FR3066643B1 - Boitier electronique pourvu d'une fente locale formant un event - Google Patents

Boitier electronique pourvu d'une fente locale formant un event Download PDF

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Publication number
FR3066643B1
FR3066643B1 FR1754298A FR1754298A FR3066643B1 FR 3066643 B1 FR3066643 B1 FR 3066643B1 FR 1754298 A FR1754298 A FR 1754298A FR 1754298 A FR1754298 A FR 1754298A FR 3066643 B1 FR3066643 B1 FR 3066643B1
Authority
FR
France
Prior art keywords
support plate
electronic chip
electronic box
box provided
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1754298A
Other languages
English (en)
Other versions
FR3066643A1 (fr
Inventor
Marika Sorrieul
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Grenoble 2 SAS
Original Assignee
STMicroelectronics Grenoble 2 SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics Grenoble 2 SAS filed Critical STMicroelectronics Grenoble 2 SAS
Priority to FR1754298A priority Critical patent/FR3066643B1/fr
Priority to US15/978,439 priority patent/US10651101B2/en
Publication of FR3066643A1 publication Critical patent/FR3066643A1/fr
Application granted granted Critical
Publication of FR3066643B1 publication Critical patent/FR3066643B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/04—Systems determining the presence of a target
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
    • G01S7/4813—Housing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Fire-Detection Mechanisms (AREA)
  • Toys (AREA)
  • Ignition Installations For Internal Combustion Engines (AREA)
  • Connection Or Junction Boxes (AREA)

Abstract

Boîtier comprenant une plaque de support (2) présentant une face avant ; au moins une puce électronique (6) montée sur la face avant de la plaque de support ; et un capot d'encapsulation (9) de la puce électronique, comprenant une paroi avant (10) s'étendant en avant de la puce électronique et une paroi périphérique (11) présentant un bord d'extrémité fixé sur une zone périphérique de la plaque de support, la plaque de support et le capot d'encapsulation délimitant au moins une chambre (13) dans laquelle est située la puce électronique ; au moins une fente locale (17) étant aménagée entre la paroi périphérique du capot d'encapsulation et la plaque de support et présentant une ouverture extérieure et une ouverture intérieure débouchant dans ladite chambre, de sorte à mettre en communication ladite chambre et l'extérieur.
FR1754298A 2017-05-16 2017-05-16 Boitier electronique pourvu d'une fente locale formant un event Expired - Fee Related FR3066643B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR1754298A FR3066643B1 (fr) 2017-05-16 2017-05-16 Boitier electronique pourvu d'une fente locale formant un event
US15/978,439 US10651101B2 (en) 2017-05-16 2018-05-14 Electronic package with a local slot forming an air-vent

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1754298A FR3066643B1 (fr) 2017-05-16 2017-05-16 Boitier electronique pourvu d'une fente locale formant un event
FR1754298 2017-05-16

Publications (2)

Publication Number Publication Date
FR3066643A1 FR3066643A1 (fr) 2018-11-23
FR3066643B1 true FR3066643B1 (fr) 2020-03-13

Family

ID=59409503

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1754298A Expired - Fee Related FR3066643B1 (fr) 2017-05-16 2017-05-16 Boitier electronique pourvu d'une fente locale formant un event

Country Status (2)

Country Link
US (1) US10651101B2 (fr)
FR (1) FR3066643B1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3061629A1 (fr) * 2017-01-03 2018-07-06 Stmicroelectronics (Grenoble 2) Sas Procede de fabrication d'un capot pour boitier electronique et boitier electronique comprenant un capot
FR3061628A1 (fr) 2017-01-03 2018-07-06 Stmicroelectronics (Grenoble 2) Sas Procede de fabrication d'un capot d'encapsulation pour boitier electronique et boitier electronique comprenant un capot
FR3061630B1 (fr) 2017-01-03 2021-07-09 St Microelectronics Grenoble 2 Procede de fabrication d'un capot pour boitier electronique et boitier electronique comprenant un capot
FR3066643B1 (fr) * 2017-05-16 2020-03-13 Stmicroelectronics (Grenoble 2) Sas Boitier electronique pourvu d'une fente locale formant un event
CN111013021A (zh) * 2019-12-06 2020-04-17 深圳市强生光电科技有限公司 一种用于理疗仪的球头灯源及其制备工艺
CN114530444A (zh) * 2022-02-21 2022-05-24 江苏长电科技股份有限公司 传感器封装结构及封装方法

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JPS598358Y2 (ja) * 1978-02-08 1984-03-15 京セラ株式会社 半導体素子パツケ−ジ
US4975762A (en) * 1981-06-11 1990-12-04 General Electric Ceramics, Inc. Alpha-particle-emitting ceramic composite cover
US5023398A (en) * 1988-10-05 1991-06-11 Olin Corporation Aluminum alloy semiconductor packages
TW238419B (fr) * 1992-08-21 1995-01-11 Olin Corp
US5317107A (en) * 1992-09-24 1994-05-31 Motorola, Inc. Shielded stripline configuration semiconductor device and method for making the same
US5635754A (en) * 1994-04-01 1997-06-03 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US6720493B1 (en) * 1994-04-01 2004-04-13 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
JP3378435B2 (ja) * 1995-09-29 2003-02-17 株式会社東芝 超高周波帯無線通信装置
US5990418A (en) * 1997-07-29 1999-11-23 International Business Machines Corporation Hermetic CBGA/CCGA structure with thermal paste cooling
JP2991172B2 (ja) * 1997-10-24 1999-12-20 日本電気株式会社 半導体装置
US6740959B2 (en) * 2001-08-01 2004-05-25 International Business Machines Corporation EMI shielding for semiconductor chip carriers
JP3922039B2 (ja) * 2002-02-15 2007-05-30 株式会社日立製作所 電磁波吸収材料及びそれを用いた各種製品
JP2003287420A (ja) * 2002-03-27 2003-10-10 Sharp Corp 測距センサおよびこれを備えた電子機器、測距センサの製造方法
JP4567954B2 (ja) * 2003-07-31 2010-10-27 三洋電機株式会社 半導体装置およびその製造方法
JP3829839B2 (ja) * 2003-11-14 2006-10-04 三菱電機株式会社 高周波パッケージ
JP3830495B2 (ja) * 2004-05-10 2006-10-04 シャープ株式会社 半導体装置、半導体装置の製造方法及び光学装置用モジュール
JP4598432B2 (ja) * 2004-05-12 2010-12-15 浜松ホトニクス株式会社 電子部品及びその製造方法
FR2877124B1 (fr) * 2004-10-22 2006-12-29 Schneider Electric Ind Sas Detecteur photoelectrique
JP4519637B2 (ja) * 2004-12-28 2010-08-04 株式会社東芝 半導体装置
JP4575247B2 (ja) * 2005-07-11 2010-11-04 株式会社東芝 高周波パッケージ装置
CN101387513B (zh) * 2008-08-28 2010-06-23 上海科勒电子科技有限公司 距离检测感应装置
US8125042B2 (en) * 2008-11-13 2012-02-28 Samsung Electronics Co., Ltd. Semiconductor package and method of manufacturing the same
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Also Published As

Publication number Publication date
US10651101B2 (en) 2020-05-12
FR3066643A1 (fr) 2018-11-23
US20180337104A1 (en) 2018-11-22

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