JP2014511027A5 - - Google Patents

Download PDF

Info

Publication number
JP2014511027A5
JP2014511027A5 JP2013553496A JP2013553496A JP2014511027A5 JP 2014511027 A5 JP2014511027 A5 JP 2014511027A5 JP 2013553496 A JP2013553496 A JP 2013553496A JP 2013553496 A JP2013553496 A JP 2013553496A JP 2014511027 A5 JP2014511027 A5 JP 2014511027A5
Authority
JP
Japan
Prior art keywords
power supply
supply module
die
fet
module according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013553496A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014511027A (ja
JP6131195B2 (ja
Filing date
Publication date
Priority claimed from US13/021,969 external-priority patent/US20120200281A1/en
Application filed filed Critical
Publication of JP2014511027A publication Critical patent/JP2014511027A/ja
Publication of JP2014511027A5 publication Critical patent/JP2014511027A5/ja
Application granted granted Critical
Publication of JP6131195B2 publication Critical patent/JP6131195B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013553496A 2011-02-07 2012-02-07 スイッチノードリンギングが低減された３次元電源モジュール Active JP6131195B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/021,969 2011-02-07
US13/021,969 US20120200281A1 (en) 2011-02-07 2011-02-07 Three-Dimensional Power Supply Module Having Reduced Switch Node Ringing
PCT/US2012/024171 WO2012109265A2 (en) 2011-02-07 2012-02-07 Three-dimensional power supply module having reduced switch node ringing

Publications (3)

Publication Number Publication Date
JP2014511027A JP2014511027A (ja) 2014-05-01
JP2014511027A5 true JP2014511027A5 (enExample) 2015-03-26
JP6131195B2 JP6131195B2 (ja) 2017-05-17

Family

ID=46600221

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013553496A Active JP6131195B2 (ja) 2011-02-07 2012-02-07 スイッチノードリンギングが低減された３次元電源モジュール

Country Status (4)

Country Link
US (1) US20120200281A1 (enExample)
JP (1) JP6131195B2 (enExample)
CN (2) CN103348469A (enExample)
WO (1) WO2012109265A2 (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI453831B (zh) 2010-09-09 2014-09-21 台灣捷康綜合有限公司 半導體封裝結構及其製造方法
US8981748B2 (en) * 2011-08-08 2015-03-17 Semiconductor Components Industries, Llc Method of forming a semiconductor power switching device, structure therefor, and power converter
US9589872B2 (en) * 2012-03-28 2017-03-07 Infineon Technologies Americas Corp. Integrated dual power converter package having internal driver IC
US9171784B2 (en) * 2012-03-28 2015-10-27 International Rectifier Corporation Dual power converter package using external driver IC
US20140063744A1 (en) * 2012-09-05 2014-03-06 Texas Instruments Incorporated Vertically Stacked Power FETS and Synchronous Buck Converter Having Low On-Resistance
JP5966921B2 (ja) * 2012-12-28 2016-08-10 トヨタ自動車株式会社 半導体モジュールの製造方法
US9966330B2 (en) 2013-03-14 2018-05-08 Vishay-Siliconix Stack die package
US9589929B2 (en) * 2013-03-14 2017-03-07 Vishay-Siliconix Method for fabricating stack die package
US9214415B2 (en) 2013-04-11 2015-12-15 Texas Instruments Incorporated Integrating multi-output power converters having vertically stacked semiconductor chips
US9171828B2 (en) * 2014-02-05 2015-10-27 Texas Instruments Incorporated DC-DC converter having terminals of semiconductor chips directly attachable to circuit board
US9136256B2 (en) * 2014-02-20 2015-09-15 Texas Instruments Incorporated Converter having partially thinned leadframe with stacked chips and interposer, free of wires and clips
US9355942B2 (en) * 2014-05-15 2016-05-31 Texas Instruments Incorporated Gang clips having distributed-function tie bars
US9515014B2 (en) 2014-10-08 2016-12-06 Infineon Technologies Americas Corp. Power converter package with integrated output inductor
US10103140B2 (en) * 2016-10-14 2018-10-16 Alpha And Omega Semiconductor Incorporated Switch circuit with controllable phase node ringing
JP6473271B1 (ja) 2017-05-19 2019-02-20 新電元工業株式会社 電子モジュール
WO2018211685A1 (ja) * 2017-05-19 2018-11-22 新電元工業株式会社 電子モジュール
US11189591B2 (en) * 2017-05-19 2021-11-30 Shindengen Electric Manufacturing Co., Ltd. Electronic module
EP3703119B1 (en) * 2017-10-26 2022-06-08 Shindengen Electric Manufacturing Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
DE102018207308B4 (de) * 2018-05-09 2020-07-02 Infineon Technologies Ag Halbleiterbauteil mit integriertem shunt-widerstand und verfahren zu dessen herstellung
US20200194347A1 (en) * 2018-12-18 2020-06-18 Alpha And Omega Semiconductor (Cayman) Ltd. Semiconductor package and method of making the same
US11658410B2 (en) 2019-03-12 2023-05-23 Epirus, Inc. Apparatus and method for synchronizing power circuits with coherent RF signals to form a steered composite RF signal
US11211703B2 (en) 2019-03-12 2021-12-28 Epirus, Inc. Systems and methods for dynamic biasing of microwave amplifier
US11616295B2 (en) 2019-03-12 2023-03-28 Epirus, Inc. Systems and methods for adaptive generation of high power electromagnetic radiation and their applications
US11469722B2 (en) 2020-06-22 2022-10-11 Epirus, Inc. Systems and methods for modular power amplifiers
US12381523B2 (en) 2020-06-22 2025-08-05 Epirus, Inc. Systems and methods for radio frequency power systems
US12068618B2 (en) 2021-07-01 2024-08-20 Epirus, Inc. Systems and methods for compact directed energy systems
US12003223B2 (en) 2020-06-22 2024-06-04 Epirus, Inc. Systems and methods for modular power amplifiers
US20220020671A1 (en) * 2020-07-20 2022-01-20 Electronics And Telecommunications Research Institute Flip-stack type semiconductor package and method of manufacturing the same
US12273075B2 (en) 2021-07-01 2025-04-08 Epirus, Inc. Systems and methods for power distribution for amplifier arrays
CN115188756B (zh) * 2022-06-24 2025-10-24 艾科微电子(深圳)有限公司 芯片堆叠结构

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6421262B1 (en) * 2000-02-08 2002-07-16 Vlt Corporation Active rectifier
JP2005217072A (ja) * 2004-01-28 2005-08-11 Renesas Technology Corp 半導体装置
JP4489485B2 (ja) * 2004-03-31 2010-06-23 株式会社ルネサステクノロジ 半導体装置
CN101819955B (zh) * 2004-12-20 2011-09-28 半导体元件工业有限责任公司 具有增强散热性的半导体封装结构
US7598603B2 (en) * 2006-03-15 2009-10-06 Infineon Technologies Ag Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink
DE102006021959B4 (de) * 2006-05-10 2011-12-29 Infineon Technologies Ag Leistungshalbleiterbauteil und Verfahren zu dessen Herstellung
US7569920B2 (en) * 2006-05-10 2009-08-04 Infineon Technologies Ag Electronic component having at least one vertical semiconductor power transistor
DE102006034679A1 (de) * 2006-07-24 2008-01-31 Infineon Technologies Ag Halbleitermodul mit Leistungshalbleiterchip und passiven Bauelement sowie Verfahren zur Herstellung desselben
US7485954B2 (en) * 2006-09-07 2009-02-03 Alpha And Omega Semiconductor Limited Stacked dual MOSFET package
DE102007009521B4 (de) * 2007-02-27 2011-12-15 Infineon Technologies Ag Bauteil und Verfahren zu dessen Herstellung
US7683477B2 (en) * 2007-06-26 2010-03-23 Infineon Technologies Ag Semiconductor device including semiconductor chips having contact elements
US7750445B2 (en) * 2007-09-18 2010-07-06 Fairchild Semiconductor Corporation Stacked synchronous buck converter
US8035221B2 (en) * 2007-11-08 2011-10-11 Intersil Americas, Inc. Clip mount for integrated circuit leadframes
US7696612B2 (en) * 2008-01-28 2010-04-13 Fairchild Semiconductor Corporation Multiphase synchronous buck converter
US20090230524A1 (en) * 2008-03-14 2009-09-17 Pao-Huei Chang Chien Semiconductor chip package having ground and power regions and manufacturing methods thereof
US8148815B2 (en) * 2008-10-13 2012-04-03 Intersil Americas, Inc. Stacked field effect transistor configurations
CN101442035B (zh) * 2008-12-14 2011-03-16 天水华天科技股份有限公司 一种扁平无引线封装件及其生产方法
US20100171543A1 (en) * 2009-01-08 2010-07-08 Ciclon Semiconductor Device Corp. Packaged power switching device
US8680627B2 (en) * 2011-01-14 2014-03-25 International Rectifier Corporation Stacked half-bridge package with a common conductive clip

Similar Documents

Publication Publication Date Title
JP2014511027A5 (enExample)
JP2014060402A5 (enExample)
US8749034B2 (en) High power semiconductor package with conductive clip and flip chip driver IC with integrated control transistor
JP2009302564A5 (enExample)
US20120200281A1 (en) Three-Dimensional Power Supply Module Having Reduced Switch Node Ringing
US8519520B2 (en) Semiconductor package of small footprint with a stack of lead frame die paddle sandwich between high-side and low-side MOSFETs and manufacturing method
EP1939937A3 (en) Bidirectional switch module
CN102760724B (zh) 一种联合封装的功率半导体器件
US20120228696A1 (en) Stacked die power converter
JP2015530748A (ja) 低いオン抵抗を有する、垂直にスタックされたパワーｆｅｔ及び同期バックコンバータ
WO2015033197A3 (en) Semiconductor device with a groove collectively surrounding solder bonds to prevent solder spreading
WO2011090574A3 (en) Semiconductor package and method
JP2010283236A5 (enExample)
JP2015142077A (ja) 半導体装置
US20140210061A1 (en) Chip arrangement and chip package
CN102983114A (zh) 具有超薄封装的高性能功率晶体管
CN102842564A (zh) 集成开关电源的倒装封装装置及其倒装封装方法
CN103824853A (zh) 应用于开关型调节器的集成电路组件
US20120061813A1 (en) Package Structure for DC-DC Converter
US8860194B2 (en) Buck converter power package
JP2009545862A5 (enExample)
US6791172B2 (en) Power semiconductor device manufactured using a chip-size package
US11315850B2 (en) Semiconductor device
JP2010258366A5 (enExample)
JP2017511976A5 (enExample)