JP2011077550A5 - - Google Patents
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- Publication number
- JP2011077550A5 JP2011077550A5 JP2010292753A JP2010292753A JP2011077550A5 JP 2011077550 A5 JP2011077550 A5 JP 2011077550A5 JP 2010292753 A JP2010292753 A JP 2010292753A JP 2010292753 A JP2010292753 A JP 2010292753A JP 2011077550 A5 JP2011077550 A5 JP 2011077550A5
- Authority
- JP
- Japan
- Prior art keywords
- field effect
- mounting portion
- effect transistor
- chip mounting
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010292753A JP5292388B2 (ja) | 2010-12-28 | 2010-12-28 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010292753A JP5292388B2 (ja) | 2010-12-28 | 2010-12-28 | 半導体装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007287203A Division JP4769784B2 (ja) | 2007-11-05 | 2007-11-05 | 半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013088367A Division JP2013141035A (ja) | 2013-04-19 | 2013-04-19 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011077550A JP2011077550A (ja) | 2011-04-14 |
| JP2011077550A5 true JP2011077550A5 (enExample) | 2012-01-19 |
| JP5292388B2 JP5292388B2 (ja) | 2013-09-18 |
Family
ID=44021126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010292753A Expired - Fee Related JP5292388B2 (ja) | 2010-12-28 | 2010-12-28 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5292388B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013141035A (ja) * | 2013-04-19 | 2013-07-18 | Renesas Electronics Corp | 半導体装置 |
| CN113366636B (zh) * | 2019-03-22 | 2024-06-21 | 株式会社村田制作所 | 电路模块 |
| CN117832177B (zh) * | 2024-03-04 | 2024-05-28 | 深圳市沃芯半导体技术有限公司 | 开关电源模块封装系统及封装方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001291823A (ja) * | 2000-04-05 | 2001-10-19 | Toshiba Digital Media Engineering Corp | 半導体装置 |
| JP2001339041A (ja) * | 2000-05-29 | 2001-12-07 | Toshiba Digital Media Engineering Corp | 半導体装置及び半導体装置の製造方法 |
| JP3450803B2 (ja) * | 2000-06-22 | 2003-09-29 | 株式会社東芝 | 樹脂封止型半導体装置 |
| JP2002083927A (ja) * | 2000-09-07 | 2002-03-22 | Matsushita Electric Ind Co Ltd | 半導体装置 |
| JP2002299544A (ja) * | 2001-03-30 | 2002-10-11 | Matsushita Electric Ind Co Ltd | 半導体装置 |
-
2010
- 2010-12-28 JP JP2010292753A patent/JP5292388B2/ja not_active Expired - Fee Related
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