JP2009120946A - 成膜方法および発光装置の作製方法 - Google Patents
成膜方法および発光装置の作製方法 Download PDFInfo
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- JP2009120946A JP2009120946A JP2008271476A JP2008271476A JP2009120946A JP 2009120946 A JP2009120946 A JP 2009120946A JP 2008271476 A JP2008271476 A JP 2008271476A JP 2008271476 A JP2008271476 A JP 2008271476A JP 2009120946 A JP2009120946 A JP 2009120946A
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/048—Coating on selected surface areas, e.g. using masks using irradiation by energy or particles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008271476A JP2009120946A (ja) | 2007-10-23 | 2008-10-22 | 成膜方法および発光装置の作製方法 |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007274900 | 2007-10-23 | ||
| JP2008271476A JP2009120946A (ja) | 2007-10-23 | 2008-10-22 | 成膜方法および発光装置の作製方法 |
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| JP2009120946A true JP2009120946A (ja) | 2009-06-04 |
| JP2009120946A5 JP2009120946A5 (enExample) | 2011-11-10 |
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| JP2008271476A Withdrawn JP2009120946A (ja) | 2007-10-23 | 2008-10-22 | 成膜方法および発光装置の作製方法 |
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| Country | Link |
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| US (1) | US20090104721A1 (enExample) |
| JP (1) | JP2009120946A (enExample) |
| KR (1) | KR20090041316A (enExample) |
| CN (1) | CN101691652A (enExample) |
| TW (1) | TWI500787B (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011001596A1 (ja) * | 2009-07-03 | 2011-01-06 | シャープ株式会社 | 有機層の形成方法、有機電界発光素子の製造方法、有機電界発光素子、及び有機電界発光表示装置 |
| JP2012023026A (ja) * | 2010-07-12 | 2012-02-02 | Samsung Mobile Display Co Ltd | 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法 |
| WO2012053532A1 (ja) * | 2010-10-20 | 2012-04-26 | 株式会社アルバック | 有機膜形成装置及び有機膜形成方法 |
| US9627619B2 (en) | 2014-09-03 | 2017-04-18 | Samsung Display Co., Ltd. | Thin film forming apparatus and thin film forming method using the same |
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| KR101689519B1 (ko) * | 2007-12-26 | 2016-12-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 증착용 기판, 증착용 기판의 제조방법, 및 발광장치의 제조방법 |
| US8080811B2 (en) | 2007-12-28 | 2011-12-20 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing evaporation donor substrate and light-emitting device |
| WO2009099002A1 (en) | 2008-02-04 | 2009-08-13 | Semiconductor Energy Laboratory Co., Ltd. | Deposition method and method for manufacturing light-emitting device |
| WO2009107548A1 (en) * | 2008-02-29 | 2009-09-03 | Semiconductor Energy Laboratory Co., Ltd. | Deposition method and manufacturing method of light-emitting device |
| JP5416987B2 (ja) * | 2008-02-29 | 2014-02-12 | 株式会社半導体エネルギー研究所 | 成膜方法及び発光装置の作製方法 |
| US8182863B2 (en) * | 2008-03-17 | 2012-05-22 | Semiconductor Energy Laboratory Co., Ltd. | Deposition method and manufacturing method of light-emitting device |
| KR101629637B1 (ko) * | 2008-05-29 | 2016-06-13 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 성막방법 및 발광장치의 제조방법 |
| SG10201707064RA (en) * | 2009-09-07 | 2017-10-30 | Semiconductor Energy Lab | Light-emitting element, light-emitting device, lighting device, and electronic device |
| WO2011125570A1 (ja) * | 2010-03-31 | 2011-10-13 | 東レ株式会社 | 転写用ドナー基板、デバイスの製造方法および有機ｅｌ素子 |
| JP5559656B2 (ja) * | 2010-10-14 | 2014-07-23 | 大日本スクリーン製造株式会社 | 熱処理装置および熱処理方法 |
| JP5298244B2 (ja) * | 2010-10-19 | 2013-09-25 | シャープ株式会社 | 蒸着装置 |
| CN104862669B (zh) * | 2010-12-16 | 2018-05-22 | 潘重光 | 任意尺寸底板及显示屏的气相沉积荫罩板系统及其方法 |
| KR102112440B1 (ko) | 2011-02-16 | 2020-05-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 소자 |
| TWI486470B (zh) * | 2011-03-22 | 2015-06-01 | Au Optronics Corp | 蒸鍍設備 |
| EP2584062A1 (de) * | 2011-10-19 | 2013-04-24 | Heraeus Materials Technology GmbH & Co. KG | Sputtertarget und seine Verwendung |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI500787B (zh) | 2015-09-21 |
| CN101691652A (zh) | 2010-04-07 |
| TW200932930A (en) | 2009-08-01 |
| US20090104721A1 (en) | 2009-04-23 |
| KR20090041316A (ko) | 2009-04-28 |
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