JP2010258366A5 - - Google Patents
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- Publication number
- JP2010258366A5 JP2010258366A5 JP2009109518A JP2009109518A JP2010258366A5 JP 2010258366 A5 JP2010258366 A5 JP 2010258366A5 JP 2009109518 A JP2009109518 A JP 2009109518A JP 2009109518 A JP2009109518 A JP 2009109518A JP 2010258366 A5 JP2010258366 A5 JP 2010258366A5
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- external terminal
- electrode
- electrically connected
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004020 conductor Substances 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009109518A JP2010258366A (ja) | 2009-04-28 | 2009-04-28 | 半導体装置 |
| US12/767,156 US20100270992A1 (en) | 2009-04-28 | 2010-04-26 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009109518A JP2010258366A (ja) | 2009-04-28 | 2009-04-28 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010258366A JP2010258366A (ja) | 2010-11-11 |
| JP2010258366A5 true JP2010258366A5 (enExample) | 2012-05-31 |
Family
ID=42991544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009109518A Withdrawn JP2010258366A (ja) | 2009-04-28 | 2009-04-28 | 半導体装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20100270992A1 (enExample) |
| JP (1) | JP2010258366A (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5936310B2 (ja) * | 2011-03-17 | 2016-06-22 | 三菱電機株式会社 | パワー半導体モジュール及びその取り付け構造 |
| JP5870200B2 (ja) * | 2012-09-24 | 2016-02-24 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体装置 |
| WO2019049213A1 (ja) * | 2017-09-05 | 2019-03-14 | 新電元工業株式会社 | 半導体装置 |
| CN111406311A (zh) * | 2017-11-10 | 2020-07-10 | 新电元工业株式会社 | 电子模块以及电子模块的制造方法 |
| JP7364499B2 (ja) * | 2020-03-10 | 2023-10-18 | 株式会社日立製作所 | 電力変換ユニットおよび電力変換装置 |
| JP7696853B2 (ja) * | 2022-03-24 | 2025-06-23 | 株式会社東芝 | 半導体装置 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4149438B2 (ja) * | 2002-06-05 | 2008-09-10 | 株式会社ルネサステクノロジ | 半導体装置 |
| EP1594164B1 (en) * | 2003-02-14 | 2012-05-09 | Hitachi, Ltd. | Integrated circuit for driving semiconductor device |
| JP4115882B2 (ja) * | 2003-05-14 | 2008-07-09 | 株式会社ルネサステクノロジ | 半導体装置 |
| JP2005217072A (ja) * | 2004-01-28 | 2005-08-11 | Renesas Technology Corp | 半導体装置 |
| JP4426955B2 (ja) * | 2004-11-30 | 2010-03-03 | 株式会社ルネサステクノロジ | 半導体装置 |
| JP5291864B2 (ja) * | 2006-02-21 | 2013-09-18 | ルネサスエレクトロニクス株式会社 | Ｄｃ／ｄｃコンバータ用半導体装置の製造方法およびｄｃ／ｄｃコンバータ用半導体装置 |
| DE102006034679A1 (de) * | 2006-07-24 | 2008-01-31 | Infineon Technologies Ag | Halbleitermodul mit Leistungshalbleiterchip und passiven Bauelement sowie Verfahren zur Herstellung desselben |
| DE102007013186B4 (de) * | 2007-03-15 | 2020-07-02 | Infineon Technologies Ag | Halbleitermodul mit Halbleiterchips und Verfahren zur Herstellung desselben |
| US7884444B2 (en) * | 2008-07-22 | 2011-02-08 | Infineon Technologies Ag | Semiconductor device including a transformer on chip |
| JP5107839B2 (ja) * | 2008-09-10 | 2012-12-26 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP5407667B2 (ja) * | 2008-11-05 | 2014-02-05 | 株式会社村田製作所 | 半導体装置 |
-
2009
- 2009-04-28 JP JP2009109518A patent/JP2010258366A/ja not_active Withdrawn
-
2010
- 2010-04-26 US US12/767,156 patent/US20100270992A1/en not_active Abandoned