JP2010513722A5 - - Google Patents
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- Publication number
- JP2010513722A5 JP2010513722A5 JP2009543091A JP2009543091A JP2010513722A5 JP 2010513722 A5 JP2010513722 A5 JP 2010513722A5 JP 2009543091 A JP2009543091 A JP 2009543091A JP 2009543091 A JP2009543091 A JP 2009543091A JP 2010513722 A5 JP2010513722 A5 JP 2010513722A5
- Authority
- JP
- Japan
- Prior art keywords
- processing kit
- main body
- ring
- kit according
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000008021 deposition Effects 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 2
- 229910001220 stainless steel Inorganic materials 0.000 claims 2
- 239000010935 stainless steel Substances 0.000 claims 2
- 229910052719 titanium Inorganic materials 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US87075206P | 2006-12-19 | 2006-12-19 | |
| US60/870,752 | 2006-12-19 | ||
| PCT/US2007/087466 WO2008079722A2 (en) | 2006-12-19 | 2007-12-13 | Non-contact process kit |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010513722A JP2010513722A (ja) | 2010-04-30 |
| JP2010513722A5 true JP2010513722A5 (enExample) | 2010-12-09 |
| JP5666133B2 JP5666133B2 (ja) | 2015-02-12 |
Family
ID=39563165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009543091A Active JP5666133B2 (ja) | 2006-12-19 | 2007-12-13 | 非接触型処理キット |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5666133B2 (enExample) |
| KR (1) | KR101504085B1 (enExample) |
| CN (1) | CN101563560B (enExample) |
| SG (1) | SG177902A1 (enExample) |
| WO (1) | WO2008079722A2 (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8617672B2 (en) | 2005-07-13 | 2013-12-31 | Applied Materials, Inc. | Localized surface annealing of components for substrate processing chambers |
| US9127362B2 (en) | 2005-10-31 | 2015-09-08 | Applied Materials, Inc. | Process kit and target for substrate processing chamber |
| US7942969B2 (en) | 2007-05-30 | 2011-05-17 | Applied Materials, Inc. | Substrate cleaning chamber and components |
| JP5194315B2 (ja) * | 2008-07-04 | 2013-05-08 | 株式会社昭和真空 | スパッタリング装置 |
| US8900471B2 (en) | 2009-02-27 | 2014-12-02 | Applied Materials, Inc. | In situ plasma clean for removal of residue from pedestal surface without breaking vacuum |
| KR101355303B1 (ko) * | 2010-03-24 | 2014-01-23 | 캐논 아네르바 가부시키가이샤 | 전자 디바이스의 제조 방법 및 스퍼터링 방법 |
| SG187625A1 (en) * | 2010-08-20 | 2013-03-28 | Applied Materials Inc | Extended life deposition ring |
| KR101585883B1 (ko) | 2010-10-29 | 2016-01-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 물리적 기상 증착 챔버를 위한 증착 링 및 정전 척 |
| CN102676997A (zh) * | 2012-06-11 | 2012-09-19 | 上海宏力半导体制造有限公司 | 一种物理气相沉积设备 |
| GB2522600B (en) * | 2013-02-28 | 2018-07-11 | Canon Anelva Corp | Sputtering Apparatus |
| CN104746019B (zh) * | 2013-12-26 | 2018-01-19 | 北京北方华创微电子装备有限公司 | 反应腔室及等离子体加工设备 |
| CN105097604B (zh) * | 2014-05-05 | 2018-11-06 | 北京北方华创微电子装备有限公司 | 工艺腔室 |
| CN106460147B (zh) * | 2014-06-13 | 2020-02-11 | 应用材料公司 | 针对较好的均匀性和增加的边缘寿命的平坦边缘设计 |
| US10115573B2 (en) * | 2014-10-14 | 2018-10-30 | Applied Materials, Inc. | Apparatus for high compressive stress film deposition to improve kit life |
| US10546733B2 (en) * | 2014-12-31 | 2020-01-28 | Applied Materials, Inc. | One-piece process kit shield |
| KR20170128585A (ko) * | 2015-03-20 | 2017-11-22 | 어플라이드 머티어리얼스, 인코포레이티드 | 고온 폴리머 본드를 이용하여 금속 베이스에 본딩 결합된 세라믹 정전 척 |
| JP6976925B2 (ja) * | 2015-07-03 | 2021-12-08 | アプライド マテリアルズ インコーポレイテッドApplied Materials, Incorporated | 背高の堆積リングと堆積リングクランプとを有するプロセスキット |
| TWM534436U (en) * | 2015-07-03 | 2016-12-21 | Applied Materials Inc | Frame, multi-piece under substrate cover frame and processing chamber |
| US10103012B2 (en) * | 2015-09-11 | 2018-10-16 | Applied Materials, Inc. | One-piece process kit shield for reducing the impact of an electric field near the substrate |
| JP7225599B2 (ja) * | 2018-08-10 | 2023-02-21 | 東京エレクトロン株式会社 | 成膜装置 |
| US11961723B2 (en) | 2018-12-17 | 2024-04-16 | Applied Materials, Inc. | Process kit having tall deposition ring for PVD chamber |
| CN110670049A (zh) * | 2019-11-19 | 2020-01-10 | 武汉新芯集成电路制造有限公司 | 一种气相沉积方法及装置 |
| TW202129045A (zh) | 2019-12-05 | 2021-08-01 | 美商應用材料股份有限公司 | 多陰極沉積系統與方法 |
| CN111471976A (zh) * | 2020-05-21 | 2020-07-31 | 中国科学院半导体研究所 | 衬底托 |
| US11492697B2 (en) * | 2020-06-22 | 2022-11-08 | Applied Materials, Inc. | Apparatus for improved anode-cathode ratio for rf chambers |
| US11600477B2 (en) * | 2020-12-14 | 2023-03-07 | Applied Materials, Inc. | Gas injection process kit to eliminate arcing and improve uniform gas distribution for a PVD process |
| CN114717514B (zh) * | 2021-01-06 | 2023-12-15 | 鑫天虹(厦门)科技有限公司 | 薄膜沉积设备 |
| US20240186176A1 (en) * | 2022-12-02 | 2024-06-06 | Onto Innovation Inc. | Stage actuator particle shield |
| CN117305814A (zh) * | 2023-09-22 | 2023-12-29 | 上海中欣晶圆半导体科技有限公司 | 一种常压化学气相沉积用治具及其使用方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6174377B1 (en) * | 1997-03-03 | 2001-01-16 | Genus, Inc. | Processing chamber for atomic layer deposition processes |
| US20030049372A1 (en) | 1997-08-11 | 2003-03-13 | Cook Robert C. | High rate deposition at low pressures in a small batch reactor |
| US6051122A (en) * | 1997-08-21 | 2000-04-18 | Applied Materials, Inc. | Deposition shield assembly for a semiconductor wafer processing system |
| JPH11229132A (ja) * | 1998-02-19 | 1999-08-24 | Toshiba Corp | スパッタ成膜装置およびスパッタ成膜方法 |
| CN1172022C (zh) * | 2001-10-11 | 2004-10-20 | 矽统科技股份有限公司 | 沉积过程的工作平台 |
| GB2401375B (en) * | 2002-02-14 | 2005-08-31 | Trikon Technologies Ltd | Plasma processing apparatus |
| US7670436B2 (en) * | 2004-11-03 | 2010-03-02 | Applied Materials, Inc. | Support ring assembly |
| US7579067B2 (en) * | 2004-11-24 | 2009-08-25 | Applied Materials, Inc. | Process chamber component with layered coating and method |
-
2007
- 2007-12-13 JP JP2009543091A patent/JP5666133B2/ja active Active
- 2007-12-13 WO PCT/US2007/087466 patent/WO2008079722A2/en not_active Ceased
- 2007-12-13 CN CN2007800470734A patent/CN101563560B/zh active Active
- 2007-12-13 SG SG2011094000A patent/SG177902A1/en unknown
- 2007-12-13 KR KR1020097014871A patent/KR101504085B1/ko active Active
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