JP2006519501A - 印刷配線板上に予め塗布済みのアンダーフィル層を有するエリアアレイデバイスアセンブリ - Google Patents
印刷配線板上に予め塗布済みのアンダーフィル層を有するエリアアレイデバイスアセンブリ Download PDFInfo
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- JP2006519501A JP2006519501A JP2006503878A JP2006503878A JP2006519501A JP 2006519501 A JP2006519501 A JP 2006519501A JP 2006503878 A JP2006503878 A JP 2006503878A JP 2006503878 A JP2006503878 A JP 2006503878A JP 2006519501 A JP2006519501 A JP 2006519501A
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- area array
- array device
- underfill material
- underfill
- bumped
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Abstract
Description
本発明は、包括的には、集積回路パッケージング及び印刷回路板アセンブリに関する。本発明は、具体的には、予め塗布済みのアンダーフィル材料を有する印刷配線板に取り付けられるフリップチップなどのバンプ付きエリアアレイデバイスに関し、且つ、予め塗布済みのアンダーフィルを用いて回路板上にフリップチップアセンブリを作製する方法に関する。
米国政府は、本発明におけるペイドアップライセンスを有しており、且つ、限定された状況で、米国標準技術局によって授与された契約書第NIST−ATP 70NANB8H4007号の諸条項により規定されるような適当な条件で他者にライセンスを供与することを特許権者に求める権利を有する。
バンプ付き集積回路を基板に接合するために、一般的に、チップ又は電気基板上にフラックスが配置され、次いでICが基板上に配置される。このアセンブリは、はんだリフロー熱サイクルにかけられて、バンプを溶解させ、チップを基板にはんだ付けする。はんだの表面張力は、チップが基板パッドに自己整合するのに役立つ。チップのアンダーフィル封止は、一般的に、リフローの後に続く。
くしつつ、PWBへの確実な電気的且つ機械的なダイ取付けを可能にするPWBなどの下にある電気基板にバンプ付きフリップチップなどのエリアアレイデバイスを直接取り付けるパッケージング技術を所有することは有利なはずである。このパッケージング技術は、電気基板にバンプ付きデバイスを有効にボンディングして、高度に信頼性のある電気的相互接続、並びに確実なダイボンディング、バンプの応力緩和、及び環境からの有効な保護のための保護アンダーフィル材料を可能にするはずである。さらに、この技術は、はんだバンプにプリコート材料を必要としないはずであり、バンプ認識の課題をなくすはずであり、且つ、リフローの際の位置合わせを維持するために一般的に必要とされる追加の仮接着するステップをなくすはずである。
本発明の1態様は、バンプ付きフリップチップなどのバンプ付きエリアアレイデバイスを電気基板に取り付ける方法を提供する。アンダーフィル材料が電気基板の一部分に塗布される。塗布済みアンダーフィル材料は、アンダーフィル材料ステージ温度まで加熱される。相互接続表面とこの相互接続表面から延びる複数の接続バンプとを備えるバンプ付きエリアアレイデバイスが設けられる。バンプ付きエリアアレイデバイスの相互接続表面が塗布済みアンダーフィル材料の近くに位置決めされる。バンプ付きエリアアレイデバイスが加熱され、電気基板に接続バンプを電気的に接続させ、バンプの周囲にアンダーフィル材料が流動する。
と、電気基板150の表面に塗布したアンダーフィル材料140とを備える。はんだマスク160は電気基板150の表面に塗布することもできる。
面から延びる複数の接続バンプに対応する複数の開口を電気基板150上の一組のパッド152の上に備えることができる。パッド152を有する電気基板150は、いくつかの電気的トレース、コンタクト開口、ビア、誘電体層、電気基板150の表面上の基準点及び表示も備えることができるが、本発明を説明する際、簡略化のために示さない。電気基板150は、相互接続トレースとバンプ付きデバイスを電気基板150に電気的に接続するための基板パッド152とのアレイを含むことができる。パッド152を、バンプ付きデバイス上の接続バンプに対応させて、バンプ付きデバイス及び電気基板150を組み立てるとき、パッド152が対応する接続バンプに電気的に接続されるようにする。電気基板150は、電気基板150にボンディングした、又は電気基板150上に形成した、1つ又は複数のアクティブデバイス及び受動デバイスを含むことができる。
電子部品、又は一組の接続バンプ120を含むバンプ付き電子パッケージであってもよい。バンプ付きエリアアレイデバイス110は、多数のアクティブ部品、受動部品、又はそれらの任意の組合せを含むことができる。バンプ付きエリアアレイデバイス110は、たとえば、フリップチップとして構成され、又はセラミックボールグリッドアレイパッケージ内に構成された、抵抗器、コンデンサ、トランジスタ、などの電子部品を含むことができる。これらの部品は、1つ又は複数の集積回路を含むことができるバンプ付きエリアアレイデバイス110内に一体化させることができる。簡略化のために示さないが、バンプ付きエリアアレイデバイス110は、一組の電気的相互接続トレースと、パッドと、ビアと、導電層と、絶縁層とを備えることができる。
0上の接続バンプ120は、電気基板150上のパッド152に対応する予め塗布済みのアンダーフィル材料140中の穴又は窓を貫通して配置される。接着剤を用いて、バンプ付きエリアアレイデバイス110を電気基板150に一時的に取り付けることができる。たとえば、塗布したフラックスは接着剤の働きをすることができ、あるいは、バンプ付きエリアアレイデバイス110又は電気基板150を加熱してアンダーフィル材料140を軟化させ、且つ接着のための粘着性表面をもたらすことができる。バンプ付きデバイス及び他の部品を電気基板150上に位置決めした後で、このアセンブリを赤外炉、又は対流炉、又は強制空気炉中に送り、フリップチップ及び他の部品を加熱してそれらを電気基板150に電気的に接続することができる。バンプ付きデバイス上のはんだバンプ又ははんだボールは溶融し、且つ電気基板150にはんだ付けされる。アンダーフィル材料140は、接続バンプ120の側面122の周囲で軟化し且つ流動することができる。アンダーフィル材料140は、加熱すると、バンプ付きエリアアレイデバイス110の相互接続表面112を濡らして接着性を向上させることができる。同様に、アンダーフィル材料140は、加熱すると、電気基板150を濡らして接着性を向上させることができる。あるいは、バンプ付きエリアアレイデバイス110を局所的に加熱し、電気基板に押し付けて接続バンプをリフローさせ、且つ接続バンプ120の側面122の周囲にアンダーフィル材料140を流動させることもできる。
を使用しない。別の実施形態では、このアンダーフィル材料は、たとえば、パッド上に未充填で且つフラキシングなアンダーフィル材料を有する充填アンダーフィル材料を用いて選択的に塗布した2つの別個の材料からなる。
ンプ付きエリアアレイデバイス310の端部の下にはみ出して重なり、上に一部重なり、又は完全に重なることができる。
4に取り付けられた接続バンプ420を備える。はんだマスク460は、予め塗布済みのアンダーフィル材料440と電気基板450との間に位置決めされる。この実施形態では、はんだペースト又はフラックス層430は、電気基板450のパッド452上に位置決めされて、電気基板450にバンプ付きフリップチップや他のバンプ付きデバイスなどのバンプ付きエリアアレイデバイス410を接続するのに役立つ。フラックスを使用するとき、フラックスはパッド452を越えて延びる表面区域に塗布することができる。バンプ付きエリアアレイデバイス410を加熱して、電気基板450に接続バンプ420を電気的に接続し、且つ、バンプ付きエリアアレイデバイス収容領域から電気基板450上に予め塗布済みのアンダーフィル材料440を流動させる。アンダーフィル材料440は、加熱すると接続バンプ420の周囲に流動する。アンダーフィル材料440は、応力緩和及び水分浸透バリアをもたらして、電気基板450にバンプ付きエリアアレイデバイス410を固定する。リフロー後、電気基板450を個々のダイに切断することができる。
マザーボード、セラミック基板、混成回路基板、集積回路パッケージ、リードフレーム、半導体基板、ポリイミドテープ、屈曲回路、高密度相互接続ボード、又は電子モジュールなどの電気基板550を備える。この実施形態では、電気基板550は予め塗布済みのアンダーフィル材料540を含み、この予め塗布済みのアンダーフィル材料540はパターン付きアンダーフィル膜を備える。このパターン付きアンダーフィル膜は、フラキシングアンダーフィルを有する第1の部分542と、充填アンダーフィルを有する第2の部分544とを備える。フラキシングアンダーフィルを有する第1の部分542は、一般的に、電気基板550上の各パッド552に隣接して配置されて、はんだボール又ははんだバンプの取付けに役立つ。パターン付きアンダーフィル膜の第1の部分542は、バンプ付きエリアアレイデバイス510を加熱して電気基板550上のパッド552に接続バンプ520を電気的に接続するとき、電気基板550上のパッド552の表面を洗浄し且つ還元するはんだフラックスを含む。パターン付きアンダーフィル膜の第1の部分542は、一般的には、フィラーは含まないが、改善した熱膨張係数整合のためのフィラーを含むことができる。1実施形態では、パターン付きアンダーフィル膜の第2の部分544は、フラキシングではないが、熱膨張係数整合を改善させるためのフィラーを含む。
ージの場合、電気基板上のパッケージフットプリントを完全に覆う必要はない。
気基板との間の領域をポンプ排気して閉じ込められた空気を除去し、電気基板に対してパターン付きアンダーフィル膜をしっかり固定することによって、並びに、パターン付きアンダーフィル膜及び電気基板を積層温度まで加熱することによって積層することができる。電気基板及びパターン付きアンダーフィル膜は、通常60℃と100℃の間の積層温度まで加熱される。裏打ち層はパターン付きアンダーフィル膜から除去され、アンダーフィル材料層は電気基板に積層したままである。この裏打ち層は、それをアンダーフィル材料及び電気基板から剥ぎ取り、又は他の方法で分離することによって除去することができる。
れることができ、あるいは、ニードル定量供給、ピン転写によって、もしくはスクリーン付きマスク、ステンシル、又は他のパターン付きマスクを用いて電気基板の選択したパッドに局所的に塗布することができる。このフラックス層は、バンプ付きデバイスのアクティブ側又は電気基板の選択した区域に吹き付けることによって塗布することができる。あるいは、このフラックス層は、フラックス浴又はフラックス溶液内に電気基板又はバンプ付きエリアアレイデバイスを浸漬させ、その後乾燥させることによって塗布することができる。いくつかの例では、このフラックス層は、アンダーフィル材料を塗布する前に塗布することができる。代替実施形態では、フラキシングアンダーフィル材料を用いて、それによって別個のフラックス層の必要性をなくす。別の実施形態では、たとえば、バンプ及びパッドに酸化しない金属を用いるとき、又はバンプを電気基板上のパッドにサーモソニックボンディングするときはフラックス層を塗布しない。
Claims (5)
- エリアアレイデバイスを電気基板に取り付ける方法であって、
該電気基板の一部分にアンダーフィル材料を塗布するステップと、
該塗布済みアンダーフィル材料をアンダーフィル材料ステージ温度まで加熱するステップと、
相互接続表面と該相互接続表面から延びる複数の接続バンプとを備えるバンプ付きエリアアレイデバイスを設けるステップと、
前記バンプ付きエリアアレイデバイスの前記相互接続表面を前記塗布済みアンダーフィル材料の近くに位置決めするステップと、
前記バンプ付きエリアアレイデバイスを加熱して、前記電気基板に前記接続バンプを電気的に接続させるステップと
前記バンプの周囲に前記アンダーフィル材料を流動させるステップとを備える、エリアアレイデバイスを電気基板に取り付ける方法。 - 前記アンダーフィル材料を塗布するステップは、
前記電気基板に接してパターン付きアンダーフィル膜を位置決めするステップ、及び
該パターン付きアンダーフィル膜を前記電気基板に押し付けるステップを備える、請求項1に記載のエリアアレイデバイスを電気基板に取り付ける方法。 - 前記パターン付きアンダーフィル膜は、フラキシングアンダーフィルを有する第1の部分と充填アンダーフィルを有する第2の部分とを備える、請求項2に記載のエリアアレイデバイスを電気基板に取り付ける方法。
- バンプ付きエリアアレイデバイスアセンブリであって、
アクティブ表面及び該アクティブ表面から延びる複数の接続バンプを備えるバンプ付きフリップチップと、
フリップチップ収容領域で予め塗布済みのアンダーフィル材料を備える電気基板とを備え、
前記フリップチップを加熱して前記電気基板に前記接続バンプを電気的に接続し、且つ、前記電気基板に前記フリップチップを固定するように前記フリップチップ収容領域から前記接続バンプの周囲に前記アンダーフィル材料を流動させる、バンプ付きエリアアレイデバイスアセンブリ。 - 予め塗布済みのアンダーフィル材料を有する印刷配線板パネルであって、
複数のフリップチップ収容領域で予め塗布済みのアンダーフィル材料を表面上に設けた単層又は多層の印刷回路板を備え、
前記フリップチップ収容領域は、フリップチップアセンブリの際にフリップチップの配置を指示する、印刷配線板パネル。
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Also Published As
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WO2004077527A3 (en) | 2004-12-02 |
TW200501339A (en) | 2005-01-01 |
WO2004077527A2 (en) | 2004-09-10 |
US6821878B2 (en) | 2004-11-23 |
KR20050105499A (ko) | 2005-11-04 |
MY137390A (en) | 2009-01-30 |
JP4809761B2 (ja) | 2011-11-09 |
TWI334634B (en) | 2010-12-11 |
US20040169275A1 (en) | 2004-09-02 |
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