JP2007184588A - 頑丈なシャロー・トレンチ分離構造およびシャロー・トレンチ分離構造を形成する方法 - Google Patents
頑丈なシャロー・トレンチ分離構造およびシャロー・トレンチ分離構造を形成する方法 Download PDFInfo
- Publication number
- JP2007184588A JP2007184588A JP2006345124A JP2006345124A JP2007184588A JP 2007184588 A JP2007184588 A JP 2007184588A JP 2006345124 A JP2006345124 A JP 2006345124A JP 2006345124 A JP2006345124 A JP 2006345124A JP 2007184588 A JP2007184588 A JP 2007184588A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- dielectric material
- forming
- depositing
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76232—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
- H01L21/0214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being a silicon oxynitride, e.g. SiON or SiON:H
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02167—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon carbide not containing oxygen, e.g. SiC, SiC:H or silicon carbonitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/0217—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/3143—Inorganic layers composed of alternated layers or of mixtures of nitrides and oxides or of oxinitrides, e.g. formation of oxinitride by oxidation of nitride layers
- H01L21/3145—Inorganic layers composed of alternated layers or of mixtures of nitrides and oxides or of oxinitrides, e.g. formation of oxinitride by oxidation of nitride layers formed by deposition from a gas or vapour
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/3148—Silicon Carbide layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/318—Inorganic layers composed of nitrides
- H01L21/3185—Inorganic layers composed of nitrides of siliconnitrides
Abstract
【解決手段】これらのボイドは、誘電体材料をトレンチ内に形成した後、ウエット洗浄プロセス中に形成されることがある。コンフォーマルな窒化ケイ素層を、基板の上に、またボイド中に形成する。この窒化ケイ素層の除去後、ボイドは窒化ケイ素材料によって少なくとも部分的に充てんされている。
【選択図】図4
Description
窒化ケイ素層38およびパッド酸化物層36内に、開口部41を通して側壁47付きの開口部46を形成する。開口部46は、好ましくは酸素とC2F6および/またはCHF3などのフッ素含有ガス(フッ素含有ガスはシリコン基板30に対して選択的である)を用いるプラズマ・エッチング・プロセスにより形成される。
誘電体ライナ膜50をトレンチ48内に形成しまたは堆積させる。
一般的な慣行に従って、記載されているデバイスの様々なフィーチャは原寸に比例して示してはおらず、本発明にとって重要な特定のフィーチャを強調するように示してある。図面および明細書を通して、同じ参照文字は同じ要素を示す。
図1は、窒化ケイ素層38除去後のSTI構造55を示す。本発明の教示によれば、パッド酸化物層36が基板30の上に残っている。
Claims (10)
- シャロー・トレンチ分離構造を形成する方法であって、
半導体層内に開口部を形成する工程と、
前記開口部に誘電体材料を堆積させる工程と、
前記誘電体材料の上にコンフォーマルに材料を堆積させる工程と、
前記コンフォーマルな材料を除去する工程とを含み、
前記誘電体材料中に位置するボイドが、前記除去工程の後に、前記コンフォーマルな材料によって少なくとも部分的に充てんされている方法。 - 前記開口部内に前記誘電体材料を堆積させる前記工程が、前記開口部の側壁に隣接して低密度誘電体材料を堆積させる工程と、続いて前記開口部の残りの領域に高密度誘電体材料を堆積させる工程とを含み、前記高密度および低密度誘電体材料の界面に隣接して前記ボイドが形成されることがある、請求項1に記載の方法。
- 前記開口部内に前記誘電体材料を堆積させる前記工程が、
前記開口部の側壁に隣接して二酸化ケイ素ライナを堆積させる工程と、
前記ライナに隣接して低密度USG材料を堆積させる工程と、
前記開口部の残りの領域に高密度USG材料を堆積させる工程とを含み、
前記低密度および高密度USG材料の界面に隣接して前記ボイドが形成されることがある、請求項1に記載の方法。 - 前記コンフォーマルな材料を堆積させる前記工程が、前記半導体層の上面よりも上方に延びる前記誘電体材料の側壁に前記コンフォーマルな材料を堆積させる工程をさらに含む、請求項1に記載の方法。
- 前記コンフォーマルな材料を堆積させる前記工程が、窒化ケイ素、酸窒化ケイ素または炭化ケイ素を堆積させる工程を含む、請求項1に記載の方法。
- 集積回路内にシャロー・トレンチ分離構造を形成する方法であって、
半導体層を設ける工程と、
前記半導体層の上にパッド酸化物層を形成する工程と、
前記パッド酸化物層の上に窒化ケイ素層または酸窒化ケイ素層を含む第1材料層を形成する工程と、
前記パッド酸化物層および前記第1材料層内に第1の開口部を形成する工程と、
前記第1の開口部を通して前記半導体層をエッチングして前記半導体層内にトレンチを形成する工程と、
前記トレンチ内に誘電体第2材料層を形成する工程であって、前記第2材料層の形成中に、トレンチの側壁に隣接して低密度誘電体材料層を形成し、前記トレンチの残りの領域に高密度誘電体材料層を形成する工程と、
前記第1材料層を除去する工程と、
前記パッド酸化物層の上にコンフォーマルな第3材料層を形成する工程であって、前記低密度および高密度誘電体材料の界面に隣接して形成されていることがあるボイドが、前記第3材料層を除去する工程の後に、前記第3材料層によって少なくとも部分的に充てんされる工程とを含む方法。 - 前記第3材料層を除去する前記工程が、
酸素とフッ素含有ガスの混合物を用いたプラズマ・エッチング工程と
重合ガス、不活性ガスおよびフッ素含有ガスの混合物を用いたプラズマ・エッチング工程とをさらに含む、請求項6に記載の方法。 - 前記コンフォーマルな第3材料層を形成する前記工程が、窒化ケイ素層、酸窒化ケイ素層または炭化ケイ素層を形成する工程を含む、請求項7に記載の方法。
- 半導体層と、
前記半導体層内に形成されたデバイス分離構造であって、前記半導体層内のトレンチに配設された第1の誘電体材料を含み、前記トレンチの側壁に隣接する前記第1の誘電体材料中にボイドが存在することがあるデバイス分離構造と、
前記ボイド内の第2の誘電体材料とを備える集積回路構造。 - 前記半導体層の上面よりも上方に延びる前記第1の誘電体材料の上部領域が側壁を含み、前記第2の誘電体材料が前記上部領域の前記側壁上に堆積される、請求項9に記載の集積回路構造。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/321,206 | 2005-12-29 | ||
US11/321,206 US7514336B2 (en) | 2005-12-29 | 2005-12-29 | Robust shallow trench isolation structures and a method for forming shallow trench isolation structures |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007184588A true JP2007184588A (ja) | 2007-07-19 |
JP2007184588A5 JP2007184588A5 (ja) | 2011-01-13 |
JP5579358B2 JP5579358B2 (ja) | 2014-08-27 |
Family
ID=38068283
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006345124A Active JP5579358B2 (ja) | 2005-12-29 | 2006-12-22 | 頑丈なシャロー・トレンチ分離構造およびシャロー・トレンチ分離構造を形成する方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7514336B2 (ja) |
EP (1) | EP1806780A3 (ja) |
JP (1) | JP5579358B2 (ja) |
KR (1) | KR101292025B1 (ja) |
CN (1) | CN100501968C (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7514336B2 (en) * | 2005-12-29 | 2009-04-07 | Agere Systems Inc. | Robust shallow trench isolation structures and a method for forming shallow trench isolation structures |
US20110244683A1 (en) * | 2010-04-01 | 2011-10-06 | Michiaki Sano | Fabricating Voids Using Slurry Protect Coat Before Chemical-Mechanical Polishing |
CN103531519B (zh) * | 2012-07-02 | 2016-03-23 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构及其形成方法 |
US9768055B2 (en) | 2012-08-21 | 2017-09-19 | Stmicroelectronics, Inc. | Isolation regions for SOI devices |
US10468529B2 (en) * | 2017-07-11 | 2019-11-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Structure and formation method of semiconductor device structure with etch stop layer |
KR102661930B1 (ko) | 2018-08-13 | 2024-04-29 | 삼성전자주식회사 | 집적회로 소자 |
CN109273532B (zh) * | 2018-09-12 | 2022-03-11 | 上海华力微电子有限公司 | 应用于高压电路防静电保护的无回滞效应硅控整流器 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08330410A (ja) * | 1995-05-31 | 1996-12-13 | Sony Corp | 素子分離方法、素子分離構造、及び半導体装置 |
JPH11340313A (ja) * | 1998-05-07 | 1999-12-10 | Samsung Electronics Co Ltd | トレンチ隔離形成方法 |
JP2000058637A (ja) * | 1998-07-31 | 2000-02-25 | United Microelectronics Corp | 半導体基板に浅いトレンチ絶縁構造を形成する方法 |
JP2000223704A (ja) * | 1999-01-29 | 2000-08-11 | Sony Corp | 半導体装置およびその製造方法 |
US20010015046A1 (en) * | 1999-06-03 | 2001-08-23 | Hong Sug-Hun | Trench isolation method |
US6319794B1 (en) * | 1998-10-14 | 2001-11-20 | International Business Machines Corporation | Structure and method for producing low leakage isolation devices |
JP2004363486A (ja) * | 2003-06-06 | 2004-12-24 | Renesas Technology Corp | トレンチ分離を有する半導体装置およびその製造方法 |
JP2005166700A (ja) * | 2003-11-28 | 2005-06-23 | Toshiba Corp | 半導体装置及びその製造方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW388100B (en) * | 1997-02-18 | 2000-04-21 | Hitachi Ulsi Eng Corp | Semiconductor deivce and process for producing the same |
US6228741B1 (en) * | 1998-01-13 | 2001-05-08 | Texas Instruments Incorporated | Method for trench isolation of semiconductor devices |
WO1999044223A2 (en) * | 1998-02-27 | 1999-09-02 | Lsi Logic Corporation | Process of shallow trench isolating active devices to avoid sub-threshold kinks arising from corner effects without additional processing |
KR100286127B1 (ko) * | 1998-06-24 | 2001-04-16 | 윤종용 | 반도체 장치의 트렌치 격리 형성 방법 |
US6500729B1 (en) * | 2000-06-02 | 2002-12-31 | Agere Systems Guardian Corp. | Method for reducing dishing related issues during the formation of shallow trench isolation structures |
US6921947B2 (en) * | 2000-12-15 | 2005-07-26 | Renesas Technology Corp. | Semiconductor device having recessed isolation insulation film |
KR100568100B1 (ko) * | 2001-03-05 | 2006-04-05 | 삼성전자주식회사 | 트렌치형 소자 분리막 형성 방법 |
JP2003151956A (ja) * | 2001-11-19 | 2003-05-23 | Sony Corp | 半導体装置製造工程における窒化シリコン膜のエッチング方法 |
TW540135B (en) * | 2002-04-24 | 2003-07-01 | Nanya Technology Corp | Method of forming shallow trench isolation region |
KR20040002147A (ko) * | 2002-06-29 | 2004-01-07 | 주식회사 하이닉스반도체 | 반도체 소자의 소자분리막 형성방법 |
JP2004311487A (ja) * | 2003-04-02 | 2004-11-04 | Hitachi Ltd | 半導体装置の製造方法 |
KR100505419B1 (ko) * | 2003-04-23 | 2005-08-04 | 주식회사 하이닉스반도체 | 반도체 소자의 소자분리막 제조방법 |
KR100538811B1 (ko) * | 2003-12-29 | 2005-12-23 | 주식회사 하이닉스반도체 | 반도체 소자의 제조방법 |
US7514336B2 (en) * | 2005-12-29 | 2009-04-07 | Agere Systems Inc. | Robust shallow trench isolation structures and a method for forming shallow trench isolation structures |
-
2005
- 2005-12-29 US US11/321,206 patent/US7514336B2/en not_active Expired - Fee Related
-
2006
- 2006-09-06 EP EP06254630A patent/EP1806780A3/en not_active Withdrawn
- 2006-09-13 CN CNB2006101542012A patent/CN100501968C/zh not_active Expired - Fee Related
- 2006-12-22 JP JP2006345124A patent/JP5579358B2/ja active Active
- 2006-12-29 KR KR1020060137758A patent/KR101292025B1/ko not_active IP Right Cessation
-
2009
- 2009-01-21 US US12/356,600 patent/US8022481B2/en not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08330410A (ja) * | 1995-05-31 | 1996-12-13 | Sony Corp | 素子分離方法、素子分離構造、及び半導体装置 |
JPH11340313A (ja) * | 1998-05-07 | 1999-12-10 | Samsung Electronics Co Ltd | トレンチ隔離形成方法 |
JP2000058637A (ja) * | 1998-07-31 | 2000-02-25 | United Microelectronics Corp | 半導体基板に浅いトレンチ絶縁構造を形成する方法 |
US6319794B1 (en) * | 1998-10-14 | 2001-11-20 | International Business Machines Corporation | Structure and method for producing low leakage isolation devices |
JP2000223704A (ja) * | 1999-01-29 | 2000-08-11 | Sony Corp | 半導体装置およびその製造方法 |
US20010015046A1 (en) * | 1999-06-03 | 2001-08-23 | Hong Sug-Hun | Trench isolation method |
JP2004363486A (ja) * | 2003-06-06 | 2004-12-24 | Renesas Technology Corp | トレンチ分離を有する半導体装置およびその製造方法 |
JP2005166700A (ja) * | 2003-11-28 | 2005-06-23 | Toshiba Corp | 半導体装置及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20070152294A1 (en) | 2007-07-05 |
EP1806780A3 (en) | 2011-06-01 |
CN100501968C (zh) | 2009-06-17 |
US8022481B2 (en) | 2011-09-20 |
JP5579358B2 (ja) | 2014-08-27 |
US7514336B2 (en) | 2009-04-07 |
US20090127651A1 (en) | 2009-05-21 |
KR20070072408A (ko) | 2007-07-04 |
EP1806780A2 (en) | 2007-07-11 |
CN1992194A (zh) | 2007-07-04 |
KR101292025B1 (ko) | 2013-08-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7906407B2 (en) | Shallow trench isolation structures and a method for forming shallow trench isolation structures | |
JP5579358B2 (ja) | 頑丈なシャロー・トレンチ分離構造およびシャロー・トレンチ分離構造を形成する方法 | |
US6727150B2 (en) | Methods of forming trench isolation within a semiconductor substrate including, Tshaped trench with spacers | |
KR20070069405A (ko) | 반도체소자의 제조방법 | |
JP4401156B2 (ja) | 半導体素子の製造方法 | |
KR100935760B1 (ko) | 반도체 소자의 제조 방법 | |
KR100474863B1 (ko) | 반도체 소자의 소자 분리막 형성 방법 | |
KR100552852B1 (ko) | 얕은 트렌치 소자 분리 제조 방법 | |
KR100519517B1 (ko) | 반도체 소자의 소자 분리막 형성 방법 | |
KR20060075402A (ko) | 반도체 소자의 소자 분리막 형성 방법 | |
KR100905163B1 (ko) | 반도체소자의 제조방법 | |
KR100984854B1 (ko) | 반도체 소자의 소자분리막 형성방법 | |
KR100763679B1 (ko) | 반도체 소자의 포토레지스트 패턴 제거 방법 | |
KR100932336B1 (ko) | 플래시 메모리 소자의 소자 분리막 형성 방법 | |
KR100967672B1 (ko) | 반도체 소자의 얕은 트랜치 소자분리막 형성방법 | |
KR20030049604A (ko) | 반도체 소자의 소자 분리막 형성 방법 | |
KR20050014166A (ko) | 반도체소자의 제조방법 | |
KR20080061209A (ko) | 반도체 소자의 트렌치 형성 방법 | |
KR20040050554A (ko) | 반도체 소자의 소자 분리막 형성 방법 | |
KR20040060571A (ko) | Sti 에지 모트 방지방법 | |
KR20040058937A (ko) | 반도체 소자의 소자 분리막 및 그 형성 방법 | |
KR20040042562A (ko) | 얕은 트렌치 격리 공정 | |
KR20050012654A (ko) | 반도체 소자의 소자분리막 형성방법 | |
KR20030048211A (ko) | 반도체 소자의 콘택 플러그 형성방법 | |
JPH11251425A (ja) | 半導体集積回路装置およびその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091130 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20091130 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101115 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120911 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20121025 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130117 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130822 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20131122 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20131127 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131220 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20140227 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140624 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140709 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5579358 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20140807 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20140812 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: R3D02 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |