JP4634962B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP4634962B2
JP4634962B2 JP2006125380A JP2006125380A JP4634962B2 JP 4634962 B2 JP4634962 B2 JP 4634962B2 JP 2006125380 A JP2006125380 A JP 2006125380A JP 2006125380 A JP2006125380 A JP 2006125380A JP 4634962 B2 JP4634962 B2 JP 4634962B2
Authority
JP
Japan
Prior art keywords
power switching
control
element mounting
semiconductor device
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006125380A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006216989A (ja
JP2006216989A5 (enExample
Inventor
英明 名倉
竜太郎 荒川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2006125380A priority Critical patent/JP4634962B2/ja
Publication of JP2006216989A publication Critical patent/JP2006216989A/ja
Publication of JP2006216989A5 publication Critical patent/JP2006216989A5/ja
Application granted granted Critical
Publication of JP4634962B2 publication Critical patent/JP4634962B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

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  • Inverter Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2006125380A 2006-04-28 2006-04-28 半導体装置 Expired - Fee Related JP4634962B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006125380A JP4634962B2 (ja) 2006-04-28 2006-04-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006125380A JP4634962B2 (ja) 2006-04-28 2006-04-28 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2000244803A Division JP3812878B2 (ja) 2000-08-11 2000-08-11 半導体装置およびそれを用いたインバータ回路

Publications (3)

Publication Number Publication Date
JP2006216989A JP2006216989A (ja) 2006-08-17
JP2006216989A5 JP2006216989A5 (enExample) 2009-07-30
JP4634962B2 true JP4634962B2 (ja) 2011-02-16

Family

ID=36979875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006125380A Expired - Fee Related JP4634962B2 (ja) 2006-04-28 2006-04-28 半導体装置

Country Status (1)

Country Link
JP (1) JP4634962B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4586034B2 (ja) 2007-03-16 2010-11-24 株式会社日立製作所 モータ駆動用半導体装置とそれを有する３相モータ及びモータ駆動装置並びにファンモータ
JP5152526B2 (ja) * 2009-04-24 2013-02-27 株式会社デンソー 車載電力変換装置
JP5564367B2 (ja) * 2010-08-26 2014-07-30 新電元工業株式会社 半導体装置及びリードフレーム
JP5564369B2 (ja) * 2010-08-31 2014-07-30 新電元工業株式会社 リードフレーム、半導体装置及びその製造方法
US10348179B2 (en) 2015-08-20 2019-07-09 Mitsubishi Electric Corporation Power semiconductor device
CN115346948B (zh) * 2022-10-14 2023-04-07 吉光半导体(绍兴)有限公司 一种半桥模块
TWI872853B (zh) * 2023-12-07 2025-02-11 朋程科技股份有限公司 驅動裝置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0758757B2 (ja) * 1989-11-15 1995-06-21 三洋電機株式会社 混成集積回路
JPH06101636B2 (ja) * 1990-01-25 1994-12-12 三菱電機株式会社 半導体装置
JP3212791B2 (ja) * 1994-02-10 2001-09-25 株式会社東芝 半導体装置
JP3843185B2 (ja) * 1998-10-30 2006-11-08 三菱電機株式会社 半導体装置
JP4073559B2 (ja) * 1998-10-30 2008-04-09 三菱電機株式会社 半導体装置
JP2000196009A (ja) * 1998-12-24 2000-07-14 Mitsubishi Electric Corp 半導体パワーモジュール

Also Published As

Publication number Publication date
JP2006216989A (ja) 2006-08-17

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