JP2009059860A - トレンチゲート型半導体装置 - Google Patents
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- JP2009059860A JP2009059860A JP2007225414A JP2007225414A JP2009059860A JP 2009059860 A JP2009059860 A JP 2009059860A JP 2007225414 A JP2007225414 A JP 2007225414A JP 2007225414 A JP2007225414 A JP 2007225414A JP 2009059860 A JP2009059860 A JP 2009059860A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 128
- 238000009792 diffusion process Methods 0.000 claims abstract description 51
- 239000012535 impurity Substances 0.000 claims description 32
- 230000001066 destructive effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 196
- 239000002184 metal Substances 0.000 description 33
- 230000015556 catabolic process Effects 0.000 description 29
- 230000015572 biosynthetic process Effects 0.000 description 11
- 239000000758 substrate Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000001133 acceleration Effects 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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Abstract
【解決手段】第1導電型半導体層と、第1導電型半導体層内の主面側に選択的に設けられた第2導電型拡散領域と、第2導電型拡散領域内に選択的に設けられた第1導電型拡散領域と、第1導電型拡散領域に接触し、かつ第2導電型拡散領域を貫通して第1導電型半導体層に達する複数の第1のトレンチ内に、ゲート絶縁膜を介して設けられたゲート電極と、第1導電型半導体層内において第2導電型拡散領域と離間して設けられた第2導電型の第1の半導体領域と、第2導電型拡散領域内において隣り合う第1のトレンチ間に設けられた第2導電型の第2の半導体領域と、第1の半導体領域が設けられた第1導電型半導体層側の第1主面及び第1導電型拡散領域に接続された第1主電極とを具備する。
【選択図】図1
Description
Claims (5)
- 相互に対向する第1主面及び第2主面を有する第1導電型半導体層と、
前記第1導電型半導体層内の前記第1主面側に選択的に設けられた第2導電型拡散領域と、
前記第2導電型拡散領域内に選択的に設けられた第1導電型拡散領域と、
前記第1導電型拡散領域に接触し、かつ前記第2導電型拡散領域を貫通して前記第1導電型半導体層に達する複数の第1のトレンチ内に、ゲート絶縁膜を介して設けられたゲート電極と、
前記第1導電型半導体層内において前記第2導電型拡散領域と離間して設けられた第2導電型の第1の半導体領域と、
前記第2導電型拡散領域内において隣り合う前記第1のトレンチ間に設けられた第2導電型の第2の半導体領域と、
前記第1の半導体領域が設けられた前記第1導電型半導体層側の前記第1主面及び前記第1導電型拡散領域に接続された第1主電極と
を具備することを特徴とするトレンチゲート型半導体装置。 - 前記第1の半導体領域が、前記第1導電型半導体層内の所定の水平位置に相互に離間して複数個設けられていることを特徴とする請求項1記載のトレンチゲート型半導体装置。
- 前記第2の半導体領域が、前記第1導電型半導体層内において前記第1の半導体領域と実質同じ水平位置に設けられていることを特徴とする請求項2記載のトレンチゲート型半導体装置。
- 前記第1導電型半導体層内において前記第1主面から前記第1の半導体領域に向かって設けられた第2のトレンチ内に、前記第1主電極が延在していることを特徴とする請求項1記載のトレンチゲート型半導体装置。
- 前記第1の半導体領域が、第1の不純物濃度を有する第1の部位と、前記第1の部位上に位置し、かつ前記第1の不純物濃度よりも高い第2の不純物濃度を有する第2の部位とを有することを特徴とする請求項4記載のトレンチゲート型半導体装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007225414A JP4599379B2 (ja) | 2007-08-31 | 2007-08-31 | トレンチゲート型半導体装置 |
TW097130837A TWI412131B (zh) | 2007-08-31 | 2008-08-13 | Diversion gate type semiconductor device and manufacturing method thereof |
US12/199,224 US8169021B2 (en) | 2007-08-31 | 2008-08-27 | Trench gate semiconductor device and method of manufacturing the same |
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Application Number | Priority Date | Filing Date | Title |
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JP2007225414A JP4599379B2 (ja) | 2007-08-31 | 2007-08-31 | トレンチゲート型半導体装置 |
Publications (2)
Publication Number | Publication Date |
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JP2009059860A true JP2009059860A (ja) | 2009-03-19 |
JP4599379B2 JP4599379B2 (ja) | 2010-12-15 |
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JP2007225414A Active JP4599379B2 (ja) | 2007-08-31 | 2007-08-31 | トレンチゲート型半導体装置 |
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Country | Link |
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US (1) | US8169021B2 (ja) |
JP (1) | JP4599379B2 (ja) |
TW (1) | TWI412131B (ja) |
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JP2011198993A (ja) * | 2010-03-19 | 2011-10-06 | Toshiba Corp | 半導体装置およびdc−dcコンバータ |
US8610213B2 (en) | 2010-12-10 | 2013-12-17 | Rohm Co., Ltd. | Semiconductor device and semiconductor package |
JP2014170778A (ja) * | 2013-03-01 | 2014-09-18 | Sumitomo Electric Ind Ltd | 炭化珪素半導体装置 |
US8928072B2 (en) | 2012-05-09 | 2015-01-06 | Rohm Co., Ltd. | Semiconductor device |
KR20150033555A (ko) * | 2013-09-24 | 2015-04-01 | 도요타 지도샤(주) | 반도체 장치 |
US9911803B2 (en) | 2013-09-24 | 2018-03-06 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device |
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JP2008085188A (ja) * | 2006-09-28 | 2008-04-10 | Sanyo Electric Co Ltd | 絶縁ゲート型半導体装置 |
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US8193579B2 (en) | 2008-07-29 | 2012-06-05 | Rohm Co., Ltd. | Trench type semiconductor device and fabrication method for the same |
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DE102009028240A1 (de) * | 2009-08-05 | 2011-02-10 | Robert Bosch Gmbh | Feldeffekttransistor mit integrierter TJBS-Diode |
JP2011176026A (ja) * | 2010-02-23 | 2011-09-08 | Fuji Electric Co Ltd | 半導体素子の製造方法 |
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JP6047297B2 (ja) * | 2012-04-09 | 2016-12-21 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP6135364B2 (ja) * | 2013-07-26 | 2017-05-31 | 住友電気工業株式会社 | 炭化珪素半導体装置およびその製造方法 |
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JP2005057049A (ja) * | 2003-08-04 | 2005-03-03 | Renesas Technology Corp | 半導体装置およびその製造方法 |
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JPH01138754A (ja) * | 1987-11-26 | 1989-05-31 | Shindengen Electric Mfg Co Ltd | ショットキダイオード |
JP2001284604A (ja) * | 2000-03-31 | 2001-10-12 | Shindengen Electric Mfg Co Ltd | 半導体装置 |
JP2002033479A (ja) * | 2000-07-17 | 2002-01-31 | Yokogawa Electric Corp | 半導体リレー |
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Cited By (12)
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JP2011198993A (ja) * | 2010-03-19 | 2011-10-06 | Toshiba Corp | 半導体装置およびdc−dcコンバータ |
US8610213B2 (en) | 2010-12-10 | 2013-12-17 | Rohm Co., Ltd. | Semiconductor device and semiconductor package |
US9123535B2 (en) | 2010-12-10 | 2015-09-01 | Rohm Co., Ltd. | Semiconductor device and semiconductor package |
US9490242B2 (en) | 2010-12-10 | 2016-11-08 | Rohm Co., Ltd. | Semiconductor device and semiconductor package |
US8928072B2 (en) | 2012-05-09 | 2015-01-06 | Rohm Co., Ltd. | Semiconductor device |
US9076885B2 (en) | 2012-05-09 | 2015-07-07 | Rohm Co., Ltd. | Manufacturing method of semiconductor device |
US9368612B2 (en) | 2012-05-09 | 2016-06-14 | Rohm Co., Ltd. | Semiconductor device with diode trench and schottky electrode |
JP2014170778A (ja) * | 2013-03-01 | 2014-09-18 | Sumitomo Electric Ind Ltd | 炭化珪素半導体装置 |
KR20150033555A (ko) * | 2013-09-24 | 2015-04-01 | 도요타 지도샤(주) | 반도체 장치 |
US9219142B2 (en) | 2013-09-24 | 2015-12-22 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device having element region and termination region surrounding element region |
KR101668918B1 (ko) | 2013-09-24 | 2016-10-24 | 도요타 지도샤(주) | 반도체 장치 |
US9911803B2 (en) | 2013-09-24 | 2018-03-06 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device |
Also Published As
Publication number | Publication date |
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TW200915570A (en) | 2009-04-01 |
TWI412131B (zh) | 2013-10-11 |
US8169021B2 (en) | 2012-05-01 |
JP4599379B2 (ja) | 2010-12-15 |
US20090057757A1 (en) | 2009-03-05 |
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