JP2009120946A5 - - Google Patents

Download PDF

Info

Publication number
JP2009120946A5
JP2009120946A5 JP2008271476A JP2008271476A JP2009120946A5 JP 2009120946 A5 JP2009120946 A5 JP 2009120946A5 JP 2008271476 A JP2008271476 A JP 2008271476A JP 2008271476 A JP2008271476 A JP 2008271476A JP 2009120946 A5 JP2009120946 A5 JP 2009120946A5
Authority
JP
Japan
Prior art keywords
shadow mask
substrate
deposition
region
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008271476A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009120946A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008271476A priority Critical patent/JP2009120946A/ja
Priority claimed from JP2008271476A external-priority patent/JP2009120946A/ja
Publication of JP2009120946A publication Critical patent/JP2009120946A/ja
Publication of JP2009120946A5 publication Critical patent/JP2009120946A5/ja
Withdrawn legal-status Critical Current

Links

JP2008271476A 2007-10-23 2008-10-22 成膜方法および発光装置の作製方法 Withdrawn JP2009120946A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008271476A JP2009120946A (ja) 2007-10-23 2008-10-22 成膜方法および発光装置の作製方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007274900 2007-10-23
JP2008271476A JP2009120946A (ja) 2007-10-23 2008-10-22 成膜方法および発光装置の作製方法

Publications (2)

Publication Number Publication Date
JP2009120946A JP2009120946A (ja) 2009-06-04
JP2009120946A5 true JP2009120946A5 (enExample) 2011-11-10

Family

ID=40563879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008271476A Withdrawn JP2009120946A (ja) 2007-10-23 2008-10-22 成膜方法および発光装置の作製方法

Country Status (5)

Country Link
US (1) US20090104721A1 (enExample)
JP (1) JP2009120946A (enExample)
KR (1) KR20090041316A (enExample)
CN (1) CN101691652A (enExample)
TW (1) TWI500787B (enExample)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101689519B1 (ko) * 2007-12-26 2016-12-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 증착용 기판, 증착용 기판의 제조방법, 및 발광장치의 제조방법
US8080811B2 (en) 2007-12-28 2011-12-20 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing evaporation donor substrate and light-emitting device
WO2009099002A1 (en) 2008-02-04 2009-08-13 Semiconductor Energy Laboratory Co., Ltd. Deposition method and method for manufacturing light-emitting device
JP5416987B2 (ja) * 2008-02-29 2014-02-12 株式会社半導体エネルギー研究所 成膜方法及び発光装置の作製方法
WO2009107548A1 (en) * 2008-02-29 2009-09-03 Semiconductor Energy Laboratory Co., Ltd. Deposition method and manufacturing method of light-emitting device
US8182863B2 (en) * 2008-03-17 2012-05-22 Semiconductor Energy Laboratory Co., Ltd. Deposition method and manufacturing method of light-emitting device
KR101629637B1 (ko) * 2008-05-29 2016-06-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 성막방법 및 발광장치의 제조방법
US8535108B2 (en) 2009-07-03 2013-09-17 Sharp Kabushiki Kaisha Formation method of an organic layer, manufacturing method of an organic electroluminescent element, organic electroluminescent element, and organic electroluminescent display device
WO2011027657A1 (en) 2009-09-07 2011-03-10 Semiconductor Energy Laboratory Co., Ltd. Light-emitting element, light-emitting device, lighting device, and electronic device
KR101266828B1 (ko) * 2010-03-31 2013-05-27 도레이 카부시키가이샤 전사용 도너 기판, 디바이스의 제조 방법 및 유기 ｅｌ 소자
KR101182448B1 (ko) * 2010-07-12 2012-09-12 삼성디스플레이 주식회사 박막 증착 장치 및 이를 이용한 유기 발광 표시장치의 제조 방법
JP5559656B2 (ja) * 2010-10-14 2014-07-23 大日本スクリーン製造株式会社 熱処理装置および熱処理方法
JP5298244B2 (ja) 2010-10-19 2013-09-25 シャープ株式会社 蒸着装置
JP5619175B2 (ja) * 2010-10-20 2014-11-05 株式会社アルバック 有機膜形成方法
CN104862669B (zh) * 2010-12-16 2018-05-22 潘重光 任意尺寸底板及显示屏的气相沉积荫罩板系统及其方法
CN103380509B (zh) 2011-02-16 2017-02-15 株式会社半导体能源研究所 发光元件
TWI486470B (zh) * 2011-03-22 2015-06-01 Au Optronics Corp 蒸鍍設備
EP2584062A1 (de) * 2011-10-19 2013-04-24 Heraeus Materials Technology GmbH & Co. KG Sputtertarget und seine Verwendung
EP2781296B1 (de) * 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
KR20150007740A (ko) * 2013-07-12 2015-01-21 삼성디스플레이 주식회사 전사용 도너 기판 및 유기 발광 표시 장치의 제조 방법
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
JP6475251B2 (ja) * 2013-12-31 2019-02-27 昆山工研院新型平板顕示技術中心有限公司Ｋｕｎｓｈａｎ Ｎｅｗ Ｆｌａｔ Ｐａｎｅｌ Ｄｉｓｐｌａｙ Ｔｅｃｈｎｏｌｏｇｙ Ｃｅｎｔｅｒ Ｃｏ．， Ｌｔｄ． 有機発光表示装置及び視野角特性を改善したトップエミッション型ｏｌｅｄ装置
WO2015138226A1 (en) * 2014-03-12 2015-09-17 Advantech Global, Ltd Small mask tiling for larger area depositions
WO2016007572A1 (en) 2014-07-08 2016-01-14 Corning Incorporated Methods and apparatuses for laser processing materials
CN107073642B (zh) 2014-07-14 2020-07-28 康宁股份有限公司 使用长度和直径可调的激光束焦线来加工透明材料的系统和方法
KR102181239B1 (ko) 2014-09-03 2020-11-23 삼성디스플레이 주식회사 박막 형성 장치 및 그를 이용한 박막 형성 방법
CN105679967B (zh) * 2014-11-18 2018-06-26 昆山国显光电有限公司 掩膜板、制备有机发光显示装置的方法
CN104362170B (zh) * 2014-11-28 2017-04-12 京东方科技集团股份有限公司 一种有机电致发光显示器件、其驱动方法及相关装置
DE102015101932A1 (de) 2015-02-11 2016-08-25 Von Ardenne Gmbh Verfahren und Vorrichtung zur strukturierten Beschichtung von Substraten
CN107922237B (zh) 2015-03-24 2022-04-01 康宁股份有限公司 显示器玻璃组合物的激光切割和加工
CN104911548B (zh) * 2015-06-30 2017-05-03 合肥鑫晟光电科技有限公司 一种真空蒸镀装置及蒸镀方法
CN107835794A (zh) 2015-07-10 2018-03-23 康宁股份有限公司 在挠性基材板中连续制造孔的方法和与此相关的产品
CN105483619B (zh) * 2016-01-26 2018-01-02 京东方科技集团股份有限公司 移动靶镀膜装置及镀膜方法
JP6938543B2 (ja) 2016-05-06 2021-09-22 コーニング インコーポレイテッド 透明基板からの、輪郭設定された形状のレーザ切断及び取り外し
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
JP7066701B2 (ja) 2016-10-24 2022-05-13 コーニング インコーポレイテッド シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
CN111092171B (zh) * 2018-10-23 2022-08-16 宸鸿光电科技股份有限公司 有机发光二极管结构的形成方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3801730B2 (ja) * 1997-05-09 2006-07-26 株式会社半導体エネルギー研究所 プラズマｃｖｄ装置及びそれを用いた薄膜形成方法
US5937272A (en) * 1997-06-06 1999-08-10 Eastman Kodak Company Patterned organic layers in a full-color organic electroluminescent display array on a thin film transistor array substrate
US6165543A (en) * 1998-06-17 2000-12-26 Nec Corporation Method of making organic EL device and organic EL transfer base plate
TW527735B (en) * 1999-06-04 2003-04-11 Semiconductor Energy Lab Electro-optical device
US8853696B1 (en) * 1999-06-04 2014-10-07 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and electronic device
JP2002175878A (ja) * 2000-09-28 2002-06-21 Sanyo Electric Co Ltd 層の形成方法及びカラー発光装置の製造方法
DE10133686C2 (de) * 2001-07-11 2003-07-17 Osram Opto Semiconductors Gmbh Organisches, elektrolumineszierendes Display und dessen Herstellung
JP2003073804A (ja) * 2001-08-30 2003-03-12 Sony Corp 成膜方法および成膜装置
US6821348B2 (en) * 2002-02-14 2004-11-23 3M Innovative Properties Company In-line deposition processes for circuit fabrication
US6703179B2 (en) * 2002-03-13 2004-03-09 Eastman Kodak Company Transfer of organic material from a donor to form a layer in an OLED device
JP2004103341A (ja) * 2002-09-09 2004-04-02 Matsushita Electric Ind Co Ltd 有機エレクトロルミネッセンス素子の製造方法
US20040191564A1 (en) * 2002-12-17 2004-09-30 Samsung Sdi Co., Ltd. Donor film for low molecular weight full color organic electroluminescent device using laser induced thermal imaging method and method for fabricating low molecular weight full color organic electroluminescent device using the film
JP2004296201A (ja) * 2003-03-26 2004-10-21 Tohoku Pioneer Corp 蒸着源、蒸着装置、有機ｅｌ素子、有機ｅｌ素子の製造方法
JP4493926B2 (ja) * 2003-04-25 2010-06-30 株式会社半導体エネルギー研究所 製造装置
US20050079418A1 (en) * 2003-10-14 2005-04-14 3M Innovative Properties Company In-line deposition processes for thin film battery fabrication
JP2005120418A (ja) * 2003-10-16 2005-05-12 Stanley Electric Co Ltd 蒸着装置及び薄膜形成方法
US20050145326A1 (en) * 2004-01-05 2005-07-07 Eastman Kodak Company Method of making an OLED device
JP4534011B2 (ja) * 2004-06-25 2010-09-01 京セラ株式会社 マスクアライメント法を用いたディスプレイの製造方法
JP2006077297A (ja) * 2004-09-10 2006-03-23 Seiko Epson Corp マスク、成膜方法、有機ｅｌ装置の製造方法
JP4375232B2 (ja) * 2005-01-06 2009-12-02 セイコーエプソン株式会社 マスク成膜方法
JP2006309995A (ja) * 2005-04-27 2006-11-09 Sony Corp 転写用基板および表示装置の製造方法ならびに表示装置
TWI307612B (en) * 2005-04-27 2009-03-11 Sony Corp Transfer method and transfer apparatus
JP2006344459A (ja) * 2005-06-08 2006-12-21 Sony Corp 転写方法および転写装置

Similar Documents

Publication Publication Date Title
JP2009120946A5 (enExample)
JP2009123692A5 (enExample)
JP2009295574A5 (ja) 成膜方法、及び成膜用基板
TWI360840B (en) A process for low temperature plasma deposition of
JP2010514562A5 (enExample)
JP2006028583A5 (ja) 製造装置、膜形成方法、発光装置の作製方法
TWI658158B (zh) 沈積一已蒸發源材料於一基板上之方法及沈積設備及操作其之方法
JP2009087930A5 (enExample)
JP2013147754A5 (ja) 成膜方法および発光装置の作製方法
CN203582959U (zh) 一种蒸镀装置
JP2009152187A5 (enExample)
EP2555058A3 (en) Environmental Control Subsystem for a Variable Data Lithographic Apparatus
CN106399931A (zh) 沉积装置
TWI335356B (en) Apparatus and method for depositing thin films
TWI650614B (zh) 成膜方法及成膜裝置
CN101378107B (zh) 一种oled显示器件有机发光层形成方法
JP2009506200A5 (enExample)
JP2010528427A5 (enExample)
JP2008522848A (ja) 固体凝縮ガス層のエネルギー誘導局所除去を用いるリフトオフパターニング方法
JP2011106017A5 (enExample)
JP2010027210A5 (enExample)
JP6768918B2 (ja) 気化器および素子構造体の製造装置
KR20170104103A (ko) 고해상도 오엘이디 패턴 증착용 곡면증발원
JP2016117915A (ja) 蒸着装置並びに蒸着方法
JP2011040186A5 (enExample)