JP2007533167A - ワークピース処理システム - Google Patents

ワークピース処理システム Download PDF

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Publication number
JP2007533167A
JP2007533167A JP2007508638A JP2007508638A JP2007533167A JP 2007533167 A JP2007533167 A JP 2007533167A JP 2007508638 A JP2007508638 A JP 2007508638A JP 2007508638 A JP2007508638 A JP 2007508638A JP 2007533167 A JP2007533167 A JP 2007533167A
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JP
Japan
Prior art keywords
workpiece
load lock
wafer
robot
low pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007508638A
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English (en)
Japanese (ja)
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JP2007533167A5 (https=
Inventor
フェラーラ ジョセフ
Original Assignee
アクセリス テクノロジーズ インコーポレーテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アクセリス テクノロジーズ インコーポレーテッド filed Critical アクセリス テクノロジーズ インコーポレーテッド
Publication of JP2007533167A publication Critical patent/JP2007533167A/ja
Publication of JP2007533167A5 publication Critical patent/JP2007533167A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0471—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one ion or electron beam chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2007508638A 2004-04-16 2005-04-18 ワークピース処理システム Pending JP2007533167A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/826,419 US7246985B2 (en) 2004-04-16 2004-04-16 Work-piece processing system
PCT/US2005/013273 WO2006041530A2 (en) 2004-04-16 2005-04-18 Work-piece processing system

Publications (2)

Publication Number Publication Date
JP2007533167A true JP2007533167A (ja) 2007-11-15
JP2007533167A5 JP2007533167A5 (https=) 2008-05-08

Family

ID=35096438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007508638A Pending JP2007533167A (ja) 2004-04-16 2005-04-18 ワークピース処理システム

Country Status (7)

Country Link
US (2) US7246985B2 (https=)
EP (1) EP1735822A2 (https=)
JP (1) JP2007533167A (https=)
KR (1) KR101276014B1 (https=)
CN (1) CN100437898C (https=)
TW (1) TWI347295B (https=)
WO (1) WO2006041530A2 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009534867A (ja) * 2006-04-24 2009-09-24 アクセリス テクノロジーズ， インコーポレイテッド ロードロック制御
WO2012098871A1 (ja) * 2011-01-20 2012-07-26 東京エレクトロン株式会社 真空処理装置
WO2020059574A1 (ja) * 2018-09-21 2020-03-26 東京エレクトロン株式会社 真空処理装置及び基板搬送方法
JP2020510310A (ja) * 2017-03-15 2020-04-02 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ
JP2024526523A (ja) * 2021-10-12 2024-07-19 アプライド マテリアルズ インコーポレイテッド 組み込まれたロードロックと共に使用可能であるファクトリインターフェースロボット

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US7720558B2 (en) * 2004-09-04 2010-05-18 Applied Materials, Inc. Methods and apparatus for mapping carrier contents
US9110456B2 (en) * 2004-09-08 2015-08-18 Abb Research Ltd. Robotic machining with a flexible manipulator
JP4907077B2 (ja) * 2004-11-30 2012-03-28 株式会社Ｓｅｎ ウエハ処理装置及びウエハ処理方法並びにイオン注入装置
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US8153513B2 (en) * 2006-07-25 2012-04-10 Silicon Genesis Corporation Method and system for continuous large-area scanning implantation process
US7740437B2 (en) 2006-09-22 2010-06-22 Asm International N.V. Processing system with increased cassette storage capacity
JP4664264B2 (ja) * 2006-10-26 2011-04-06 東京エレクトロン株式会社 検出装置及び検出方法
US20080138178A1 (en) * 2006-12-06 2008-06-12 Axcelis Technologies,Inc. High throughput serial wafer handling end station
US7585142B2 (en) * 2007-03-16 2009-09-08 Asm America, Inc. Substrate handling chamber with movable substrate carrier loading platform
US8752449B2 (en) 2007-05-08 2014-06-17 Brooks Automation, Inc. Substrate transport apparatus with multiple movable arms utilizing a mechanical switch mechanism
US8283813B2 (en) 2007-06-27 2012-10-09 Brooks Automation, Inc. Robot drive with magnetic spindle bearings
US9752615B2 (en) 2007-06-27 2017-09-05 Brooks Automation, Inc. Reduced-complexity self-bearing brushless DC motor
KR101659931B1 (ko) 2007-06-27 2016-09-26 브룩스 오토메이션 인코퍼레이티드 다차원 위치 센서
CN101855811B (zh) 2007-06-27 2013-11-20 布鲁克斯自动化公司 具有提升能力和减少的齿槽特性的电机定子
JP5416104B2 (ja) 2007-06-27 2014-02-12 ブルックス オートメーション インコーポレイテッド セルフベアリングモータ用位置フィードバック
US8823294B2 (en) 2007-06-27 2014-09-02 Brooks Automation, Inc. Commutation of an electromagnetic propulsion and guidance system
WO2009012396A2 (en) 2007-07-17 2009-01-22 Brooks Automation, Inc. Substrate processing apparatus with motors integral to chamber walls
WO2011007753A1 (ja) * 2009-07-14 2011-01-20 キヤノンアネルバ株式会社 基板処理装置
JP5465979B2 (ja) * 2009-10-26 2014-04-09 東京エレクトロン株式会社 半導体製造装置
JP5476171B2 (ja) * 2010-03-16 2014-04-23 株式会社日立ハイテクノロジーズ 真空処理装置
JP5755842B2 (ja) * 2010-04-22 2015-07-29 株式会社ダイヘン ワーク搬送システム
CN102310999B (zh) * 2010-07-09 2013-07-17 上海凯世通半导体有限公司 真空传输制程设备及方法
KR101331288B1 (ko) * 2010-08-06 2013-11-20 도쿄엘렉트론가부시키가이샤 기판 처리 시스템, 반송 모듈, 기판 처리 방법 및 반도체 소자의 제조 방법
JP5494617B2 (ja) * 2011-10-26 2014-05-21 株式会社安川電機 ロボットシステムおよび加工品の製造方法
CN102539263A (zh) * 2011-11-29 2012-07-04 南通大学 基于掩蔽处理技术的轻微磨损测量方法
US9139402B2 (en) * 2012-02-21 2015-09-22 Altec Industries, Inc. Retractable load guide
JP6002532B2 (ja) * 2012-10-10 2016-10-05 株式会社日立ハイテクノロジーズ 真空処理装置及び真空処理方法
US10328580B2 (en) * 2013-08-09 2019-06-25 Persimmon Technologies Corporation Reduced footprint substrate transport vacuum platform
CN104016175A (zh) * 2014-05-26 2014-09-03 王义峰 一种丝网印刷机的自动输出机构
JP6257455B2 (ja) * 2014-06-17 2018-01-10 住友重機械イオンテクノロジー株式会社 イオン注入装置及びイオン注入装置の制御方法
US9378992B2 (en) 2014-06-27 2016-06-28 Axcelis Technologies, Inc. High throughput heated ion implantation system and method
US9776807B2 (en) * 2014-10-29 2017-10-03 Alain Cerf Changing orientation of an article on a moving conveyor
KR20170084240A (ko) * 2014-11-14 2017-07-19 마퍼 리쏘그라피 아이피 비.브이. 리소그래피 시스템에서 기판을 이송하기 위한 로드 로크 시스템 및 방법
US9607803B2 (en) 2015-08-04 2017-03-28 Axcelis Technologies, Inc. High throughput cooled ion implantation system and method
US10559483B2 (en) * 2016-08-10 2020-02-11 Lam Research Corporation Platform architecture to improve system productivity
JP6493339B2 (ja) * 2016-08-26 2019-04-03 村田機械株式会社 搬送容器、及び収容物の移載方法
CN108695217B (zh) * 2017-04-07 2021-06-29 台湾积体电路制造股份有限公司 衬底传送装置及其端缘作用器
US11581203B2 (en) * 2020-09-02 2023-02-14 Applied Materials, Inc. Systems for integrating load locks into a factory interface footprint space
US12159802B2 (en) 2021-03-04 2024-12-03 Applied Materials, Inc. Shortened load port for factory interface

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JPH11307608A (ja) * 1998-04-16 1999-11-05 Nissin Electric Co Ltd 被処理物体搬送装置
JP2000012647A (ja) * 1998-06-19 2000-01-14 Sumitomo Eaton Noba Kk ウエハ搬送装置及びその方法
JP2000208589A (ja) * 1998-11-09 2000-07-28 Tokyo Electron Ltd 処理装置
JP2000323551A (ja) * 1999-05-11 2000-11-24 Anelva Corp 基板処理装置
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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009534867A (ja) * 2006-04-24 2009-09-24 アクセリス テクノロジーズ， インコーポレイテッド ロードロック制御
WO2012098871A1 (ja) * 2011-01-20 2012-07-26 東京エレクトロン株式会社 真空処理装置
JP6006643B2 (ja) * 2011-01-20 2016-10-12 東京エレクトロン株式会社 真空処理装置
JP7275039B2 (ja) 2017-03-15 2023-05-17 ラム リサーチ コーポレーション リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ
JP7608512B2 (ja) 2017-03-15 2025-01-06 ラム リサーチ コーポレーション リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ
JP2020510310A (ja) * 2017-03-15 2020-04-02 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ
JP2023099172A (ja) * 2017-03-15 2023-07-11 ラム リサーチ コーポレーション リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ
JP7210960B2 (ja) 2018-09-21 2023-01-24 東京エレクトロン株式会社 真空処理装置及び基板搬送方法
JP2020053418A (ja) * 2018-09-21 2020-04-02 東京エレクトロン株式会社 真空処理装置及び基板搬送方法
TWI844566B (zh) * 2018-09-21 2024-06-11 日商東京威力科創股份有限公司 真空處理裝置及基板搬送方法
WO2020059574A1 (ja) * 2018-09-21 2020-03-26 東京エレクトロン株式会社 真空処理装置及び基板搬送方法
JP2024526523A (ja) * 2021-10-12 2024-07-19 アプライド マテリアルズ インコーポレイテッド 組み込まれたロードロックと共に使用可能であるファクトリインターフェースロボット
JP7704895B2 (ja) 2021-10-12 2025-07-08 アプライド マテリアルズ インコーポレイテッド 組み込まれたロードロックと共に使用可能であるファクトリインターフェースロボット

Also Published As

Publication number Publication date
TWI347295B (en) 2011-08-21
KR20070012490A (ko) 2007-01-25
US7699574B2 (en) 2010-04-20
US20050232727A1 (en) 2005-10-20
TW200540087A (en) 2005-12-16
WO2006041530A3 (en) 2006-06-08
KR101276014B1 (ko) 2013-06-19
CN1943009A (zh) 2007-04-04
EP1735822A2 (en) 2006-12-27
US7246985B2 (en) 2007-07-24
US20070243049A1 (en) 2007-10-18
CN100437898C (zh) 2008-11-26
WO2006041530A2 (en) 2006-04-20

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