SG137738A1 - Lead frame and semiconductor device using the same - Google Patents

Lead frame and semiconductor device using the same

Info

Publication number
SG137738A1
SG137738A1 SG200700808-9A SG2007008089A SG137738A1 SG 137738 A1 SG137738 A1 SG 137738A1 SG 2007008089 A SG2007008089 A SG 2007008089A SG 137738 A1 SG137738 A1 SG 137738A1
Authority
SG
Singapore
Prior art keywords
die pad
radiator plate
inner leads
lead frame
sides
Prior art date
Application number
SG200700808-9A
Inventor
Yoichiro Nozaki
Yasuhiro Takehana
Akira Oga
Toshiyuki Fukuda
Seiji Fujiwara
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of SG137738A1 publication Critical patent/SG137738A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
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    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
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    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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Abstract

A lead frame includes: a die pad for holding a semiconductor chip; a radiator plate extending outward from one side face of the die pad and another side face thereof opposite the one side; a plurality of inner leads arranged opposite respective sides of the die pad other than the sides from which the radiator plate extends so as to interpose the die pad; and a plurality of outer leads formed outside the plurality of inner leads and connected to the inner leads. At least one of the plurality of inner leads serves as a ground lead connected to the die pad. In the radiator plate, an island bonding area of which potential is equal to that of the die pad is formed, a first slit is formed around three sides of the island bonding area, and the other side is connected to the radiator plate through a joint part.
SG200700808-9A 2006-05-09 2007-02-02 Lead frame and semiconductor device using the same SG137738A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006130369A JP4705881B2 (en) 2006-05-09 2006-05-09 Lead frame and semiconductor device using the same

Publications (1)

Publication Number Publication Date
SG137738A1 true SG137738A1 (en) 2007-12-28

Family

ID=38684338

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200700808-9A SG137738A1 (en) 2006-05-09 2007-02-02 Lead frame and semiconductor device using the same

Country Status (4)

Country Link
US (1) US20070262409A1 (en)
JP (1) JP4705881B2 (en)
CN (1) CN101071796A (en)
SG (1) SG137738A1 (en)

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JP5026848B2 (en) * 2007-04-19 2012-09-19 スタンレー電気株式会社 Optical semiconductor device and manufacturing method thereof
JP2012089563A (en) * 2010-10-15 2012-05-10 Sanken Electric Co Ltd Semiconductor module
CN102034784B (en) * 2010-11-10 2013-06-05 吴江巨丰电子有限公司 28K lead frame
JP5885987B2 (en) * 2011-10-05 2016-03-16 ローム株式会社 Semiconductor device
CN106611753A (en) * 2015-10-26 2017-05-03 无锡华润矽科微电子有限公司 Chip packaging frame and chip packaging structure
CN106783753A (en) * 2016-12-21 2017-05-31 伍昭云 Semiconductor devices
US10242935B2 (en) * 2017-08-31 2019-03-26 Nxp Usa, Inc. Packaged semiconductor device and method for forming
CN109192715B (en) * 2018-09-20 2024-03-22 江苏长电科技股份有限公司 Lead frame structure, packaging structure and manufacturing method thereof
EP3671829B1 (en) * 2018-12-17 2023-09-27 Nexperia B.V. Leadframe assembly for a semiconductor device
JP7353121B2 (en) * 2019-10-08 2023-09-29 キヤノン株式会社 Semiconductor devices and equipment
CN112563233B (en) * 2020-12-09 2023-04-11 天水七四九电子有限公司 Planar packaging part and production method thereof
WO2023176267A1 (en) * 2022-03-17 2023-09-21 ローム株式会社 Semiconductor device

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JP4255934B2 (en) * 2005-08-26 2009-04-22 シャープ株式会社 Semiconductor device and electronic device using the semiconductor device

Also Published As

Publication number Publication date
US20070262409A1 (en) 2007-11-15
JP2007305671A (en) 2007-11-22
JP4705881B2 (en) 2011-06-22
CN101071796A (en) 2007-11-14

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