同一構成部分には同一符号を付す。
11,91,121 配線基板
12 CPU用半導体チップ
13 RFデバイス
15,75,95,125 アンテナ素子
17 基板本体
21〜27,93,94,131〜135 配線
31,76,96,138 シリコン基板
17A,31A,76A,96A,138A 上面
31B,76B,96B,138B 下面
32 絶縁膜
33 逆F型アンテナ
35,41 Ni層
36,42 Au層
37,43,99,143 ソルダーレジスト
43A〜43E,97A〜97C,143A〜143F 開口部
45〜49,102〜104 外部接続端子
52,53,106,152,153 貫通孔
56,57,107,157,158 接続部
58,109,161,162 信号入力用パッド
59,77,111,163 グラウンド層
62,112,165,166 電磁波送受信部
77 逆L型アンテナ
81,115,169 溝部
97 パッチアンテナ
141 ダイポールアンテナ
M1〜M3 厚さ
W1〜W14 幅
Claims (4)
- 電磁波の送受信を行う電磁波送受信部と、信号入力用パッドと、グラウンド層と、前記電磁波送受信部と前記グラウンド層及び前記信号入力用パッドとを電気的に接続する接続部とを有したアンテナを備えたアンテナ素子であって、
前記アンテナが形成されるシリコン基板と、前記シリコン基板と前記アンテナとを電気的に絶縁する絶縁膜とを設け、
前記シリコン基板の第1の面に、前記絶縁膜を介して、前記電磁波送受信部を配置すると共に、前記第1の面とは反対側に位置する前記シリコン基板の第2の面に、前記絶縁膜を介して、前記グラウンド層及び前記信号入力用パッドを配置し、
前記シリコン基板を貫通するように前記接続部を配置したことを特徴とするアンテナ素子。 - 電磁波の送受信を行う電磁波送受信部と、信号入力用パッドと、グラウンド層と、前記電磁波送受信部と前記信号入力用パッドとを電気的に接続する接続部とを有したアンテナを備えたアンテナ素子であって、
前記アンテナが形成されるシリコン基板と、前記シリコン基板と前記アンテナとを電気的に絶縁する絶縁膜とを設け、
前記シリコン基板の第1の面に、前記絶縁膜を介して、前記電磁波送受信部を配置すると共に、前記第1の面とは反対側に位置する前記シリコン基板の第2の面に、前記絶縁膜を介して、前記グラウンド層及び前記信号入力用パッドを配置し、
前記シリコン基板を貫通するように前記接続部を配置したことを特徴とするアンテナ素子。 - 前記アンテナは、めっき膜により構成することを特徴とする請求項1又は2記載のアンテナ素子。
- 請求項1ないし3のうち、いずれか一項記載のアンテナ素子と、
前記アンテナ素子と電気的に接続される電子部品と、
前記アンテナ素子及び前記電子部品が実装される配線基板と、を備えたことを特徴とする半導体装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007102501A JP5054413B2 (ja) | 2007-04-10 | 2007-04-10 | アンテナ素子及び半導体装置 |
KR1020080032754A KR20080092278A (ko) | 2007-04-10 | 2008-04-08 | 안테나 소자 및 반도체 장치 |
US12/099,983 US8018392B2 (en) | 2007-04-10 | 2008-04-09 | Antenna element and semiconductor device |
TW097112859A TW200847386A (en) | 2007-04-10 | 2008-04-09 | Antenna element and semiconductor device |
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JP2007102501A JP5054413B2 (ja) | 2007-04-10 | 2007-04-10 | アンテナ素子及び半導体装置 |
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JP2008263263A true JP2008263263A (ja) | 2008-10-30 |
JP2008263263A5 JP2008263263A5 (ja) | 2010-04-08 |
JP5054413B2 JP5054413B2 (ja) | 2012-10-24 |
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US (1) | US8018392B2 (ja) |
JP (1) | JP5054413B2 (ja) |
KR (1) | KR20080092278A (ja) |
TW (1) | TW200847386A (ja) |
Cited By (1)
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CN104022345A (zh) * | 2013-03-01 | 2014-09-03 | 索尼公司 | 芯片级封装件 |
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US10373508B2 (en) * | 2012-06-27 | 2019-08-06 | Intel Corporation | Devices, systems, and methods for enriching communications |
US20150325534A1 (en) * | 2014-05-09 | 2015-11-12 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor package for radio communication and method of manufacturing the same |
WO2016130090A1 (en) * | 2015-02-13 | 2016-08-18 | Nanyang Technological University | Semiconductor arrangement and method for fabricating thereof |
USD913256S1 (en) * | 2019-07-31 | 2021-03-16 | Eryn Smith | Antenna pattern for a semiconductive substrate carrier |
USD926716S1 (en) * | 2019-07-31 | 2021-08-03 | Eryn Smith | Antenna pattern for a semiconductive substrate carrier |
KR20220066536A (ko) | 2020-11-16 | 2022-05-24 | 삼성전기주식회사 | 안테나 장치 |
Citations (7)
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Also Published As
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TW200847386A (en) | 2008-12-01 |
US8018392B2 (en) | 2011-09-13 |
US20090009402A1 (en) | 2009-01-08 |
KR20080092278A (ko) | 2008-10-15 |
JP5054413B2 (ja) | 2012-10-24 |
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