ATE514194T1 - System und verfahren zum herstellen eines solarzellen-arrays - Google Patents
System und verfahren zum herstellen eines solarzellen-arraysInfo
- Publication number
- ATE514194T1 ATE514194T1 AT06809889T AT06809889T ATE514194T1 AT E514194 T1 ATE514194 T1 AT E514194T1 AT 06809889 T AT06809889 T AT 06809889T AT 06809889 T AT06809889 T AT 06809889T AT E514194 T1 ATE514194 T1 AT E514194T1
- Authority
- AT
- Austria
- Prior art keywords
- substantially large
- contact surface
- soldering material
- terminal
- area contact
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000005476 soldering Methods 0.000 abstract 6
- 239000000463 material Substances 0.000 abstract 5
- 238000000151 deposition Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 239000011800 void material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1178—Means for venting or for letting gases escape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Photovoltaic Devices (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US73986805P | 2005-11-25 | 2005-11-25 | |
PCT/IL2006/001340 WO2007060657A1 (en) | 2005-11-25 | 2006-11-21 | System and method for producing a solar cell array |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE514194T1 true ATE514194T1 (de) | 2011-07-15 |
Family
ID=37833576
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT06809889T ATE514194T1 (de) | 2005-11-25 | 2006-11-21 | System und verfahren zum herstellen eines solarzellen-arrays |
Country Status (6)
Country | Link |
---|---|
US (1) | US20090242023A1 (de) |
EP (1) | EP2005487B1 (de) |
KR (1) | KR101367773B1 (de) |
AT (1) | ATE514194T1 (de) |
ES (1) | ES2366922T3 (de) |
WO (1) | WO2007060657A1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101055558B1 (ko) * | 2010-01-11 | 2011-08-08 | 삼성전기주식회사 | 방열기판 및 그 제조방법 |
ES2661770T3 (es) * | 2010-02-25 | 2018-04-03 | Saint-Augustin Canada Electric Inc. | Conjunto de células solares |
EP2362432B1 (de) * | 2010-02-25 | 2017-06-07 | Saint-Augustin Canada Electric Inc. | Solarzellenanordnung |
WO2015026483A1 (en) * | 2013-08-21 | 2015-02-26 | Gtat Corporation | Using an active solder to couple a metallic article to a photovoltaic cell |
AT516750B1 (de) | 2014-12-18 | 2016-08-15 | Zizala Lichtsysteme Gmbh | Verfahren zur Voidreduktion in Lötstellen |
EP3297410A1 (de) * | 2016-09-19 | 2018-03-21 | ZF Friedrichshafen AG | Lötschablone und verfahren zur herstellung einer leitrplattenanordnung |
KR20240030512A (ko) * | 2022-08-31 | 2024-03-07 | 한화솔루션 주식회사 | 태양전지 모듈 제조용 태빙 장치 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4836861A (en) * | 1987-04-24 | 1989-06-06 | Tactical Fabs, Inc. | Solar cell and cell mount |
JP2795788B2 (ja) * | 1993-02-18 | 1998-09-10 | シャープ株式会社 | 半導体チップの実装方法 |
US5410449A (en) * | 1993-05-24 | 1995-04-25 | Delco Electronics Corp. | Heatsink conductor solder pad |
US5460659A (en) * | 1993-12-10 | 1995-10-24 | Spectrolab, Inc. | Concentrating photovoltaic module and fabrication method |
JP3054056B2 (ja) * | 1995-04-24 | 2000-06-19 | 株式会社日立製作所 | はんだ付け方法 |
EP0831533A1 (de) * | 1996-09-16 | 1998-03-25 | Rockwell International Corporation | Verbundstruktur in einer Bildebene-Matrix zum Kompensieren der Verformung |
EP1025587A4 (de) * | 1997-07-21 | 2000-10-04 | Aguila Technologies Inc | Halbleiter-flipchippackung und herstellungsverfahren dafür |
JP3965795B2 (ja) * | 1998-08-24 | 2007-08-29 | 株式会社デンソー | 電子部品の半田付け方法 |
US6048656A (en) * | 1999-05-11 | 2000-04-11 | Micron Technology, Inc. | Void-free underfill of surface mounted chips |
EP1182709A1 (de) * | 2000-08-14 | 2002-02-27 | IPU, Instituttet For Produktudvikling | Verfahren zur Abscheidung von Metallkontakten auf einer Solarzelle mit vergrabenem Gitter und so hergestellte Solarzelle |
US6395972B1 (en) * | 2000-11-09 | 2002-05-28 | Trw Inc. | Method of solar cell external interconnection and solar cell panel made thereby |
US6476314B2 (en) * | 2001-03-20 | 2002-11-05 | The Boeing Company | Solar tile and associated method for fabricating the same |
US6803514B2 (en) * | 2001-03-23 | 2004-10-12 | Canon Kabushiki Kaisha | Mounting structure and mounting method of a photovoltaic element, mounting substrate for mounting a semiconductor element thereon and method for mounting a semiconductor element on said mounting substrate |
JP2003234433A (ja) * | 2001-10-01 | 2003-08-22 | Matsushita Electric Ind Co Ltd | 半導体装置、半導体装置の実装方法、ならびに実装体およびその製造方法 |
US6821878B2 (en) * | 2003-02-27 | 2004-11-23 | Freescale Semiconductor, Inc. | Area-array device assembly with pre-applied underfill layers on printed wiring board |
-
2006
- 2006-11-21 KR KR1020087015333A patent/KR101367773B1/ko active IP Right Grant
- 2006-11-21 ES ES06809889T patent/ES2366922T3/es active Active
- 2006-11-21 AT AT06809889T patent/ATE514194T1/de not_active IP Right Cessation
- 2006-11-21 EP EP06809889A patent/EP2005487B1/de not_active Not-in-force
- 2006-11-21 WO PCT/IL2006/001340 patent/WO2007060657A1/en active Application Filing
- 2006-11-21 US US12/094,904 patent/US20090242023A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20090242023A1 (en) | 2009-10-01 |
ES2366922T3 (es) | 2011-10-26 |
EP2005487A1 (de) | 2008-12-24 |
KR20080100334A (ko) | 2008-11-17 |
WO2007060657A1 (en) | 2007-05-31 |
KR101367773B1 (ko) | 2014-02-27 |
EP2005487B1 (de) | 2011-06-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |