JP2006179158A5 - - Google Patents

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Publication number
JP2006179158A5
JP2006179158A5 JP2004374314A JP2004374314A JP2006179158A5 JP 2006179158 A5 JP2006179158 A5 JP 2006179158A5 JP 2004374314 A JP2004374314 A JP 2004374314A JP 2004374314 A JP2004374314 A JP 2004374314A JP 2006179158 A5 JP2006179158 A5 JP 2006179158A5
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Japan
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semiconductor device
potential
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JP2004374314A
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English (en)
Japanese (ja)
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JP2006179158A (ja
JP4606869B2 (ja
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Priority to JP2004374314A priority Critical patent/JP4606869B2/ja
Priority claimed from JP2004374314A external-priority patent/JP4606869B2/ja
Priority to US11/313,833 priority patent/US7239562B2/en
Publication of JP2006179158A publication Critical patent/JP2006179158A/ja
Priority to US11/797,843 priority patent/US7336544B2/en
Publication of JP2006179158A5 publication Critical patent/JP2006179158A5/ja
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Publication of JP4606869B2 publication Critical patent/JP4606869B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004374314A 2004-12-24 2004-12-24 半導体装置 Expired - Fee Related JP4606869B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004374314A JP4606869B2 (ja) 2004-12-24 2004-12-24 半導体装置
US11/313,833 US7239562B2 (en) 2004-12-24 2005-12-22 Semiconductor device
US11/797,843 US7336544B2 (en) 2004-12-24 2007-05-08 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004374314A JP4606869B2 (ja) 2004-12-24 2004-12-24 半導体装置

Publications (3)

Publication Number Publication Date
JP2006179158A JP2006179158A (ja) 2006-07-06
JP2006179158A5 true JP2006179158A5 (enExample) 2007-07-19
JP4606869B2 JP4606869B2 (ja) 2011-01-05

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ID=36683702

Family Applications (1)

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JP2004374314A Expired - Fee Related JP4606869B2 (ja) 2004-12-24 2004-12-24 半導体装置

Country Status (2)

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US (2) US7239562B2 (enExample)
JP (1) JP4606869B2 (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4210942B2 (ja) * 2005-02-23 2009-01-21 株式会社デンソー 車両用衝突物体判別装置
US7391639B2 (en) * 2006-02-14 2008-06-24 Infineon Technologies Ag Memory device and method for reading data
US7436708B2 (en) * 2006-03-01 2008-10-14 Micron Technology, Inc. NAND memory device column charging
JP4195715B2 (ja) 2006-07-31 2008-12-10 シャープ株式会社 半導体記憶装置
US7885102B2 (en) 2006-09-15 2011-02-08 Renesas Electronics Corporation Semiconductor device
US20080101110A1 (en) * 2006-10-25 2008-05-01 Thomas Happ Combined read/write circuit for memory
JP4524684B2 (ja) * 2006-11-21 2010-08-18 エルピーダメモリ株式会社 メモリ読み出し回路及び方式
JP5396011B2 (ja) * 2007-06-19 2014-01-22 ピーエスフォー ルクスコ エスエイアールエル 相変化メモリ装置
JP5159224B2 (ja) 2007-09-21 2013-03-06 株式会社東芝 抵抗変化メモリ装置
US7535783B2 (en) * 2007-10-01 2009-05-19 International Business Machines Corporation Apparatus and method for implementing precise sensing of PCRAM devices
JP2009117003A (ja) * 2007-11-09 2009-05-28 Toshiba Corp 不揮発性メモリ装置のデータ読み出し方法
US7778065B2 (en) * 2008-02-29 2010-08-17 International Business Machines Corporation Method and apparatus for implementing concurrent multiple level sensing operation for resistive memory devices
KR20100013645A (ko) 2008-07-31 2010-02-10 삼성전자주식회사 가변 저항 메모리 장치 및 그것의 쓰기 방법
JP2010044827A (ja) 2008-08-13 2010-02-25 Toshiba Corp 不揮発性半導体記憶装置
JP5178448B2 (ja) * 2008-10-17 2013-04-10 株式会社東芝 不揮発性半導体記憶装置
KR101001144B1 (ko) * 2009-05-12 2010-12-17 주식회사 하이닉스반도체 상변환 메모리 장치
US8050109B2 (en) * 2009-08-10 2011-11-01 Sandisk 3D Llc Semiconductor memory with improved memory block switching
JP5603480B2 (ja) * 2010-04-13 2014-10-08 コンバーサント・インテレクチュアル・プロパティ・マネジメント・インコーポレイテッド 二重書込みドライバを有する相変化メモリ
CN102859602A (zh) * 2010-04-13 2013-01-02 莫塞德技术公司 具有双写入驱动器的相变存储器
KR20110118874A (ko) * 2010-04-26 2011-11-02 삼성전자주식회사 반도체 장치, 이를 포함하는 반도체 시스템, 및 상기 반도체 장치의 동작 방법
JP2011258288A (ja) * 2010-06-10 2011-12-22 Toshiba Corp 半導体記憶装置
KR101278103B1 (ko) 2011-09-26 2013-06-24 에스케이하이닉스 주식회사 불휘발성 메모리 장치 및 그것의 프로그램 방법
US8582380B2 (en) * 2011-12-21 2013-11-12 Micron Technology, Inc. Systems, circuits, and methods for charge sharing
US20140140124A1 (en) * 2012-11-21 2014-05-22 Dong-seok Kang Resistive memory device having selective sensing operation and access control method thereof
JP5450846B2 (ja) * 2013-01-16 2014-03-26 株式会社東芝 不揮発性半導体記憶装置
US9001559B2 (en) 2013-03-22 2015-04-07 Masahiro Takahashi Resistance change memory
US9165647B1 (en) * 2014-06-04 2015-10-20 Intel Corporation Multistage memory cell read
TWI618074B (zh) * 2017-03-06 2018-03-11 力旺電子股份有限公司 一次編程非揮發性記憶體及其讀取感測方法
KR102671481B1 (ko) 2019-07-19 2024-06-03 삼성전자주식회사 메모리 셀의 멀티-턴 온을 방지하기 위한 메모리 장치 및 그것의 동작 방법
CN115004300B (zh) * 2021-08-19 2025-05-16 长江先进存储产业创新中心有限责任公司 存储器装置及其控制方法
KR102636041B1 (ko) 2021-10-20 2024-02-14 에스케이키파운드리 주식회사 메모리 셀 독출 회로
CN119495340A (zh) * 2024-10-22 2025-02-21 新存科技(武汉)有限责任公司 相变存储器及操作方法

Family Cites Families (10)

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Publication number Priority date Publication date Assignee Title
TW299448B (enExample) * 1995-07-20 1997-03-01 Matsushita Electric Industrial Co Ltd
JP3592887B2 (ja) * 1997-04-30 2004-11-24 株式会社東芝 不揮発性半導体記憶装置
JP3633354B2 (ja) * 1999-03-29 2005-03-30 株式会社日立製作所 半導体装置
JP2001067884A (ja) * 1999-08-31 2001-03-16 Hitachi Ltd 不揮発性半導体記憶装置
US6314014B1 (en) * 1999-12-16 2001-11-06 Ovonyx, Inc. Programmable resistance memory arrays with reference cells
JP4731041B2 (ja) * 2001-05-16 2011-07-20 ルネサスエレクトロニクス株式会社 薄膜磁性体記憶装置
US7116593B2 (en) * 2002-02-01 2006-10-03 Hitachi, Ltd. Storage device
JP4392680B2 (ja) * 2002-09-05 2010-01-06 エルピーダメモリ株式会社 半導体記憶装置
DE60323202D1 (de) * 2003-02-21 2008-10-09 St Microelectronics Srl Phasenwechselspeicheranordnung
JP4381278B2 (ja) * 2004-10-14 2009-12-09 株式会社東芝 不揮発性半導体記憶装置の制御方法

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