JP2009260216A - 配線基板の製造方法 - Google Patents

配線基板の製造方法 Download PDF

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Publication number
JP2009260216A
JP2009260216A JP2008223635A JP2008223635A JP2009260216A JP 2009260216 A JP2009260216 A JP 2009260216A JP 2008223635 A JP2008223635 A JP 2008223635A JP 2008223635 A JP2008223635 A JP 2008223635A JP 2009260216 A JP2009260216 A JP 2009260216A
Authority
JP
Japan
Prior art keywords
seed layer
wiring
layer
resist film
plating resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008223635A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009260216A5 (enExample
Inventor
Hironari Kojima
弘成 小島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2008223635A priority Critical patent/JP2009260216A/ja
Priority to US12/406,161 priority patent/US20090238956A1/en
Publication of JP2009260216A publication Critical patent/JP2009260216A/ja
Publication of JP2009260216A5 publication Critical patent/JP2009260216A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2008223635A 2008-03-19 2008-09-01 配線基板の製造方法 Pending JP2009260216A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008223635A JP2009260216A (ja) 2008-03-19 2008-09-01 配線基板の製造方法
US12/406,161 US20090238956A1 (en) 2008-03-19 2009-03-18 Manufacturing method of a wiring board containing a seed layer having a roughened surface

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008071583 2008-03-19
JP2008223635A JP2009260216A (ja) 2008-03-19 2008-09-01 配線基板の製造方法

Publications (2)

Publication Number Publication Date
JP2009260216A true JP2009260216A (ja) 2009-11-05
JP2009260216A5 JP2009260216A5 (enExample) 2011-09-15

Family

ID=41089180

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008223635A Pending JP2009260216A (ja) 2008-03-19 2008-09-01 配線基板の製造方法

Country Status (2)

Country Link
US (1) US20090238956A1 (enExample)
JP (1) JP2009260216A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150016090A (ko) * 2013-08-01 2015-02-11 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 프린트 배선판의 제조방법
CN106469655A (zh) * 2015-08-18 2017-03-01 中芯国际集成电路制造(上海)有限公司 凸块封装方法、半导体器件及电子装置
JPWO2022054873A1 (enExample) * 2020-09-11 2022-03-17
WO2023012864A1 (ja) * 2021-08-02 2023-02-09 昭和電工マテリアルズ株式会社 配線基板を製造する方法、及び配線基板

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7969005B2 (en) * 2007-04-27 2011-06-28 Sanyo Electric Co., Ltd. Packaging board, rewiring, roughened conductor for semiconductor module of a portable device, and manufacturing method therefor
JP5138459B2 (ja) * 2008-05-15 2013-02-06 新光電気工業株式会社 配線基板の製造方法
JP5511597B2 (ja) * 2010-09-06 2014-06-04 日東電工株式会社 配線回路基板の製造方法
US9361915B1 (en) * 2011-12-02 2016-06-07 Hutchinson Technology Incorporated Method for making a disk drive head suspension component having a microstructured surface region
JP2021129048A (ja) * 2020-02-14 2021-09-02 イビデン株式会社 配線基板の製造方法及び配線基板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151841A (ja) * 2000-11-13 2002-05-24 Ibiden Co Ltd 多層プリント配線板の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0783168B2 (ja) * 1988-04-13 1995-09-06 株式会社日立製作所 プリント板の製造方法
DE4231535C2 (de) * 1991-09-20 1997-12-11 Hitachi Ltd Verfahren zur Erzeugung eines leitenden Schaltungsmusters
US5679230A (en) * 1995-08-21 1997-10-21 Oak-Mitsui, Inc. Copper foil for printed circuit boards
US6835895B1 (en) * 1996-12-19 2004-12-28 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
JP4665531B2 (ja) * 2005-01-27 2011-04-06 日立電線株式会社 配線板の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151841A (ja) * 2000-11-13 2002-05-24 Ibiden Co Ltd 多層プリント配線板の製造方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150016090A (ko) * 2013-08-01 2015-02-11 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 프린트 배선판의 제조방법
JP2015046575A (ja) * 2013-08-01 2015-03-12 三菱瓦斯化学株式会社 プリント配線板の製造方法
TWI627884B (zh) * 2013-08-01 2018-06-21 Mitsubishi Gas Chemical Co 印刷電路板之製造方法
KR20190132959A (ko) * 2013-08-01 2019-11-29 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 프린트 배선판의 제조방법
KR102052946B1 (ko) * 2013-08-01 2019-12-06 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 프린트 배선판의 제조방법
KR102176434B1 (ko) 2013-08-01 2020-11-09 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 프린트 배선판의 제조방법
KR20200127144A (ko) * 2013-08-01 2020-11-10 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 프린트 배선판의 제조방법
KR102237844B1 (ko) 2013-08-01 2021-04-09 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 프린트 배선판의 제조방법
CN106469655A (zh) * 2015-08-18 2017-03-01 中芯国际集成电路制造(上海)有限公司 凸块封装方法、半导体器件及电子装置
JPWO2022054873A1 (enExample) * 2020-09-11 2022-03-17
WO2023012864A1 (ja) * 2021-08-02 2023-02-09 昭和電工マテリアルズ株式会社 配線基板を製造する方法、及び配線基板
WO2023013556A1 (ja) * 2021-08-02 2023-02-09 昭和電工マテリアルズ株式会社 配線基板を製造する方法、及び配線基板

Also Published As

Publication number Publication date
US20090238956A1 (en) 2009-09-24

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