JP2006517612A5 - - Google Patents

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Publication number
JP2006517612A5
JP2006517612A5 JP2006500812A JP2006500812A JP2006517612A5 JP 2006517612 A5 JP2006517612 A5 JP 2006517612A5 JP 2006500812 A JP2006500812 A JP 2006500812A JP 2006500812 A JP2006500812 A JP 2006500812A JP 2006517612 A5 JP2006517612 A5 JP 2006517612A5
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JP
Japan
Prior art keywords
metal powder
sputtering target
target assembly
powder
ppm
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JP2006500812A
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English (en)
Japanese (ja)
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JP2006517612A (ja
JP5006030B2 (ja
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Priority claimed from PCT/US2004/000270 external-priority patent/WO2004064114A2/en
Publication of JP2006517612A publication Critical patent/JP2006517612A/ja
Publication of JP2006517612A5 publication Critical patent/JP2006517612A5/ja
Application granted granted Critical
Publication of JP5006030B2 publication Critical patent/JP5006030B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2006500812A 2003-01-07 2004-01-07 粉末冶金スパッタリングターゲット及びその製造方法 Expired - Fee Related JP5006030B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US43846503P 2003-01-07 2003-01-07
US60/438,465 2003-01-07
PCT/US2004/000270 WO2004064114A2 (en) 2003-01-07 2004-01-07 Powder metallurgy sputtering targets and methods of producing same

Publications (3)

Publication Number Publication Date
JP2006517612A JP2006517612A (ja) 2006-07-27
JP2006517612A5 true JP2006517612A5 (cg-RX-API-DMAC7.html) 2007-03-01
JP5006030B2 JP5006030B2 (ja) 2012-08-22

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JP2006500812A Expired - Fee Related JP5006030B2 (ja) 2003-01-07 2004-01-07 粉末冶金スパッタリングターゲット及びその製造方法

Country Status (5)

Country Link
US (3) US7067197B2 (cg-RX-API-DMAC7.html)
EP (1) EP1585844B1 (cg-RX-API-DMAC7.html)
JP (1) JP5006030B2 (cg-RX-API-DMAC7.html)
TW (1) TWI341337B (cg-RX-API-DMAC7.html)
WO (1) WO2004064114A2 (cg-RX-API-DMAC7.html)

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JP6293928B2 (ja) * 2015-05-22 2018-03-14 Ｊｘ金属株式会社 タンタルスパッタリングターゲット及びその製造方法
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