JP2011518255A5 - - Google Patents

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Publication number
JP2011518255A5
JP2011518255A5 JP2011505129A JP2011505129A JP2011518255A5 JP 2011518255 A5 JP2011518255 A5 JP 2011518255A5 JP 2011505129 A JP2011505129 A JP 2011505129A JP 2011505129 A JP2011505129 A JP 2011505129A JP 2011518255 A5 JP2011518255 A5 JP 2011518255A5
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band
inches
cylindrical
deposition ring
ring
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JP2011505129A
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JP2011518255A (ja
JP5916384B2 (ja
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Priority claimed from PCT/US2009/040487 external-priority patent/WO2009154853A2/en
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JP2011505129A 2008-04-16 2009-04-14 ウェハ処理堆積物遮蔽構成材 Active JP5916384B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US4555608P 2008-04-16 2008-04-16
US61/045,556 2008-04-16
US4933408P 2008-04-30 2008-04-30
US61/049,334 2008-04-30
PCT/US2009/040487 WO2009154853A2 (en) 2008-04-16 2009-04-14 Wafer processing deposition shielding components

Publications (3)

Publication Number Publication Date
JP2011518255A JP2011518255A (ja) 2011-06-23
JP2011518255A5 true JP2011518255A5 (enExample) 2012-06-07
JP5916384B2 JP5916384B2 (ja) 2016-05-11

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JP2011505129A Active JP5916384B2 (ja) 2008-04-16 2009-04-14 ウェハ処理堆積物遮蔽構成材

Country Status (6)

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US (3) US20090260982A1 (enExample)
JP (1) JP5916384B2 (enExample)
KR (6) KR101571558B1 (enExample)
CN (1) CN102007572B (enExample)
TW (1) TWI502670B (enExample)
WO (1) WO2009154853A2 (enExample)

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