JP2006216989A5 - - Google Patents

Download PDF

Info

Publication number
JP2006216989A5
JP2006216989A5 JP2006125380A JP2006125380A JP2006216989A5 JP 2006216989 A5 JP2006216989 A5 JP 2006216989A5 JP 2006125380 A JP2006125380 A JP 2006125380A JP 2006125380 A JP2006125380 A JP 2006125380A JP 2006216989 A5 JP2006216989 A5 JP 2006216989A5
Authority
JP
Japan
Prior art keywords
element mounting
power switching
low
connection lead
switching elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006125380A
Other languages
English (en)
Japanese (ja)
Other versions
JP4634962B2 (ja
JP2006216989A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006125380A priority Critical patent/JP4634962B2/ja
Priority claimed from JP2006125380A external-priority patent/JP4634962B2/ja
Publication of JP2006216989A publication Critical patent/JP2006216989A/ja
Publication of JP2006216989A5 publication Critical patent/JP2006216989A5/ja
Application granted granted Critical
Publication of JP4634962B2 publication Critical patent/JP4634962B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2006125380A 2006-04-28 2006-04-28 半導体装置 Expired - Fee Related JP4634962B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006125380A JP4634962B2 (ja) 2006-04-28 2006-04-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006125380A JP4634962B2 (ja) 2006-04-28 2006-04-28 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2000244803A Division JP3812878B2 (ja) 2000-08-11 2000-08-11 半導体装置およびそれを用いたインバータ回路

Publications (3)

Publication Number Publication Date
JP2006216989A JP2006216989A (ja) 2006-08-17
JP2006216989A5 true JP2006216989A5 (enExample) 2009-07-30
JP4634962B2 JP4634962B2 (ja) 2011-02-16

Family

ID=36979875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006125380A Expired - Fee Related JP4634962B2 (ja) 2006-04-28 2006-04-28 半導体装置

Country Status (1)

Country Link
JP (1) JP4634962B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4586034B2 (ja) * 2007-03-16 2010-11-24 株式会社日立製作所 モータ駆動用半導体装置とそれを有する3相モータ及びモータ駆動装置並びにファンモータ
JP5152526B2 (ja) * 2009-04-24 2013-02-27 株式会社デンソー 車載電力変換装置
JP5564367B2 (ja) * 2010-08-26 2014-07-30 新電元工業株式会社 半導体装置及びリードフレーム
JP5564369B2 (ja) * 2010-08-31 2014-07-30 新電元工業株式会社 リードフレーム、半導体装置及びその製造方法
WO2017029745A1 (ja) * 2015-08-20 2017-02-23 三菱電機株式会社 電力用半導体装置
CN115346948B (zh) * 2022-10-14 2023-04-07 吉光半导体(绍兴)有限公司 一种半桥模块
TWI872853B (zh) * 2023-12-07 2025-02-11 朋程科技股份有限公司 驅動裝置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0758757B2 (ja) * 1989-11-15 1995-06-21 三洋電機株式会社 混成集積回路
JPH06101636B2 (ja) * 1990-01-25 1994-12-12 三菱電機株式会社 半導体装置
JP3212791B2 (ja) * 1994-02-10 2001-09-25 株式会社東芝 半導体装置
JP3843185B2 (ja) * 1998-10-30 2006-11-08 三菱電機株式会社 半導体装置
JP4073559B2 (ja) * 1998-10-30 2008-04-09 三菱電機株式会社 半導体装置
JP2000196009A (ja) * 1998-12-24 2000-07-14 Mitsubishi Electric Corp 半導体パワーモジュール

Similar Documents

Publication Publication Date Title
JP2009302564A5 (enExample)
JP2009231805A5 (enExample)
CN101582415B (zh) 半导体器件
JP2014511027A5 (enExample)
US7227198B2 (en) Half-bridge package
CN102760724B (zh) 一种联合封装的功率半导体器件
JP2014060402A5 (enExample)
US7615854B2 (en) Semiconductor package that includes stacked semiconductor die
EP1939937A3 (en) Bidirectional switch module
JP2006203187A5 (enExample)
JP2009534869A (ja) マルチプルダイおよび共通ノード構造を含む半導体ダイパッケージ
TW200707606A (en) Method of manufacturing an assembly and assembly
JP2008227531A5 (enExample)
JP2009027090A (ja) 半導体装置
JP2009512999A5 (enExample)
JP2009545862A5 (enExample)
JP2006216989A5 (enExample)
JP2009117819A5 (enExample)
JP4061551B2 (ja) 半導体装置
JP2007305848A5 (enExample)
CN103828041B (zh) 半导体装置
JP2013222781A5 (enExample)
JP2011077550A5 (enExample)
US8125071B2 (en) Package structure utilizing high and low side drivers on separate dice
JP2005051109A (ja) パワー半導体モジュール