JP2007205908A - 重量センサ - Google Patents

重量センサ Download PDF

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Publication number
JP2007205908A
JP2007205908A JP2006025455A JP2006025455A JP2007205908A JP 2007205908 A JP2007205908 A JP 2007205908A JP 2006025455 A JP2006025455 A JP 2006025455A JP 2006025455 A JP2006025455 A JP 2006025455A JP 2007205908 A JP2007205908 A JP 2007205908A
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JP
Japan
Prior art keywords
strain
insulating
paste
weight sensor
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006025455A
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English (en)
Inventor
Koichi Yuda
康一 油田
Hiroaki Ishida
裕昭 石田
Yukio Mizukami
行雄 水上
Masahiko Obayashi
正彦 大林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2006025455A priority Critical patent/JP2007205908A/ja
Priority to US12/160,960 priority patent/US7933127B2/en
Publication of JP2007205908A publication Critical patent/JP2007205908A/ja
Pending legal-status Critical Current

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    • H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

【課題】電極と絶縁層との熱膨張率の違いにより、焼成時に絶縁層にクラックが発生するということのない、製造時の歩留まりの向上した重量センサを提供することを目的とするものである。
【解決手段】複数の貫通孔１０を有し荷重により歪を生じる金属板（ステンレス板）からなる起歪体１２と、この起歪体１２の貫通孔１０の間に配置され歪量に応じて抵抗値が変化する４つの抵抗素子１４と、抵抗素子１４の両端部に接続した電極１６と、配線パターン１７を介して電極１６と結線された信号処理回路１８とを備え、抵抗素子１４および電極１６および配線パターン１７は起歪体１２上に配置した絶縁ガラスからなる絶縁層２０上に絶縁層２０とともに同時焼成して形成され、焼成前の電極１６および配線パターンは粒径が２．０μｍ〜１０．０μｍのＡｇ粒子を含有し、焼成前の絶縁層には１．０重量％〜３．０重量％の無機フィラーを添加した構成である。
【選択図】図１

Description

本発明は、車両用シート等の荷重を測定するための重量センサに関するものである。
以下、従来の重量センサについて説明する。
図５は従来の重量センサの平面図、図６は図５におけるＡ部の拡大断面図である。
図５、図６において、従来の重量センサは、複数の貫通孔１を有し荷重により歪を生じる金属板からなる起歪体２と、この起歪体２の貫通孔１の間に配置され歪量に応じて抵抗値が変化する抵抗素子３と、抵抗素子３の両端部に接続した電極４と、この電極４に結線された信号処理回路（図示せず）とを備えている。抵抗素子３および電極４は起歪体２上に配置した絶縁ガラスからなる絶縁層５上に設けている。
その製造方法は、荷重により歪を生じる金属板からなる起歪体２に、絶縁ガラスからなる絶縁層５を形成する工程と、歪量に応じて抵抗値が変化する抵抗素子３および抵抗素子３に接続した電極４とを絶縁層５上に形成する工程とを備えている。また、電極４および絶縁層５は、起歪体２上にガラス粒子を含有した絶縁ペーストを塗布するとともに、この絶縁ペースト上にＡｇ粒子を含有したＡｇペーストを塗布して、これら絶縁ペーストおよびＡｇペーストを同時焼成して形成する。
この重量センサを、例えば、車両用シートと床面部との間に取り付ければ、車両用シートに座る人員の荷重を測定することができる。起歪体２に設けた複数の貫通孔１の内、内側の貫通孔１に車両用シートの一部を挿入して起歪体２と車両用シートとを連結し、外側の貫通孔１に床面部の一部を挿入して起歪体２と床面部とを連結して取り付ける。そうすると、車両用シートに荷重が加わった際、起歪体２が歪んで抵抗素子３の抵抗値が変化するので、これを信号処理回路（図示せず）で処理することによって荷重を測定することができる。
なお、この出願の発明に関連する先行技術文献情報としては、例えば、特許文献１が知られている。
特開２００３−２４０６３３号公報
上記構成において、電極４および絶縁層５は、起歪体２上にガラス粒子を含有した絶縁ペーストを塗布するとともに、この絶縁ペースト上にＡｇ粒子を含有したＡｇペーストを塗布して、これら絶縁ペーストおよびＡｇペーストを同時焼成して形成されている。この焼成の際、電極４と絶縁層５の熱膨張率等の違いにより、電極４の方が絶縁層５よりも縮むため、図６に示すように、絶縁層５にクラック６が発生することとなり、その結果、絶縁層５にクラック６が発生していない良品のみ選別する必要が生じるから、重量センサの製造時の歩留まりが低下してしまうという課題を有していた。
本発明は上記問題点を解決するもので、電極と絶縁層との熱膨張率の違いにより、焼成時に絶縁層にクラックが発生するということのない、製造時の歩留まりの向上した重量センサを提供することを目的とするものである。
上記目的を達成するために本発明は、荷重により歪を生じる金属板からなる起歪体と、前記起歪体に配置され歪量に応じて抵抗値が変化する抵抗素子と、前記抵抗素子に接続した導体とを備え、前記抵抗素子および前記導体は前記起歪体上に配置した絶縁ガラスからなる絶縁層上に形成するとともに、前記導体および前記絶縁ガラスは同時焼成して形成しており、焼成前の前記導体は粒径が２．０μｍ〜１０．０μｍのＡｇ粒子を含有するとともに、焼成前の前記絶縁ガラスは無機フィラーを含有する構成である。
また、その製造方法は、荷重により歪を生じる金属板からなる起歪体に、絶縁ガラスからなる絶縁層を形成する工程と、歪量に応じて抵抗値が変化する抵抗素子および前記抵抗素子に接続した導体とを前記絶縁層上に形成する工程とを備え、前記絶縁層および前記導体は、前記起歪体上にガラス粒子と無機フィラーを含有した絶縁ペーストを塗布するとともに前記絶縁ペースト上にＡｇ粒子を含有したＡｇペーストを塗布し、前記絶縁ペーストと前記Ａｇペーストとを同時焼成して形成し、かつ、前記Ａｇペーストは粒径が２．０μｍ〜１０．０μｍのＡｇ粒子を含有する構成である。
上記構成により、焼成前の導体は粒径が２．０μｍ〜１０．０μｍのＡｇ粒子を含有するので、焼成時におけるＡｇ粒子の収縮速度を低下させることができるとともに、焼成前の絶縁ガラスは無機フィラーを含有するので、焼成時における流動性を低下させることができるため、電極が絶縁層よりも縮むということがなくなり、これにより、絶縁層にクラックが発生しなくなるから、製造時に絶縁層にクラックの発生していない良品のみを選別する必要がなくなり、その結果、歩留まりの向上した重量センサを提供することができるという効果を有するものである。
以下、本発明の実施の形態について図面を参照しながら説明する。
図１は本発明の一実施の形態における重量センサの平面図、図２は図１におけるＡ部の拡大断面図、図３は図１におけるＡ部の拡大斜視図、図４は同重量センサに用いる信号処理回路図である。
図１〜図４において、本発明の一実施の形態における重量センサは、複数の貫通孔１０を有し荷重により歪を生じる金属板（ステンレス板）からなる起歪体１２と、この起歪体１２の貫通孔１０の間に配置され歪量に応じて抵抗値が変化する４つの抵抗素子１４と、抵抗素子１４の両端部に接続した電極１６と、配線パターン１７を介して電極１６と結線された信号処理回路１８とを備えている。抵抗素子１４および電極１６は起歪体１２上に配置した絶縁ガラスからなる絶縁層２０上に同時焼成して形成されている。
また、その製造方法においては、荷重により歪を生じる金属板（ステンレス板）からなる起歪体１２上に絶縁ガラスからなる絶縁層２０を形成する工程と、歪量に応じて抵抗値が変化する抵抗素子１４およびこの抵抗素子１４に接続した導体からなる電極１６およびこの電極１６と信号処理回路１８を結線する導体からなる配線パターン１７とを絶縁層２０上に形成する工程とを備えている。絶縁層２０および導体を形成する工程では、起歪体１２上にガラス粒子を含有した絶縁ペーストを塗布する工程と、この絶縁ペースト上にＡｇ粒子を含有したＡｇペーストを塗布する工程と、塗布された絶縁ペーストおよびＡｇペーストを同時焼成する工程とを有する。ペーストとは金属粉末やガラス粉末や無機酸化物等を有機溶媒中に混練、分散させて液状にしたものであり、金属粉末の一つであるＡｇを含有したものが上記Ａｇペーストであり、絶縁性材料を含有したものが上記絶縁ペーストである。上記の同時焼成により、起歪体１２上には絶縁ガラスからなる絶縁層２０が形成され、絶縁層２０上には導体からなる電極１６および配線パターン１７が形成される。
このＡｇペーストは粒径が２．０μｍ〜１０．０μｍのＡｇ粒子を含有し、この絶縁ペーストには１．０重量％〜３．０重量％の無機フィラーを添加している。このＡｇ粒子の粒径および無機フィラーの割合は、所定の絶縁層２０の膜厚に対し、絶縁層２０と電極１６との境界部分、絶縁層２０と配線パターン１７との境界部分において、クラックの発生がない割合にて定めている。
絶縁ペーストに対する無機フィラー（アルミナ）の添加量が１．５重量％時において、絶縁層２０の膜厚とＡｇ粒子の平均粒径におけるクラック発生有無の関係は（表１）に示すとおりである。
Figure 2007205908
また、ＡｇペーストのＡｇ粒子の平均粒径がφ２．０μｍ時において、絶縁層２０の膜厚と無機フィラーの添加量におけるクラック発生有無の関係は（表２）に示すとおりである。
Figure 2007205908
この重量センサを、例えば、車両用シートと床面部との間に取り付ければ、車両用シートに座る人員の荷重を測定することができる。起歪体１２に設けた複数の貫通孔１０の内、内側の貫通孔１０に車両用シートの一部を挿入して起歪体１２と車両用シートとを連結し、外側の貫通孔１０に床面部の一部を挿入して起歪体１２と床面部とを連結して取り付ける。そうすると、車両用シートに荷重が加わった際、起歪体１２が歪んで抵抗素子１４の抵抗値が変化するので、これをＣＰＵ１９を有する信号処理回路１８で処理することによって荷重を測定することができる。信号処理回路１８としては、例えば、図４に示すように、４つの抵抗素子１４をホーイストンブリッジ回路２８で形成し、この出力信号をＣＰＵ１９で処理すればよい。
上記構成により、焼成前の導体であるＡｇペーストは粒径が２．０μｍ〜１０．０μｍのＡｇ粒子を含有するので、焼成時におけるＡｇ粒子の収縮速度を低下させることができ、また、焼成前の絶縁ガラスである絶縁ペーストは無機フィラーを含有するので、焼成時における流動性を低下させることができるとともに、焼成前の絶縁ガラスは無機フィラーを含有するので、焼成時における流動性を低下させることができるため、電極１６が絶縁層２０よりも縮むということがなくなり、これにより、絶縁層２０にクラックが発生しなくなるから、製造時に絶縁層２０にクラックの発生していない良品のみを選別する必要がなくなるという作用効果を有するものである。
すなわち、電極１６と絶縁層２０との境界部分におけるクラックの発生を防止して製造時の歩留まりを向上させることができる。さらに、焼成前の絶縁ガラスである絶縁ペーストに含有する無機フィラーの添加量は１．０重量％〜３．０重量％とすれば、的確にクラックの発生を防止できる。
以上のように本発明にかかる重量センサは、製造時の歩留まりの向上した重量センサを提供することができるという効果を有し、車両用シート等の荷重を測定するための重量センサ等に有用である。
本発明の一実施の形態における重量センサの平面図 図１におけるＡ部の拡大断面図 図１におけるＡ部の拡大斜視図 同重量センサに用いる信号処理回路図 従来の重量センサの平面図 図４におけるＡ部の拡大断面図
符号の説明
１０ 貫通孔
１２ 起歪体
１４ 抵抗素子
１６ 電極
１７ 配線パターン
１８ 信号処理回路
１９ ＣＰＵ
２０ 絶縁層
２８ ホーイストンブリッジ回路

Claims (4)

  1. 荷重により歪を生じる金属板からなる起歪体と、前記起歪体に配置され歪量に応じて抵抗値が変化する抵抗素子と、前記抵抗素子に接続した導体とを備え、前記抵抗素子および前記導体は前記起歪体上に配置した絶縁ガラスからなる絶縁層上に形成するとともに、前記導体および前記絶縁ガラスは同時焼成して形成しており、焼成前の前記導体は粒径が２．０μｍ〜１０．０μｍのＡｇ粒子を含有するとともに、焼成前の前記絶縁ガラスは無機フィラーを含有する重量センサ。
  2. 焼成前の前記絶縁ガラスに含有する無機フィラーの添加量は１．０重量％〜３．０重量％とした請求項１記載の重量センサ。
  3. 荷重により歪を生じる金属板からなる起歪体に、絶縁ガラスからなる絶縁層を形成する工程と、歪量に応じて抵抗値が変化する抵抗素子および前記抵抗素子に接続した導体とを前記絶縁層上に形成する工程とを備え、前記導体および前記絶縁層は、前記起歪体上にガラス粒子と無機フィラーを含有した絶縁ペーストを塗布するとともに前記絶縁ペースト上にＡｇ粒子を含有したＡｇペーストを塗布し、前記絶縁ペーストと前記Ａｇペーストとを同時焼成して形成し、かつ、前記Ａｇペーストは粒径が２．０μｍ〜１０．０μｍのＡｇ粒子を含有する重量センサの製造方法。
  4. 前記絶縁ペーストには１．０重量％〜３．０重量％の無機フィラーを添加する請求項３記載の重量センサの製造方法。
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