JP2006316078A - 接着テープの剥離方法及び剥離装置 - Google Patents

接着テープの剥離方法及び剥離装置 Download PDF

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Publication number
JP2006316078A
JP2006316078A JP2003357168A JP2003357168A JP2006316078A JP 2006316078 A JP2006316078 A JP 2006316078A JP 2003357168 A JP2003357168 A JP 2003357168A JP 2003357168 A JP2003357168 A JP 2003357168A JP 2006316078 A JP2006316078 A JP 2006316078A
Authority
JP
Japan
Prior art keywords
tape
peeling
adhesive tape
adhesive
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003357168A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006316078A5 (enExample
Inventor
Takeshi Akechi
武志 明地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2003357168A priority Critical patent/JP2006316078A/ja
Priority to EP04792118A priority patent/EP1679276A1/de
Priority to CN200480030449.7A priority patent/CN1867506A/zh
Priority to PCT/JP2004/014820 priority patent/WO2005037698A1/ja
Priority to US10/575,682 priority patent/US20070074822A1/en
Priority to TW093131460A priority patent/TW200518934A/zh
Publication of JP2006316078A publication Critical patent/JP2006316078A/ja
Publication of JP2006316078A5 publication Critical patent/JP2006316078A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004—Component parts, details or accessories; Auxiliary operations
    • B29C63/0013—Removing old coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/002—Web delivery apparatus, the web serving as support for articles, material or another web
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/19—Specific article or web
    • B65H2701/192—Labels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H01L2221/68395—Separation by peeling using peeling wheel
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2003357168A 2003-10-17 2003-10-17 接着テープの剥離方法及び剥離装置 Pending JP2006316078A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2003357168A JP2006316078A (ja) 2003-10-17 2003-10-17 接着テープの剥離方法及び剥離装置
EP04792118A EP1679276A1 (de) 2003-10-17 2004-10-07 Klebebandabziehvorrichtung
CN200480030449.7A CN1867506A (zh) 2003-10-17 2004-10-07 粘接带剥离装置
PCT/JP2004/014820 WO2005037698A1 (ja) 2003-10-17 2004-10-07 接着テープの剥離装置
US10/575,682 US20070074822A1 (en) 2003-10-17 2004-10-07 Apparatus for peeling adhesive tape
TW093131460A TW200518934A (en) 2003-10-17 2004-10-15 Adhesive tape peeling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003357168A JP2006316078A (ja) 2003-10-17 2003-10-17 接着テープの剥離方法及び剥離装置

Publications (2)

Publication Number Publication Date
JP2006316078A true JP2006316078A (ja) 2006-11-24
JP2006316078A5 JP2006316078A5 (enExample) 2007-01-18

Family

ID=34463238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003357168A Pending JP2006316078A (ja) 2003-10-17 2003-10-17 接着テープの剥離方法及び剥離装置

Country Status (6)

Country Link
US (1) US20070074822A1 (enExample)
EP (1) EP1679276A1 (enExample)
JP (1) JP2006316078A (enExample)
CN (1) CN1867506A (enExample)
TW (1) TW200518934A (enExample)
WO (1) WO2005037698A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012081650A (ja) * 2010-10-12 2012-04-26 Nitto Denko Corp 両面粘着テープ貼付け方法および両面粘着テープ貼付け装置
JP2014141612A (ja) * 2013-01-25 2014-08-07 Lintec Corp 分離装置及び分離方法
US9278568B2 (en) 2013-11-06 2016-03-08 Casio Computer Co., Ltd. Stamp-face forming apparatus, method of forming a stamp face, and stamp-face forming system

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007109927A (ja) * 2005-10-14 2007-04-26 Tokyo Seimitsu Co Ltd 表面保護フィルム剥離方法および表面保護フィルム剥離装置
JP4262232B2 (ja) * 2005-10-17 2009-05-13 リンテック株式会社 測定装置
JP4884075B2 (ja) 2006-05-22 2012-02-22 株式会社東京精密 テープ貼付方法およびテープ貼付装置
DE102008000461B3 (de) * 2008-02-29 2009-07-30 Foliotec Gmbh Verfahren und Vorrichtung zum Abziehen einer Folie von einem plattenartigen Trägern oder einer Folie
JP5075084B2 (ja) * 2008-10-16 2012-11-14 日東電工株式会社 保護テープ貼付け方法および保護テープ貼付け装置
WO2010121068A2 (en) * 2009-04-16 2010-10-21 Suss Microtec, Inc. Improved apparatus for temporary wafer bonding and debonding
JP5547954B2 (ja) * 2009-12-14 2014-07-16 日東電工株式会社 粘着テープ剥離方法およびその装置
JP2011204806A (ja) * 2010-03-24 2011-10-13 Nitto Denko Corp ウエハの加工方法
US8574398B2 (en) 2010-05-27 2013-11-05 Suss Microtec Lithography, Gmbh Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers
US8921130B2 (en) * 2012-03-14 2014-12-30 Osram Sylvania Inc. Methods for producing and placing wavelength converting structures
JP5591859B2 (ja) * 2012-03-23 2014-09-17 株式会社東芝 基板の分離方法及び分離装置
CN104823080B (zh) * 2012-07-26 2017-06-16 3M创新有限公司 可热脱粘的光学制品
EP2877547A4 (en) * 2012-07-26 2016-01-27 3M Innovative Properties Co HEAT-RESOLVABLE ADHESIVES
DE102012020095B4 (de) * 2012-10-12 2016-05-19 Cotesa Gmbh Trenneinrichtung
CN106469767B (zh) * 2015-08-18 2017-12-01 江苏诚睿达光电有限公司 一种基于串联滚压的有机硅树脂光转换体贴合封装led的装备系统
JP6670683B2 (ja) * 2016-06-07 2020-03-25 株式会社Ｓｃｒｅｅｎラミナテック キャリア基板と樹脂層からなるワークの分離方法および分離装置
EP3546952B1 (en) * 2018-03-26 2024-03-06 Roche Diagnostics GmbH Method for unsealing an opening of a laboratory sample container, method for handling a laboratory sample container, laboratory apparatus and laboratory automation system
TWI708536B (zh) * 2019-11-25 2020-10-21 欣興電子股份有限公司 移除局部蓋體的裝置及移除局部蓋體的方法
US11889742B2 (en) * 2020-11-04 2024-01-30 Samsung Display Co., Ltd. Apparatus of manufacturing display device and method of manufacturing display device
CN112590358A (zh) * 2020-12-24 2021-04-02 查芳振 一种通过填充夹持的pvc广告字无残留分离装置
CN113099716B (zh) * 2021-04-16 2022-06-07 东莞市沃德精密机械有限公司 一种柔性件的贴装方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5106450A (en) * 1990-12-20 1992-04-21 International Business Machines Corporation Dry film resist transport and lamination system for semiconductor wafers
JPH05116837A (ja) * 1991-10-22 1993-05-14 Takatori Corp ウエハー表面保護テープ剥し装置
US5466325A (en) * 1993-06-02 1995-11-14 Nitto Denko Corporation Resist removing method, and curable pressure-sensitive adhesive, adhesive sheets and apparatus used for the method
US5810962A (en) * 1996-09-30 1998-09-22 Magnatech Computer Services, Inc. Apparatus and process for removing computer diskette labels
JP4204658B2 (ja) * 1997-11-28 2009-01-07 リンテック株式会社 シート剥離装置および方法
JP3993918B2 (ja) * 1997-08-25 2007-10-17 富士通株式会社 半導体装置の製造方法
US6554044B2 (en) * 2000-01-28 2003-04-29 Fargo Electronics Inc. Laminator peel-off bar
JP3753421B2 (ja) * 2002-01-17 2006-03-08 リンテック株式会社 半導体ウエハの加工方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012081650A (ja) * 2010-10-12 2012-04-26 Nitto Denko Corp 両面粘着テープ貼付け方法および両面粘着テープ貼付け装置
JP2014141612A (ja) * 2013-01-25 2014-08-07 Lintec Corp 分離装置及び分離方法
US9278568B2 (en) 2013-11-06 2016-03-08 Casio Computer Co., Ltd. Stamp-face forming apparatus, method of forming a stamp face, and stamp-face forming system

Also Published As

Publication number Publication date
US20070074822A1 (en) 2007-04-05
WO2005037698A1 (ja) 2005-04-28
EP1679276A1 (de) 2006-07-12
CN1867506A (zh) 2006-11-22
TW200518934A (en) 2005-06-16

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