TW200518934A - Adhesive tape peeling device - Google Patents

Adhesive tape peeling device

Info

Publication number
TW200518934A
TW200518934A TW093131460A TW93131460A TW200518934A TW 200518934 A TW200518934 A TW 200518934A TW 093131460 A TW093131460 A TW 093131460A TW 93131460 A TW93131460 A TW 93131460A TW 200518934 A TW200518934 A TW 200518934A
Authority
TW
Taiwan
Prior art keywords
tape
peeling
adhesive tape
plate
heating
Prior art date
Application number
TW093131460A
Other languages
English (en)
Chinese (zh)
Inventor
Takeshi Akechi
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW200518934A publication Critical patent/TW200518934A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004—Component parts, details or accessories; Auxiliary operations
    • B29C63/0013—Removing old coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/002—Web delivery apparatus, the web serving as support for articles, material or another web
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/19—Specific article or web
    • B65H2701/192—Labels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling
    • H10P72/7446—Separation by peeling using a peeling wheel
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW093131460A 2003-10-17 2004-10-15 Adhesive tape peeling device TW200518934A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003357168A JP2006316078A (ja) 2003-10-17 2003-10-17 接着テープの剥離方法及び剥離装置

Publications (1)

Publication Number Publication Date
TW200518934A true TW200518934A (en) 2005-06-16

Family

ID=34463238

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093131460A TW200518934A (en) 2003-10-17 2004-10-15 Adhesive tape peeling device

Country Status (6)

Country Link
US (1) US20070074822A1 (enExample)
EP (1) EP1679276A1 (enExample)
JP (1) JP2006316078A (enExample)
CN (1) CN1867506A (enExample)
TW (1) TW200518934A (enExample)
WO (1) WO2005037698A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI411054B (zh) * 2005-10-17 2013-10-01 琳得科股份有限公司 Measuring device
TWI701146B (zh) * 2016-06-07 2020-08-11 日商迪恩士先端貼合科技股份有限公司 由載體基板與樹脂層構成之工件的分離方法及分離裝置
TWI919881B (zh) 2025-01-03 2026-03-21 大陸商深圳市深逸通電子有限公司 Pcb板撕膠嵌入機

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007109927A (ja) * 2005-10-14 2007-04-26 Tokyo Seimitsu Co Ltd 表面保護フィルム剥離方法および表面保護フィルム剥離装置
JP4884075B2 (ja) * 2006-05-22 2012-02-22 株式会社東京精密 テープ貼付方法およびテープ貼付装置
DE102008000461B3 (de) * 2008-02-29 2009-07-30 Foliotec Gmbh Verfahren und Vorrichtung zum Abziehen einer Folie von einem plattenartigen Trägern oder einer Folie
JP5075084B2 (ja) * 2008-10-16 2012-11-14 日東電工株式会社 保護テープ貼付け方法および保護テープ貼付け装置
WO2010121068A2 (en) * 2009-04-16 2010-10-21 Suss Microtec, Inc. Improved apparatus for temporary wafer bonding and debonding
JP5547954B2 (ja) * 2009-12-14 2014-07-16 日東電工株式会社 粘着テープ剥離方法およびその装置
JP2011204806A (ja) * 2010-03-24 2011-10-13 Nitto Denko Corp ウエハの加工方法
US8574398B2 (en) 2010-05-27 2013-11-05 Suss Microtec Lithography, Gmbh Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers
JP5702983B2 (ja) * 2010-10-12 2015-04-15 日東電工株式会社 両面粘着テープ貼付け方法および両面粘着テープ貼付け装置
US8921130B2 (en) * 2012-03-14 2014-12-30 Osram Sylvania Inc. Methods for producing and placing wavelength converting structures
JP5591859B2 (ja) * 2012-03-23 2014-09-17 株式会社東芝 基板の分離方法及び分離装置
WO2014018231A1 (en) 2012-07-26 2014-01-30 3M Innovative Properties Company Heat de-bondable optical articles
CN104812859B (zh) * 2012-07-26 2018-03-02 3M创新有限公司 可热脱粘的粘合剂制品
DE102012020095B4 (de) * 2012-10-12 2016-05-19 Cotesa Gmbh Trenneinrichtung
JP6085179B2 (ja) * 2013-01-25 2017-02-22 リンテック株式会社 分離装置及び分離方法
JP5958447B2 (ja) 2013-11-06 2016-08-02 カシオ計算機株式会社 印面形成装置、印面形成方法および印面形成システム
CN106469767B (zh) * 2015-08-18 2017-12-01 江苏诚睿达光电有限公司 一种基于串联滚压的有机硅树脂光转换体贴合封装led的装备系统
EP3546952B1 (en) * 2018-03-26 2024-03-06 Roche Diagnostics GmbH Method for unsealing an opening of a laboratory sample container, method for handling a laboratory sample container, laboratory apparatus and laboratory automation system
TWI708536B (zh) * 2019-11-25 2020-10-21 欣興電子股份有限公司 移除局部蓋體的裝置及移除局部蓋體的方法
US11889742B2 (en) * 2020-11-04 2024-01-30 Samsung Display Co., Ltd. Apparatus of manufacturing display device and method of manufacturing display device
CN112590358A (zh) * 2020-12-24 2021-04-02 查芳振 一种通过填充夹持的pvc广告字无残留分离装置
CN113099716B (zh) * 2021-04-16 2022-06-07 东莞市沃德精密机械有限公司 一种柔性件的贴装方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5106450A (en) * 1990-12-20 1992-04-21 International Business Machines Corporation Dry film resist transport and lamination system for semiconductor wafers
JPH05116837A (ja) * 1991-10-22 1993-05-14 Takatori Corp ウエハー表面保護テープ剥し装置
US5466325A (en) * 1993-06-02 1995-11-14 Nitto Denko Corporation Resist removing method, and curable pressure-sensitive adhesive, adhesive sheets and apparatus used for the method
US5810962A (en) * 1996-09-30 1998-09-22 Magnatech Computer Services, Inc. Apparatus and process for removing computer diskette labels
JP4204658B2 (ja) * 1997-11-28 2009-01-07 リンテック株式会社 シート剥離装置および方法
JP3993918B2 (ja) * 1997-08-25 2007-10-17 富士通株式会社 半導体装置の製造方法
US6554044B2 (en) * 2000-01-28 2003-04-29 Fargo Electronics Inc. Laminator peel-off bar
JP3753421B2 (ja) * 2002-01-17 2006-03-08 リンテック株式会社 半導体ウエハの加工方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI411054B (zh) * 2005-10-17 2013-10-01 琳得科股份有限公司 Measuring device
TWI701146B (zh) * 2016-06-07 2020-08-11 日商迪恩士先端貼合科技股份有限公司 由載體基板與樹脂層構成之工件的分離方法及分離裝置
TWI919881B (zh) 2025-01-03 2026-03-21 大陸商深圳市深逸通電子有限公司 Pcb板撕膠嵌入機

Also Published As

Publication number Publication date
EP1679276A1 (de) 2006-07-12
US20070074822A1 (en) 2007-04-05
JP2006316078A (ja) 2006-11-24
WO2005037698A1 (ja) 2005-04-28
CN1867506A (zh) 2006-11-22

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