JP2007019403A5 - - Google Patents

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Publication number
JP2007019403A5
JP2007019403A5 JP2005201745A JP2005201745A JP2007019403A5 JP 2007019403 A5 JP2007019403 A5 JP 2007019403A5 JP 2005201745 A JP2005201745 A JP 2005201745A JP 2005201745 A JP2005201745 A JP 2005201745A JP 2007019403 A5 JP2007019403 A5 JP 2007019403A5
Authority
JP
Japan
Prior art keywords
wall portion
bottom wall
cavity
lid
side wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005201745A
Other languages
English (en)
Japanese (ja)
Other versions
JP4575247B2 (ja
JP2007019403A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2005201745A external-priority patent/JP4575247B2/ja
Priority to JP2005201745A priority Critical patent/JP4575247B2/ja
Priority to US11/367,460 priority patent/US7888797B2/en
Priority to KR1020060021767A priority patent/KR100721302B1/ko
Priority to EP06251239.7A priority patent/EP1753024B1/en
Priority to TW095107954A priority patent/TWI320298B/zh
Priority to CN200610058503XA priority patent/CN1897259B/zh
Publication of JP2007019403A publication Critical patent/JP2007019403A/ja
Publication of JP2007019403A5 publication Critical patent/JP2007019403A5/ja
Publication of JP4575247B2 publication Critical patent/JP4575247B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2005201745A 2005-07-11 2005-07-11 高周波パッケージ装置 Expired - Lifetime JP4575247B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2005201745A JP4575247B2 (ja) 2005-07-11 2005-07-11 高周波パッケージ装置
US11/367,460 US7888797B2 (en) 2005-07-11 2006-03-06 High frequency package device with internal space having a resonant frequency offset from frequency used
KR1020060021767A KR100721302B1 (ko) 2005-07-11 2006-03-08 고주파 패키지 장치
EP06251239.7A EP1753024B1 (en) 2005-07-11 2006-03-08 High frequency package device
TW095107954A TWI320298B (en) 2005-07-11 2006-03-09 High frequency package device
CN200610058503XA CN1897259B (zh) 2005-07-11 2006-03-10 高频封装装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005201745A JP4575247B2 (ja) 2005-07-11 2005-07-11 高周波パッケージ装置

Publications (3)

Publication Number Publication Date
JP2007019403A JP2007019403A (ja) 2007-01-25
JP2007019403A5 true JP2007019403A5 (cg-RX-API-DMAC7.html) 2008-05-29
JP4575247B2 JP4575247B2 (ja) 2010-11-04

Family

ID=37487672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005201745A Expired - Lifetime JP4575247B2 (ja) 2005-07-11 2005-07-11 高周波パッケージ装置

Country Status (6)

Country Link
US (1) US7888797B2 (cg-RX-API-DMAC7.html)
EP (1) EP1753024B1 (cg-RX-API-DMAC7.html)
JP (1) JP4575247B2 (cg-RX-API-DMAC7.html)
KR (1) KR100721302B1 (cg-RX-API-DMAC7.html)
CN (1) CN1897259B (cg-RX-API-DMAC7.html)
TW (1) TWI320298B (cg-RX-API-DMAC7.html)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5377096B2 (ja) 2008-09-08 2013-12-25 株式会社東芝 高周波パッケージ装置およびその製造方法
US20100091477A1 (en) * 2008-10-14 2010-04-15 Kabushiki Kaisha Toshiba Package, and fabrication method for the package
JP5171652B2 (ja) * 2009-01-06 2013-03-27 三菱電機株式会社 高周波モジュール
US7990223B1 (en) 2010-05-31 2011-08-02 Kabushiki Kaisha Toshiba High frequency module and operating method of the same
CN104041195B (zh) 2012-10-17 2016-12-21 华为技术有限公司 光电子器件
KR20150075347A (ko) 2013-12-25 2015-07-03 가부시끼가이샤 도시바 반도체 패키지, 반도체 모듈 및 반도체 디바이스
JP2015149649A (ja) 2014-02-07 2015-08-20 株式会社東芝 ミリ波帯用半導体パッケージおよびミリ波帯用半導体装置
JP5921586B2 (ja) * 2014-02-07 2016-05-24 株式会社東芝 ミリ波帯用半導体パッケージおよびミリ波帯用半導体装置
JP2015149650A (ja) 2014-02-07 2015-08-20 株式会社東芝 ミリ波帯用半導体パッケージおよびミリ波帯用半導体装置
JP6455402B2 (ja) 2015-11-16 2019-01-23 三菱電機株式会社 マイクロ波帯・ミリ波帯パッケージ
FR3066643B1 (fr) * 2017-05-16 2020-03-13 Stmicroelectronics (Grenoble 2) Sas Boitier electronique pourvu d'une fente locale formant un event
CN109887904A (zh) * 2019-04-16 2019-06-14 中国电子科技集团公司第十三研究所 一种毫米波芯片的封装结构及印刷电路板
CN110444511A (zh) * 2019-07-23 2019-11-12 中国科学技术大学 提高超导量子处理器谐振频率的封装盒体结构

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US6822541B2 (en) * 2002-04-25 2004-11-23 Kyocera Corporation Electromagnetic wave absorber and high-frequency circuit package using the same
JP3830430B2 (ja) * 2002-07-09 2006-10-04 京セラ株式会社 高周波回路用パッケージ蓋体及びその製造方法並びにこれを用いた高周波回路用パッケージ
JP2004111570A (ja) * 2002-09-17 2004-04-08 Kyocera Corp 高周波回路用パッケージ
JP2004214577A (ja) * 2003-01-09 2004-07-29 Mitsubishi Electric Corp マイクロ波集積回路実装ケース
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JP3829839B2 (ja) * 2003-11-14 2006-10-04 三菱電機株式会社 高周波パッケージ
GB0328246D0 (en) * 2003-12-04 2004-06-16 Qinetiq Ltd Improvements relating to electronic circuit packages
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JP4519637B2 (ja) * 2004-12-28 2010-08-04 株式会社東芝 半導体装置

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