JP2007332453A5 - - Google Patents
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- Publication number
- JP2007332453A5 JP2007332453A5 JP2007043910A JP2007043910A JP2007332453A5 JP 2007332453 A5 JP2007332453 A5 JP 2007332453A5 JP 2007043910 A JP2007043910 A JP 2007043910A JP 2007043910 A JP2007043910 A JP 2007043910A JP 2007332453 A5 JP2007332453 A5 JP 2007332453A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- gas
- carboxylic acid
- film forming
- carboxylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007789 gas Substances 0.000 claims description 94
- 239000000758 substrate Substances 0.000 claims description 85
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 56
- 229910052760 oxygen Inorganic materials 0.000 claims description 54
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 53
- 150000007942 carboxylates Chemical class 0.000 claims description 53
- 239000001301 oxygen Substances 0.000 claims description 53
- 150000002736 metal compounds Chemical class 0.000 claims description 48
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 34
- 239000002184 metal Substances 0.000 claims description 27
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000010949 copper Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 23
- 229960004643 cupric oxide Drugs 0.000 claims description 18
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 claims description 16
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 14
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 claims description 12
- HFDWIMBEIXDNQS-UHFFFAOYSA-L copper;diformate Chemical compound [Cu+2].[O-]C=O.[O-]C=O HFDWIMBEIXDNQS-UHFFFAOYSA-L 0.000 claims description 12
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 claims description 12
- 229940112669 cuprous oxide Drugs 0.000 claims description 12
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 9
- 150000001734 carboxylic acid salts Chemical class 0.000 claims description 9
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000005749 Copper compound Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 150000001880 copper compounds Chemical class 0.000 claims description 8
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 claims description 8
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 7
- 235000019253 formic acid Nutrition 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 239000011247 coating layer Substances 0.000 claims description 4
- 235000019260 propionic acid Nutrition 0.000 claims description 4
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims description 4
- 229940005605 valeric acid Drugs 0.000 claims description 4
- 235000011054 acetic acid Nutrition 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 239000005751 Copper oxide Substances 0.000 claims description 2
- 229910000431 copper oxide Inorganic materials 0.000 claims description 2
- 239000002344 surface layer Substances 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 4
- 230000015572 biosynthetic process Effects 0.000 claims 4
- 230000008021 deposition Effects 0.000 claims 3
- -1 carboxylate salt Chemical class 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical group [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 claims 2
- 150000001735 carboxylic acids Chemical class 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 229910001923 silver oxide Inorganic materials 0.000 claims 1
- 150000003839 salts Chemical class 0.000 description 2
- 241000255925 Diptera Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- OTCVAHKKMMUFAY-UHFFFAOYSA-N oxosilver Chemical compound [Ag]=O OTCVAHKKMMUFAY-UHFFFAOYSA-N 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007043910A JP4936928B2 (ja) | 2006-05-16 | 2007-02-23 | 成膜方法および成膜装置、ならびに記憶媒体 |
| US11/747,647 US8029856B2 (en) | 2006-05-16 | 2007-05-11 | Film formation method and apparatus |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006136657 | 2006-05-16 | ||
| JP2006136657 | 2006-05-16 | ||
| JP2007043910A JP4936928B2 (ja) | 2006-05-16 | 2007-02-23 | 成膜方法および成膜装置、ならびに記憶媒体 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012019498A Division JP5436589B2 (ja) | 2006-05-16 | 2012-02-01 | 成膜装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007332453A JP2007332453A (ja) | 2007-12-27 |
| JP2007332453A5 true JP2007332453A5 (OSRAM) | 2010-03-18 |
| JP4936928B2 JP4936928B2 (ja) | 2012-05-23 |
Family
ID=38875285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007043910A Expired - Fee Related JP4936928B2 (ja) | 2006-05-16 | 2007-02-23 | 成膜方法および成膜装置、ならびに記憶媒体 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8029856B2 (OSRAM) |
| JP (1) | JP4936928B2 (OSRAM) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4964097B2 (ja) * | 2007-11-15 | 2012-06-27 | 東京エレクトロン株式会社 | 成膜方法および成膜装置、ならびに記憶媒体 |
| JP5145052B2 (ja) * | 2008-01-07 | 2013-02-13 | 東京エレクトロン株式会社 | 成膜方法および成膜装置、ならびに記憶媒体 |
| WO2009148959A2 (en) * | 2008-05-29 | 2009-12-10 | Lawrence Livermore National Security, Llc | Membranes with functionalized carbon nanotube pores for selective transport |
| JP5281856B2 (ja) * | 2008-09-16 | 2013-09-04 | 東京エレクトロン株式会社 | 成膜方法および成膜装置、ならびに記憶媒体 |
| CN101768730B (zh) * | 2009-01-05 | 2013-06-05 | 鸿富锦精密工业（深圳）有限公司 | 一种薄膜制备装置 |
| CN102498238B (zh) * | 2009-09-16 | 2015-04-22 | 日立化成工业株式会社 | 金属铜膜及其制造方法、金属铜图案及使用了其的导体布线、金属铜凸块、导热路径、粘合材料及液状组合物 |
| KR101651932B1 (ko) * | 2009-10-26 | 2016-08-30 | 한화케미칼 주식회사 | 카르복실산을 이용한 전도성 금속 박막의 제조방법 |
| WO2016057427A1 (en) | 2014-10-06 | 2016-04-14 | Lawrence Livermore National Security, Llc | Nanotube trans-membrane channels mimicking biological porins |
| US10541137B2 (en) * | 2018-06-01 | 2020-01-21 | Varian Semiconductor Equipment Associates, Inc. | Method and apparatus for non line-of-sight doping |
| KR102138149B1 (ko) * | 2019-08-29 | 2020-07-27 | 솔브레인 주식회사 | 박막 형성용 성장 억제제, 이를 이용한 박막 형성 방법 및 이로부터 제조된 반도체 기판 |
| US12311053B2 (en) | 2019-12-13 | 2025-05-27 | Lawrence Livermore National Security, Llc | Nanotube-vesicle compositions and uses thereof |
| JP2023539064A (ja) * | 2020-08-25 | 2023-09-13 | ジュソン エンジニアリング カンパニー リミテッド | 基板処理装置 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2745677B2 (ja) | 1989-05-18 | 1998-04-28 | 三菱瓦斯化学株式会社 | 銅張基板の製造法 |
| KR0137370B1 (ko) * | 1988-11-07 | 1998-04-27 | 니시가와 레이치 | 구리 도금된 수지 제품의 제조방법 |
| US6232150B1 (en) * | 1998-12-03 | 2001-05-15 | The Regents Of The University Of Michigan | Process for making microstructures and microstructures made thereby |
| KR100381742B1 (ko) * | 1999-06-30 | 2003-04-26 | 스미토모덴키고교가부시키가이샤 | Ⅲ-ⅴ족 질화물반도체의 성장방법 및 기상성장장치 |
| US7629017B2 (en) * | 2001-10-05 | 2009-12-08 | Cabot Corporation | Methods for the deposition of conductive electronic features |
| JP3771882B2 (ja) | 2002-04-30 | 2006-04-26 | 三菱重工業株式会社 | 金属膜作製装置及び金属膜作製方法 |
| US7522822B2 (en) * | 2004-01-06 | 2009-04-21 | Robert Trujillo | Halogen lamp assembly with integrated heat sink |
| JP4590402B2 (ja) * | 2004-04-30 | 2010-12-01 | 株式会社荏原製作所 | 基板の処理装置 |
| JP2007332422A (ja) * | 2006-06-15 | 2007-12-27 | Ebara Corp | 成膜方法及び成膜装置 |
-
2007
- 2007-02-23 JP JP2007043910A patent/JP4936928B2/ja not_active Expired - Fee Related
- 2007-05-11 US US11/747,647 patent/US8029856B2/en not_active Expired - Fee Related
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