JP2006140473A5 - - Google Patents

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Publication number
JP2006140473A5
JP2006140473A5 JP2005320823A JP2005320823A JP2006140473A5 JP 2006140473 A5 JP2006140473 A5 JP 2006140473A5 JP 2005320823 A JP2005320823 A JP 2005320823A JP 2005320823 A JP2005320823 A JP 2005320823A JP 2006140473 A5 JP2006140473 A5 JP 2006140473A5
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JP
Japan
Prior art keywords
annular band
substrate support
peripheral edge
assembly
substrate
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JP2005320823A
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English (en)
Japanese (ja)
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JP4808467B2 (ja
JP2006140473A (ja
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Priority claimed from US10/981,261 external-priority patent/US7670436B2/en
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Publication of JP2006140473A5 publication Critical patent/JP2006140473A5/ja
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Publication of JP4808467B2 publication Critical patent/JP4808467B2/ja
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JP2005320823A 2004-11-03 2005-11-04 基板リングアセンブリ及び基板処理チャンバ Expired - Lifetime JP4808467B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/981,261 2004-11-03
US10/981,261 US7670436B2 (en) 2004-11-03 2004-11-03 Support ring assembly

Publications (3)

Publication Number Publication Date
JP2006140473A JP2006140473A (ja) 2006-06-01
JP2006140473A5 true JP2006140473A5 (enExample) 2011-03-31
JP4808467B2 JP4808467B2 (ja) 2011-11-02

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JP2005320823A Expired - Lifetime JP4808467B2 (ja) 2004-11-03 2005-11-04 基板リングアセンブリ及び基板処理チャンバ

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US (1) US7670436B2 (enExample)
JP (1) JP4808467B2 (enExample)
KR (1) KR101267466B1 (enExample)
CN (1) CN100437969C (enExample)
TW (1) TWI328267B (enExample)

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