JP2009545862A5 - - Google Patents

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Publication number
JP2009545862A5
JP2009545862A5 JP2009511260A JP2009511260A JP2009545862A5 JP 2009545862 A5 JP2009545862 A5 JP 2009545862A5 JP 2009511260 A JP2009511260 A JP 2009511260A JP 2009511260 A JP2009511260 A JP 2009511260A JP 2009545862 A5 JP2009545862 A5 JP 2009545862A5
Authority
JP
Japan
Prior art keywords
module
transistor
drain
pad
clip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009511260A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009545862A (ja
Filing date
Publication date
Priority claimed from US11/740,475 external-priority patent/US7777315B2/en
Application filed filed Critical
Priority claimed from PCT/US2007/069362 external-priority patent/WO2007137221A2/en
Publication of JP2009545862A publication Critical patent/JP2009545862A/ja
Publication of JP2009545862A5 publication Critical patent/JP2009545862A5/ja
Pending legal-status Critical Current

Links

JP2009511260A 2006-05-19 2007-05-21 ２面冷却集積化トランジスタモジュール及びその製造方法 Pending JP2009545862A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US80218106P 2006-05-19 2006-05-19
US11/740,475 US7777315B2 (en) 2006-05-19 2007-04-26 Dual side cooling integrated power device module and methods of manufacture
US91699407P 2007-05-09 2007-05-09
PCT/US2007/069362 WO2007137221A2 (en) 2006-05-19 2007-05-21 Dual side cooling integrated transistor module and methods of manufacture

Publications (2)

Publication Number Publication Date
JP2009545862A JP2009545862A (ja) 2009-12-24
JP2009545862A5 true JP2009545862A5 (enExample) 2011-10-06

Family

ID=38724063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009511260A Pending JP2009545862A (ja) 2006-05-19 2007-05-21 ２面冷却集積化トランジスタモジュール及びその製造方法

Country Status (6)

Country Link
JP (1) JP2009545862A (enExample)
KR (1) KR101157305B1 (enExample)
CN (1) CN101473423B (enExample)
DE (1) DE112007001240T5 (enExample)
TW (1) TWI452662B (enExample)
WO (1) WO2007137221A2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5822468B2 (ja) * 2011-01-11 2015-11-24 ローム株式会社 半導体装置
CN102832190B (zh) * 2011-06-14 2015-02-04 万国半导体股份有限公司 一种倒装芯片的半导体器件及制造方法
WO2013157172A1 (ja) * 2012-04-20 2013-10-24 パナソニック株式会社 半導体パッケージ及びその製造方法、半導体モジュール、並びに半導体装置
US9355942B2 (en) * 2014-05-15 2016-05-31 Texas Instruments Incorporated Gang clips having distributed-function tie bars
US10438900B1 (en) * 2018-03-29 2019-10-08 Alpha And Omega Semiconductor (Cayman) Ltd. HV converter with reduced EMI
US11309233B2 (en) * 2019-09-18 2022-04-19 Alpha And Omega Semiconductor (Cayman), Ltd. Power semiconductor package having integrated inductor, resistor and capacitor
US20210082790A1 (en) * 2019-09-18 2021-03-18 Alpha And Omega Semiconductor (Cayman) Ltd. Power semiconductor package having integrated inductor and method of making the same
CN113410185B (zh) * 2021-06-04 2021-12-14 深圳真茂佳半导体有限公司 功率半导体器件封装结构及其制造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5877555A (en) * 1996-12-20 1999-03-02 Ericsson, Inc. Direct contact die attach
JP4173751B2 (ja) * 2003-02-28 2008-10-29 株式会社ルネサステクノロジ 半導体装置
TWI265611B (en) * 2003-03-11 2006-11-01 Siliconware Precision Industries Co Ltd Semiconductor package with heatsink
JP2005217072A (ja) * 2004-01-28 2005-08-11 Renesas Technology Corp 半導体装置
US7301235B2 (en) * 2004-06-03 2007-11-27 International Rectifier Corporation Semiconductor device module with flip chip devices on a common lead frame
JP2006073655A (ja) * 2004-08-31 2006-03-16 Toshiba Corp 半導体モジュール
US7476976B2 (en) * 2005-02-23 2009-01-13 Texas Instruments Incorporated Flip chip package with advanced electrical and thermal properties for high current designs
US7504733B2 (en) * 2005-08-17 2009-03-17 Ciclon Semiconductor Device Corp. Semiconductor die package
US20070132073A1 (en) * 2005-12-09 2007-06-14 Tiong Toong T Device and method for assembling a top and bottom exposed packaged semiconductor

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