TWI452662B - 雙邊冷卻整合電源裝置封裝與模組及製造方法 - Google Patents

雙邊冷卻整合電源裝置封裝與模組及製造方法 Download PDF

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Publication number
TWI452662B
TWI452662B TW096117812A TW96117812A TWI452662B TW I452662 B TWI452662 B TW I452662B TW 096117812 A TW096117812 A TW 096117812A TW 96117812 A TW96117812 A TW 96117812A TW I452662 B TWI452662 B TW I452662B
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Taiwan
Prior art keywords
module
drain
transistor
pads
lead frame
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TW096117812A
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English (en)
Chinese (zh)
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TW200810069A (en
Inventor
諾奎爾 強納森Ａ
馬德里 魯本Ｐ
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菲爾卻德半導體公司
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Priority claimed from US11/740,475 external-priority patent/US7777315B2/en
Application filed by 菲爾卻德半導體公司 filed Critical 菲爾卻德半導體公司
Publication of TW200810069A publication Critical patent/TW200810069A/zh
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Publication of TWI452662B publication Critical patent/TWI452662B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for individual devices of subclass H10D
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Dc-Dc Converters (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW096117812A 2006-05-19 2007-05-18 雙邊冷卻整合電源裝置封裝與模組及製造方法 TWI452662B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US80218106P 2006-05-19 2006-05-19
US11/740,475 US7777315B2 (en) 2006-05-19 2007-04-26 Dual side cooling integrated power device module and methods of manufacture
US91699407P 2007-05-09 2007-05-09

Publications (2)

Publication Number Publication Date
TW200810069A TW200810069A (en) 2008-02-16
TWI452662B true TWI452662B (zh) 2014-09-11

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JP (1) JP2009545862A (enExample)
KR (1) KR101157305B1 (enExample)
CN (1) CN101473423B (enExample)
DE (1) DE112007001240T5 (enExample)
TW (1) TWI452662B (enExample)
WO (1) WO2007137221A2 (enExample)

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JP5822468B2 (ja) * 2011-01-11 2015-11-24 ローム株式会社 半導体装置
CN102832190B (zh) * 2011-06-14 2015-02-04 万国半导体股份有限公司 一种倒装芯片的半导体器件及制造方法
WO2013157172A1 (ja) * 2012-04-20 2013-10-24 パナソニック株式会社 半導体パッケージ及びその製造方法、半導体モジュール、並びに半導体装置
US9355942B2 (en) * 2014-05-15 2016-05-31 Texas Instruments Incorporated Gang clips having distributed-function tie bars
US10438900B1 (en) * 2018-03-29 2019-10-08 Alpha And Omega Semiconductor (Cayman) Ltd. HV converter with reduced EMI
US11309233B2 (en) * 2019-09-18 2022-04-19 Alpha And Omega Semiconductor (Cayman), Ltd. Power semiconductor package having integrated inductor, resistor and capacitor
US20210082790A1 (en) * 2019-09-18 2021-03-18 Alpha And Omega Semiconductor (Cayman) Ltd. Power semiconductor package having integrated inductor and method of making the same
CN113410185B (zh) * 2021-06-04 2021-12-14 深圳真茂佳半导体有限公司 功率半导体器件封装结构及其制造方法

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US20060044772A1 (en) * 2004-08-31 2006-03-02 Kabushiki Kaisha Toshiba Semiconductor module
US20070040254A1 (en) * 2005-08-17 2007-02-22 Lopez Osvaldo J Semiconductor die package

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US5877555A (en) * 1996-12-20 1999-03-02 Ericsson, Inc. Direct contact die attach
JP4173751B2 (ja) * 2003-02-28 2008-10-29 株式会社ルネサステクノロジ 半導体装置
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CN101473423B (zh) 2011-04-13
JP2009545862A (ja) 2009-12-24
WO2007137221A2 (en) 2007-11-29
TW200810069A (en) 2008-02-16
WO2007137221A3 (en) 2008-10-02
CN101473423A (zh) 2009-07-01
KR101157305B1 (ko) 2012-06-15
DE112007001240T5 (de) 2009-04-23
KR20090009882A (ko) 2009-01-23

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