WO2001095679A1 - Module for radio communication - Google Patents

Module for radio communication

Info

Publication number
WO2001095679A1
WO2001095679A1 PCT/SE2001/000949 SE0100949W WO2001095679A1 WO 2001095679 A1 WO2001095679 A1 WO 2001095679A1 SE 0100949 W SE0100949 W SE 0100949W WO 2001095679 A1 WO2001095679 A1 WO 2001095679A1
Authority
WO
Grant status
Application
Patent type
Prior art keywords
module
card
antenna
side
metal
Prior art date
Application number
PCT/SE2001/000949
Other languages
French (fr)
Inventor
Shaofang Gong
Johan Nilsson
Original Assignee
Bluetronics Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2291Supports; Mounting means by structural association with other equipment or articles used in bluetooth or WI-FI devices of Wireless Local Area Networks [WLAN]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64Impedance arrangements
    • H01L2223/66High-frequency adaptations
    • H01L2223/6661High-frequency adaptations for passive devices
    • H01L2223/6677High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/153Connection portion
    • H01L2924/1532Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/15321Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA

Abstract

A module for radio communication in accordance with the Blue Tooth concept and/or in accordance with the wireless-LAN concept, wherein the module comprises a transmitter-and-receiver circuit and an antenna. The invention is characterised in that the module comprises a carrier in the form of a laminated PCB-card (1) (Printed Circuit Board) that includes a number of electrically conductive metal layers (M1-M5) and so-called microvias; in that a first side (11) of the card (1) has an integrated antenna (10) formed in the metal layer (M5) on said side and connected to the remainder of the module; in that a radio frequency chip (13) is surface-mounted on the PCB-card (1) on other side (12) of said card; in that passive components (14, 15), such as filters, Baluns, inductors and capacitors, are integrated in the PCB-card (1) and connected to different microvias; and in that terminals in the form of BGA balls (16, 17) (Ball Grid Array) are provided on said second side (12) of the card.

Description

MODULE FOR RADIO COMMUNICATION

The present invention relates to a radio communications module and more specifically to a module for communication in accordance with the Blue Tooth concept and the Wireless LAN (WLAN) concept.

The main purpose of the Blue Tooth concept is to replace cables with radio signals when the range required is relatively short. The main purpose of WLAN is to obtain wireless access to the Internet.

Both techniques use the ISM (Industrial, Scientific and Medical) frequency band. Blue Tooth will operate at 2.4 GHz, whereas WLAN will operate at both 2.4 and 5.7 GHz.

In coming years, hundreds of millions of modules for these techniques will be required when the techniques are introduced onto the market.

Consequently, it is a desire that modules for these techniques will be small and can be produced in large numbers at low cost.

The present invention satisfies the^e desiderata.

Accordingly, the present invention relates to a module for radio communication in accordance with the Blue Tooth concept and/or in accordance with the wireless LAN concept, said module comprising a transmitter and receiver circuit and an antenna, wherein the module is characterised in that it comprises a carrier in the form of a laminated PCB - card (Printed Circuit Board) that includes a plurality of electrically conductive metal layers and so called microvias; in that a first side of the board carries an integrated antenna formed in the metal layer on said side and connected to the remainder of the module; in that the other side, of the card carries a surface-mounted radio frequency chip; in that passive components, such as filters, Baluns, inductors and capacitors, are integrated in the PCB-card and connected to different microvias; and in that terminals in the form of BGA balls (Ball Grid Array) are disposed on said other side of the card. The invention will now be described in more detail partly with reference to an exemplifying embodiment of the invention illustrated in the accompanying drawing, in which

- Figure 1 is a side view of an inventive module;

- Figure 2 is a sectioned view through a PCB-card that includes so called microvias and a through-penetrating via;

- Figure 3 shows an integrated capacitor from above; and

- Figure 4 shows an integrated coil from above.

According to known technology, passive radio frequency components are mounted on a typical PCB-card (Printed Circuit Board) as discrete components together with semiconductor chips. More advanced technology uses thin films and ceramic multilayers to integrate certain passive components, such as filters and inductances. However, such technologies result in higher production costs than conventional PCB technology.

The present invention relates to a module that is fully integrated for Blue Tooth or WLAN.

Accordingly, the invention relates to a module for radio communication in accordance with the Blue Tooth concept and/or in accordance with the wireless LAN concept, comprising a transmitter and receiver circuit and an antenna.

In accordance with the invention, the module includes a carrier in the form of a laminated PCB-card (Printed Circuit Board) 1 that has a number of electrically conductive layers interconnected with so-called microvias. Figure 2 illustrates microvias 2, 3, 4. The reference signs Ml, M2, M3, M4 and M5 identify metal layers that are separated by dielectric material 6, 7, 8 and 9. The dielectric layer 6 suitably has a thickness of 0.8 to 1.5 mm, whereas the layers 7, 8 and 9 have a thickness of 0.05 mm.

The microvias function to connect the various metal layers together and also to connect components to the board 1. M5 in Figure 2 is used to pattern and form the antenna 10. The layers M1-M4 are used as transmission conductors and integrated passive components, such as filters, Baluns, inductances and capacitances.

According to the invention, the antenna 10 is provided on a first side 11 of the card 1 and is connected to the layer Ml through a through-penetrating via 18. The thickness of the antenna in Figure 1 has been exaggerated. The antenna is conveniently a so-called patch antenna of a quarter wavelength. However, other types of antenna may be used, such as a so-called microstrip antenna or a loop antenna.

A radio frequency chip 13 is surface-mounted on the other side 12 of the card. Passive components 14, 15, such as filters, Baluns, inductors and capacitors are integrated in the Printed Circuit Board.

According to the invention, said other side 12 of the card carries terminals in the form of BGA balls 16, 17 (Ball Grid Array).

There is therewith formed a fully integrated commiulicatipns module, which is connected to a circuit card through the medium of the BGA balls,

It will be understood that the number of metal layers may be greater or smaller than the number described above.

According to one preferred embodiment, one or more passive components of the aforesaid kind are integrated in the card 1 and formed by means of said metal layers M1-M4. Figure 2 shows in the central part 18 of the figure a capacitor formed by means of the metal layers. Figure 3 shows the capacitor from above as formed in the metal layers M1-M4.

The arrows in Figure 1 show the capacitor 14 and the coil 15 situated within the PCB-card.

Figure 4 shows from above a coil formed in the metal layer Ml or M2 in the right-hand part 19 of Figure 2. The present invention provides a number of significant advantages over known technology. One significant advantage is that the module can be made very small. With a quarter- wavelength antenna, the external measurements of the module may be 16x18x2.5 millimetres. There is also obtained a high radio quality owing to the absence of parasitic capacitances and inductances in electrical connections. Another advantage resides in the high sensitivity of the module, owing to the fact that requisite filters and Baluns are integrated in the structure. The cost of manufacture is also low.

Although the invention has been described above with reference to a number of exemplifying embodiments, it will be understood that the structural details of the module can be modified in accordance with the construction desired and desired performance.

Consequently, the present invention shall not be considered to be limited to the aforedescribed exemplifying embodiments thereof, since variations can be made within the scope of the accompanying Claims.

Claims

1. A module for radio communication in accordance with the Blue Tooth concept and/or in accordance with the wireless-LAN concept, wherein the module comprises a transmitter-and-receiver circuit and an antenna, characterised in that the module comprises a carrier in the form of a laminated PCB-card (1) (Printed Circuit Board) that includes a number of electrically conductive metal layers (M1-M5) and so-called microvias; in that a first side (11) of the card (1) has an integrated antenna (10) formed in the metal layer (M5) on said side and connected to the remainder of the module; in that a radio frequency chip (13) is surface-mounted on the PCB-card (1) on the other side (12) of said card, and in that passive components (14, 15), such as filters, Baluns, inductors and capacitors, are integrated in the PCB-card (1) and connected to different microvias; and in that terminals in the form of BGA balls (16, 17) (Ball Grid Array) are provided on said second side (12) of the card.
2. A module according to Claim 1, characterised in that passive components of the aforesaid kind are integrated in the card (1) and formed by means of said metal layers (Ml-
M4).
3. A module according to Claim 1 or Claim 2, characterised in that said antenna (10) is connected to the metal layer (Ml) located on said second side (12), by means of a through-passing via (18).
PCT/SE2001/000949 2000-06-07 2001-05-03 Module for radio communication WO2001095679A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SE0001943 2000-06-07
SE0001943-0 2000-06-07

Publications (1)

Publication Number Publication Date
WO2001095679A1 true true WO2001095679A1 (en) 2001-12-13

Family

ID=20279824

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SE2001/000949 WO2001095679A1 (en) 2000-06-07 2001-05-03 Module for radio communication

Country Status (1)

Country Link
WO (1) WO2001095679A1 (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005084090A1 (en) * 2004-02-23 2005-09-09 Georgia Tech Research Corporation Liquid crystalline polymer- and multilayer polymer-based passive signal processing components for rf/wireless multi-band applications
US6987307B2 (en) 2002-06-26 2006-01-17 Georgia Tech Research Corporation Stand-alone organic-based passive devices
US7068124B2 (en) 2003-03-28 2006-06-27 Georgia Tech Research Corporation Integrated passive devices fabricated utilizing multi-layer, organic laminates
WO2007061691A2 (en) * 2005-11-17 2007-05-31 Cts Corporation Ball grid array filter
DE102006007381A1 (en) * 2006-02-15 2007-08-23 Infineon Technologies Ag Ultra-wide-band semiconductor component for ultra-wide-band standard in communication, comprises semiconductor component, ultra-wide-band semiconductor chip and multilevel circuit substrate with lower and upper metal layer
US7260890B2 (en) 2002-06-26 2007-08-28 Georgia Tech Research Corporation Methods for fabricating three-dimensional all organic interconnect structures
DE102006057332A1 (en) * 2006-12-05 2008-06-19 Infineon Technologies Ag Assembly comprising a substrate and a substrate mounted on the chip and a method of manufacturing the same
FR2919433A1 (en) * 2007-07-27 2009-01-30 Thales Sa Transmitting or receiving antenna module, has unitary radiating elements coupled to filters via calibration couplers and to electric outputs via connection network, where filters, couplers and outputs are developed at single layer
US7489914B2 (en) 2003-03-28 2009-02-10 Georgia Tech Research Corporation Multi-band RF transceiver with passive reuse in organic substrates
US7646255B2 (en) 2006-11-17 2010-01-12 Cts Corporation Voltage controlled oscillator module with ball grid array resonator
WO2010058337A1 (en) * 2008-11-19 2010-05-27 Nxp B.V. Millimetre-wave radio antenna module
US7808434B2 (en) 2006-08-09 2010-10-05 Avx Corporation Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices
US7940148B2 (en) 2006-11-02 2011-05-10 Cts Corporation Ball grid array resonator
US7989895B2 (en) 2006-11-15 2011-08-02 Avx Corporation Integration using package stacking with multi-layer organic substrates
CN102074534B (en) 2009-11-24 2013-05-29 上海长丰智能卡有限公司 Micro PCB radio frequency module and packaging method thereof

Citations (5)

* Cited by examiner, † Cited by third party
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GB2321787A (en) * 1997-01-31 1998-08-05 Nokia Mobile Phones Ltd Multiple layer printed circuit board inductive arrangement
DE19813767A1 (en) * 1997-03-28 1998-10-08 Toshiba Kawasaki Kk Microwave transceiver module
EP0962968A2 (en) * 1998-06-05 1999-12-08 Murata Manufacturing Co., Ltd. Method of producing a multi-layer ceramic substrate
US6021050A (en) * 1998-12-02 2000-02-01 Bourns, Inc. Printed circuit boards with integrated passive components and method for making same
US6060954A (en) * 1997-11-28 2000-05-09 Delta Electronic, Inc. Oscillator device having inductor formed inside multi-layer circuit board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2321787A (en) * 1997-01-31 1998-08-05 Nokia Mobile Phones Ltd Multiple layer printed circuit board inductive arrangement
DE19813767A1 (en) * 1997-03-28 1998-10-08 Toshiba Kawasaki Kk Microwave transceiver module
US6060954A (en) * 1997-11-28 2000-05-09 Delta Electronic, Inc. Oscillator device having inductor formed inside multi-layer circuit board
EP0962968A2 (en) * 1998-06-05 1999-12-08 Murata Manufacturing Co., Ltd. Method of producing a multi-layer ceramic substrate
US6021050A (en) * 1998-12-02 2000-02-01 Bourns, Inc. Printed circuit boards with integrated passive components and method for making same

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7260890B2 (en) 2002-06-26 2007-08-28 Georgia Tech Research Corporation Methods for fabricating three-dimensional all organic interconnect structures
US6987307B2 (en) 2002-06-26 2006-01-17 Georgia Tech Research Corporation Stand-alone organic-based passive devices
US7068124B2 (en) 2003-03-28 2006-06-27 Georgia Tech Research Corporation Integrated passive devices fabricated utilizing multi-layer, organic laminates
US7489914B2 (en) 2003-03-28 2009-02-10 Georgia Tech Research Corporation Multi-band RF transceiver with passive reuse in organic substrates
US7805834B2 (en) 2003-03-28 2010-10-05 Georgia Tech Research Corporation Method for fabricating three-dimensional all organic interconnect structures
WO2005084090A1 (en) * 2004-02-23 2005-09-09 Georgia Tech Research Corporation Liquid crystalline polymer- and multilayer polymer-based passive signal processing components for rf/wireless multi-band applications
US8013688B2 (en) 2004-02-23 2011-09-06 Georgia Tech Research Corporation Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications
US7795995B2 (en) 2004-02-23 2010-09-14 Georgia Tech Research Corporation Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications
WO2007061691A3 (en) * 2005-11-17 2007-08-23 Cts Corp Ball grid array filter
US7724109B2 (en) 2005-11-17 2010-05-25 Cts Corporation Ball grid array filter
WO2007061691A2 (en) * 2005-11-17 2007-05-31 Cts Corporation Ball grid array filter
US7945231B2 (en) 2006-02-15 2011-05-17 Infineon Technologies Ag Semiconductor device for an ultra wideband standard for ultra-high-frequency communication, and method for producing the same
DE102006007381A1 (en) * 2006-02-15 2007-08-23 Infineon Technologies Ag Ultra-wide-band semiconductor component for ultra-wide-band standard in communication, comprises semiconductor component, ultra-wide-band semiconductor chip and multilevel circuit substrate with lower and upper metal layer
US7808434B2 (en) 2006-08-09 2010-10-05 Avx Corporation Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices
US7940148B2 (en) 2006-11-02 2011-05-10 Cts Corporation Ball grid array resonator
US7989895B2 (en) 2006-11-15 2011-08-02 Avx Corporation Integration using package stacking with multi-layer organic substrates
US7646255B2 (en) 2006-11-17 2010-01-12 Cts Corporation Voltage controlled oscillator module with ball grid array resonator
DE102006057332B4 (en) * 2006-12-05 2018-01-25 Infineon Technologies Ag Assembly comprising a substrate and a chip mounted on the substrate
US8053890B2 (en) 2006-12-05 2011-11-08 Infineon Technologies Ag Microchip assembly including an inductor and fabrication method
DE102006057332A1 (en) * 2006-12-05 2008-06-19 Infineon Technologies Ag Assembly comprising a substrate and a substrate mounted on the chip and a method of manufacturing the same
FR2919433A1 (en) * 2007-07-27 2009-01-30 Thales Sa Transmitting or receiving antenna module, has unitary radiating elements coupled to filters via calibration couplers and to electric outputs via connection network, where filters, couplers and outputs are developed at single layer
US8854277B2 (en) 2008-11-19 2014-10-07 Nxp, B.V. Millimetre-wave radio antenna module
WO2010058337A1 (en) * 2008-11-19 2010-05-27 Nxp B.V. Millimetre-wave radio antenna module
CN102074534B (en) 2009-11-24 2013-05-29 上海长丰智能卡有限公司 Micro PCB radio frequency module and packaging method thereof

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