JP2007537562A - サスペンションアセンブリ用貴金属導電性リードの作製方法 - Google Patents

サスペンションアセンブリ用貴金属導電性リードの作製方法 Download PDF

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Publication number
JP2007537562A
JP2007537562A JP2007513445A JP2007513445A JP2007537562A JP 2007537562 A JP2007537562 A JP 2007537562A JP 2007513445 A JP2007513445 A JP 2007513445A JP 2007513445 A JP2007513445 A JP 2007513445A JP 2007537562 A JP2007537562 A JP 2007537562A
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Japan
Prior art keywords
conductive
layer
lead
plating
spring metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2007513445A
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English (en)
Japanese (ja)
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JP2007537562A5 (enExample
Inventor
カート Ｃ． スワンソン
ジェフリー ワング
Original Assignee
ハッチンソン テクノロジー インコーポレーティッド
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Application filed by ハッチンソン テクノロジー インコーポレーティッド filed Critical ハッチンソン テクノロジー インコーポレーティッド
Publication of JP2007537562A publication Critical patent/JP2007537562A/ja
Publication of JP2007537562A5 publication Critical patent/JP2007537562A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/484—Integrated arm assemblies, e.g. formed by material deposition or by etching from single piece of metal or by lamination of materials forming a single arm/suspension/head unit
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/486—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
JP2007513445A 2004-05-14 2005-05-13 サスペンションアセンブリ用貴金属導電性リードの作製方法 Pending JP2007537562A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US57147604P 2004-05-14 2004-05-14
PCT/US2005/016982 WO2005114658A2 (en) 2004-05-14 2005-05-13 Method for making noble metal conductive leads for suspension assemblies

Publications (2)

Publication Number Publication Date
JP2007537562A true JP2007537562A (ja) 2007-12-20
JP2007537562A5 JP2007537562A5 (enExample) 2008-05-22

Family

ID=35429082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007513445A Pending JP2007537562A (ja) 2004-05-14 2005-05-13 サスペンションアセンブリ用貴金属導電性リードの作製方法

Country Status (3)

Country Link
US (2) US7142395B2 (enExample)
JP (1) JP2007537562A (enExample)
WO (1) WO2005114658A2 (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011023063A (ja) * 2009-07-15 2011-02-03 Dainippon Printing Co Ltd サスペンション用基板およびその製造方法
US8059369B2 (en) 2009-05-22 2011-11-15 Kabushiki Kaisha Toshiba Head gimbal assembly and disk drive provided with the same
JP2012099762A (ja) * 2010-11-05 2012-05-24 Nitto Denko Corp 配線回路基板
JP2012160235A (ja) * 2011-02-01 2012-08-23 Nitto Denko Corp 回路付サスペンション基板
WO2012121032A1 (ja) * 2011-03-08 2012-09-13 大日本印刷株式会社 配線回路基板、サスペンション用フレキシャー基板およびサスペンション用フレキシャー基板の製造方法
JP2013236106A (ja) * 2013-08-12 2013-11-21 Dainippon Printing Co Ltd 配線回路基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブおよび配線回路基板の製造方法
US9295156B2 (en) 2013-05-28 2016-03-22 Nitto Denko Corporation Wired circuit board
JP2016157508A (ja) * 2016-05-25 2016-09-01 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブおよびサスペンション用基板の製造方法

Families Citing this family (95)

* Cited by examiner, † Cited by third party
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US7489493B2 (en) * 2003-12-01 2009-02-10 Magnecomp Corporation Method to form electrostatic discharge protection on flexible circuits using a diamond-like carbon material
WO2005114658A2 (en) * 2004-05-14 2005-12-01 Hutchinson Technology Incorporated Method for making noble metal conductive leads for suspension assemblies
US7466517B2 (en) * 2005-06-15 2008-12-16 Seagate Technology Llc Unified suspension laminate
JP4640802B2 (ja) * 2005-07-07 2011-03-02 日東電工株式会社 回路付サスペンション基板
JP4652179B2 (ja) * 2005-09-05 2011-03-16 日東電工株式会社 配線回路基板
US8395866B1 (en) * 2005-09-09 2013-03-12 Magnecomp Corporation Resilient flying lead and terminus for disk drive suspension
US8553364B1 (en) 2005-09-09 2013-10-08 Magnecomp Corporation Low impedance, high bandwidth disk drive suspension circuit
US7436040B2 (en) * 2005-12-29 2008-10-14 Lsi Corporation Method and apparatus for diverting void diffusion in integrated circuit conductors
US7361965B2 (en) * 2005-12-29 2008-04-22 Lsi Logic Corporation Method and apparatus for redirecting void diffusion away from vias in an integrated circuit design
JP4865453B2 (ja) * 2006-08-30 2012-02-01 日東電工株式会社 配線回路基板およびその製造方法
US7710687B1 (en) 2006-09-13 2010-05-04 Hutchinson Technology Incorporated High conductivity ground planes for integrated lead suspensions
US7929252B1 (en) 2006-10-10 2011-04-19 Hutchinson Technology Incorporated Multi-layer ground plane structures for integrated lead suspensions
US7832082B1 (en) * 2006-10-10 2010-11-16 Hutchinson Technology Incorporated Method for manufacturing an integrated lead suspension component
US7813082B2 (en) * 2007-01-26 2010-10-12 Hutchinson Technology Incorporated Head suspension flexure with inline lead portions positioned at a level between levels of first and second surfaces of the spring metal layer
JP5227531B2 (ja) * 2007-03-30 2013-07-03 日本発條株式会社 ディスク装置用サスペンション
US8379349B1 (en) * 2007-05-04 2013-02-19 Hutchinson Technology Incorporated Trace jumpers for disc drive suspensions
JP2008282995A (ja) * 2007-05-10 2008-11-20 Nitto Denko Corp 配線回路基板
US8082656B1 (en) * 2007-09-04 2011-12-27 Hutchinson Technology Incorporated Method for manufacturing a disk drive head suspension
JP4892453B2 (ja) * 2007-10-23 2012-03-07 日東電工株式会社 回路付サスペンション基板
US8320083B1 (en) 2007-12-06 2012-11-27 Magnecomp Corporation Electrical interconnect with improved corrosion resistance for a disk drive head suspension
JP5139102B2 (ja) * 2008-02-05 2013-02-06 日東電工株式会社 配線回路基板およびその製造方法
US8169746B1 (en) 2008-04-08 2012-05-01 Hutchinson Technology Incorporated Integrated lead suspension with multiple trace configurations
JP2009259315A (ja) * 2008-04-14 2009-11-05 Nitto Denko Corp 回路付サスペンション基板およびその製造方法
JP5139169B2 (ja) * 2008-06-20 2013-02-06 日東電工株式会社 配線回路基板およびその製造方法
JP5604830B2 (ja) * 2008-12-22 2014-10-15 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンションおよびハードディスクドライブ
CN102044256A (zh) * 2009-10-16 2011-05-04 新科实业有限公司 悬臂件及其制造方法、设有该悬臂件的磁头悬臂组合以及磁盘驱动器
US8462464B1 (en) * 2009-11-24 2013-06-11 Magnecomp Corporation High strength flying leads for multi-layer flexure designs
US8885299B1 (en) 2010-05-24 2014-11-11 Hutchinson Technology Incorporated Low resistance ground joints for dual stage actuation disk drive suspensions
JP5591602B2 (ja) * 2010-06-24 2014-09-17 日本発條株式会社 フレキシャ及びその配線部形成方法
JP4962879B2 (ja) * 2010-07-06 2012-06-27 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
US8467153B1 (en) 2010-10-29 2013-06-18 Western Digital Technologies, Inc. Disk drive head gimbal assembly having a flexure tail with folded bond pads
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US8320084B1 (en) * 2010-10-29 2012-11-27 Western Digital Technologies, Inc. Disk drive head gimbal assembly having a flexure tail with features to facilitate bonding
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US9633680B2 (en) 2010-10-29 2017-04-25 Western Digital Technologies, Inc. Head suspension having a flexure tail with a covered conductive layer and structural layer bond pads
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JP5711947B2 (ja) * 2010-11-30 2015-05-07 日本発條株式会社 ディスク装置用フレキシャ
JP5713718B2 (ja) * 2011-02-17 2015-05-07 日本発條株式会社 フレキシャ及びこれを備えたヘッドサスペンション
US8665566B1 (en) 2011-12-20 2014-03-04 Western Digital Technologies, Inc. Suspension tail design for a head gimbal assembly of a hard disk drive
US8760812B1 (en) 2011-12-20 2014-06-24 Western Digital Technologies, Inc. Disk drive head gimbal assembly having a jumper in a flexible printed circuit overlap region
US9001469B2 (en) 2012-03-16 2015-04-07 Hutchinson Technology Incorporated Mid-loadbeam dual stage actuated (DSA) disk drive head suspension
US9093117B2 (en) 2012-03-22 2015-07-28 Hutchinson Technology Incorporated Ground feature for disk drive head suspension flexures
JP6174843B2 (ja) * 2012-03-27 2017-08-02 大日本印刷株式会社 サスペンション用基板、サスペンション、素子付サスペンション、ハードディスクドライブ、およびサスペンション用基板の製造方法
JP6024225B2 (ja) * 2012-06-08 2016-11-09 大日本印刷株式会社 サスペンション用フレキシャー基板
JP6024226B2 (ja) * 2012-06-08 2016-11-09 大日本印刷株式会社 サスペンション用フレキシャー基板
US8861141B2 (en) 2012-08-31 2014-10-14 Hutchinson Technology Incorporated Damped dual stage actuation disk drive suspensions
JP6251745B2 (ja) 2012-09-14 2017-12-20 ハッチンソン テクノロジー インコーポレイテッドＨｕｔｃｈｉｎｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃｏｒｐｏｒａｔｅｄ ２段始動構造部を有するジンバル形撓み部材及びサスペンション
JP6356682B2 (ja) 2012-10-10 2018-07-11 ハッチンソン テクノロジー インコーポレイテッドＨｕｔｃｈｉｎｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃｏｒｐｏｒａｔｅｄ 二段作動構造を有するサスペンション
US8941951B2 (en) 2012-11-28 2015-01-27 Hutchinson Technology Incorporated Head suspension flexure with integrated strain sensor and sputtered traces
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JP6228454B2 (ja) * 2013-12-26 2017-11-08 日東電工株式会社 回路付サスペンション基板およびその製造方法
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JP6869890B2 (ja) * 2015-01-16 2021-05-12 ハッチンソン テクノロジー インコーポレイテッドＨｕｔｃｈｉｎｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃｏｒｐｏｒａｔｅｄ 金電気めっき溶液及び方法
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EP3410929A4 (en) 2016-02-03 2020-01-22 Hutchinson Technology Incorporated MINIATURIZED PRESSURE / FORCE SENSOR WITH INTEGRATED CONDUCTORS
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KR102766940B1 (ko) 2016-06-09 2025-02-14 허친슨 테크놀로지 인코포레이티드 현가 조립체를 위한 접착제를 갖는 형상기억합금 와이어 부착 구조물
JP6802688B2 (ja) * 2016-11-02 2020-12-16 日東電工株式会社 配線回路基板
JP6778585B2 (ja) * 2016-11-02 2020-11-04 日東電工株式会社 配線回路基板およびその製造方法
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WO2021134261A1 (zh) * 2019-12-30 2021-07-08 瑞声声学科技(深圳)有限公司 软性电路板及电子装置
US12002497B2 (en) * 2020-01-31 2024-06-04 Magnecomp Corporation Suspension damping
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US20050254175A1 (en) 2005-11-17

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