WO2007137221A3 - Dual side cooling integrated transistor module and methods of manufacture - Google Patents

Dual side cooling integrated transistor module and methods of manufacture Download PDF

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Publication number
WO2007137221A3
WO2007137221A3 PCT/US2007/069362 US2007069362W WO2007137221A3 WO 2007137221 A3 WO2007137221 A3 WO 2007137221A3 US 2007069362 W US2007069362 W US 2007069362W WO 2007137221 A3 WO2007137221 A3 WO 2007137221A3
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WO
WIPO (PCT)
Prior art keywords
drain
pads
transistor
manufacture
methods
Prior art date
Application number
PCT/US2007/069362
Other languages
French (fr)
Other versions
WO2007137221A2 (en
Inventor
Jonathan A Noquil
Ruben P Madrid
Original Assignee
Fairchild Semiconductor
Jonathan A Noquil
Ruben P Madrid
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/740,475 external-priority patent/US7777315B2/en
Application filed by Fairchild Semiconductor, Jonathan A Noquil, Ruben P Madrid filed Critical Fairchild Semiconductor
Priority to KR1020087028221A priority Critical patent/KR101157305B1/en
Priority to CN2007800230340A priority patent/CN101473423B/en
Priority to DE112007001240T priority patent/DE112007001240T5/en
Priority to JP2009511260A priority patent/JP2009545862A/en
Publication of WO2007137221A2 publication Critical patent/WO2007137221A2/en
Publication of WO2007137221A3 publication Critical patent/WO2007137221A3/en

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
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  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Dc-Dc Converters (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

An integrated transistor module including a lead frame having first and second spaced pads, one or more common source-drain leads located between the first and second pads, and one or more drain leads located on the outside of the second pad. First and second transistors are flip chip attached respectively to the first and second pads, wherein the source of the second transistor is electrically connected to the one or more common source-drain leads. A first clip is attached to the drain of the first transistor and electrically connected to the one or more common source-drain leads. A second clip is attached to the drain of the second transistor and electrically connected to the one or more drain leads located on the outside of the second pad. Molding material encapsulates the lead frame, the transistors, and the clips to form the module. By leaving the lead frame pads and clips exposed and free of molding material, dual cooling of the module is effected.
PCT/US2007/069362 2006-05-19 2007-05-21 Dual side cooling integrated transistor module and methods of manufacture WO2007137221A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020087028221A KR101157305B1 (en) 2006-05-19 2007-05-21 Dual side cooling integrated transistor module and methodes of manufacture
CN2007800230340A CN101473423B (en) 2006-05-19 2007-05-21 Dual side cooling integrated transistor module and methods of manufacture
DE112007001240T DE112007001240T5 (en) 2006-05-19 2007-05-21 Integrated transistor module with double-sided cooling and method of manufacture
JP2009511260A JP2009545862A (en) 2006-05-19 2007-05-21 Two-surface cooling integrated transistor module and manufacturing method thereof

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US80218106P 2006-05-19 2006-05-19
US60/802,181 2006-05-19
US11/740,475 2007-04-26
US11/740,475 US7777315B2 (en) 2006-05-19 2007-04-26 Dual side cooling integrated power device module and methods of manufacture
US91699407P 2007-05-09 2007-05-09
US60/916,994 2007-05-09

Publications (2)

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WO2007137221A2 WO2007137221A2 (en) 2007-11-29
WO2007137221A3 true WO2007137221A3 (en) 2008-10-02

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KR (1) KR101157305B1 (en)
CN (1) CN101473423B (en)
DE (1) DE112007001240T5 (en)
TW (1) TWI452662B (en)
WO (1) WO2007137221A2 (en)

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US20210082790A1 (en) * 2019-09-18 2021-03-18 Alpha And Omega Semiconductor (Cayman) Ltd. Power semiconductor package having integrated inductor and method of making the same
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Also Published As

Publication number Publication date
KR101157305B1 (en) 2012-06-15
JP2009545862A (en) 2009-12-24
TW200810069A (en) 2008-02-16
CN101473423B (en) 2011-04-13
CN101473423A (en) 2009-07-01
WO2007137221A2 (en) 2007-11-29
DE112007001240T5 (en) 2009-04-23
KR20090009882A (en) 2009-01-23
TWI452662B (en) 2014-09-11

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