JP2013222781A5 - - Google Patents

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Publication number
JP2013222781A5
JP2013222781A5 JP2012092575A JP2012092575A JP2013222781A5 JP 2013222781 A5 JP2013222781 A5 JP 2013222781A5 JP 2012092575 A JP2012092575 A JP 2012092575A JP 2012092575 A JP2012092575 A JP 2012092575A JP 2013222781 A5 JP2013222781 A5 JP 2013222781A5
Authority
JP
Japan
Prior art keywords
lead
drain
die pad
terminal
power device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012092575A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013222781A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012092575A priority Critical patent/JP2013222781A/ja
Priority claimed from JP2012092575A external-priority patent/JP2013222781A/ja
Priority to PCT/JP2013/054757 priority patent/WO2013157300A1/ja
Publication of JP2013222781A publication Critical patent/JP2013222781A/ja
Publication of JP2013222781A5 publication Critical patent/JP2013222781A5/ja
Pending legal-status Critical Current

Links

JP2012092575A 2012-04-16 2012-04-16 半導体装置のデバイス実装構造 Pending JP2013222781A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012092575A JP2013222781A (ja) 2012-04-16 2012-04-16 半導体装置のデバイス実装構造
PCT/JP2013/054757 WO2013157300A1 (ja) 2012-04-16 2013-02-25 半導体装置のデバイス実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012092575A JP2013222781A (ja) 2012-04-16 2012-04-16 半導体装置のデバイス実装構造

Publications (2)

Publication Number Publication Date
JP2013222781A JP2013222781A (ja) 2013-10-28
JP2013222781A5 true JP2013222781A5 (enExample) 2015-03-05

Family

ID=49383269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012092575A Pending JP2013222781A (ja) 2012-04-16 2012-04-16 半導体装置のデバイス実装構造

Country Status (2)

Country Link
JP (1) JP2013222781A (enExample)
WO (1) WO2013157300A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7097742B2 (ja) * 2018-05-01 2022-07-08 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
CN109300889B (zh) * 2018-10-30 2023-11-24 山东晶导微电子股份有限公司 一种ac-dc芯片与高压续流二极管集成芯片结构及电源模组
US12165957B2 (en) 2019-07-01 2024-12-10 Rohm Co., Ltd. Semiconductor device
JPWO2024185473A1 (enExample) * 2023-03-03 2024-09-12

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2522457Y2 (ja) * 1990-10-16 1997-01-16 富士通テン株式会社 表面実装形電子部品
JP3675603B2 (ja) * 1997-03-19 2005-07-27 株式会社ルネサス東日本セミコンダクタ 半導体装置
JP4211138B2 (ja) * 1999-05-27 2009-01-21 株式会社デンソー 高周波切替装置
JP2003347491A (ja) * 2002-05-28 2003-12-05 Renesas Technology Corp 半導体装置
JP4810072B2 (ja) * 2004-06-15 2011-11-09 株式会社東芝 窒素化合物含有半導体装置
JP2008166621A (ja) * 2006-12-29 2008-07-17 Sanyo Electric Co Ltd 半導体装置およびその製造方法
JP4865829B2 (ja) * 2009-03-31 2012-02-01 シャープ株式会社 半導体装置およびその製造方法

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