JP2010513722A5 - - Google Patents
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- Publication number
- JP2010513722A5 JP2010513722A5 JP2009543091A JP2009543091A JP2010513722A5 JP 2010513722 A5 JP2010513722 A5 JP 2010513722A5 JP 2009543091 A JP2009543091 A JP 2009543091A JP 2009543091 A JP2009543091 A JP 2009543091A JP 2010513722 A5 JP2010513722 A5 JP 2010513722A5
- Authority
- JP
- Japan
- Prior art keywords
- processing kit
- main body
- ring
- kit according
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000008021 deposition Effects 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 2
- 229910001220 stainless steel Inorganic materials 0.000 claims 2
- 239000010935 stainless steel Substances 0.000 claims 2
- 229910052719 titanium Inorganic materials 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US87075206P | 2006-12-19 | 2006-12-19 | |
| US60/870,752 | 2006-12-19 | ||
| PCT/US2007/087466 WO2008079722A2 (en) | 2006-12-19 | 2007-12-13 | Non-contact process kit |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010513722A JP2010513722A (ja) | 2010-04-30 |
| JP2010513722A5 true JP2010513722A5 (enExample) | 2010-12-09 |
| JP5666133B2 JP5666133B2 (ja) | 2015-02-12 |
Family
ID=39563165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009543091A Active JP5666133B2 (ja) | 2006-12-19 | 2007-12-13 | 非接触型処理キット |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5666133B2 (enExample) |
| KR (1) | KR101504085B1 (enExample) |
| CN (1) | CN101563560B (enExample) |
| SG (1) | SG177902A1 (enExample) |
| WO (1) | WO2008079722A2 (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8617672B2 (en) | 2005-07-13 | 2013-12-31 | Applied Materials, Inc. | Localized surface annealing of components for substrate processing chambers |
| US9127362B2 (en) | 2005-10-31 | 2015-09-08 | Applied Materials, Inc. | Process kit and target for substrate processing chamber |
| US7942969B2 (en) | 2007-05-30 | 2011-05-17 | Applied Materials, Inc. | Substrate cleaning chamber and components |
| JP5194315B2 (ja) * | 2008-07-04 | 2013-05-08 | 株式会社昭和真空 | スパッタリング装置 |
| US8900471B2 (en) | 2009-02-27 | 2014-12-02 | Applied Materials, Inc. | In situ plasma clean for removal of residue from pedestal surface without breaking vacuum |
| WO2011117916A1 (ja) * | 2010-03-24 | 2011-09-29 | キヤノンアネルバ株式会社 | 電子デバイスの製造方法およびスパッタリング方法 |
| SG187625A1 (en) * | 2010-08-20 | 2013-03-28 | Applied Materials Inc | Extended life deposition ring |
| CN105177519B (zh) * | 2010-10-29 | 2018-03-27 | 应用材料公司 | 用于物理气相沉积腔室的沉积环及静电夹盘 |
| CN102676997A (zh) * | 2012-06-11 | 2012-09-19 | 上海宏力半导体制造有限公司 | 一种物理气相沉积设备 |
| GB2522600B (en) * | 2013-02-28 | 2018-07-11 | Canon Anelva Corp | Sputtering Apparatus |
| CN104746019B (zh) * | 2013-12-26 | 2018-01-19 | 北京北方华创微电子装备有限公司 | 反应腔室及等离子体加工设备 |
| CN105097604B (zh) * | 2014-05-05 | 2018-11-06 | 北京北方华创微电子装备有限公司 | 工艺腔室 |
| WO2015188879A1 (en) * | 2014-06-13 | 2015-12-17 | Applied Materials, Inc. | Flat edge design for better uniformity and increased edge lifetime |
| US10115573B2 (en) * | 2014-10-14 | 2018-10-30 | Applied Materials, Inc. | Apparatus for high compressive stress film deposition to improve kit life |
| US10546733B2 (en) * | 2014-12-31 | 2020-01-28 | Applied Materials, Inc. | One-piece process kit shield |
| JP6728196B2 (ja) * | 2015-03-20 | 2020-07-22 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 高温ポリマー接合によって金属ベースに接合されたセラミックス静電チャック |
| CN109321890A (zh) * | 2015-07-03 | 2019-02-12 | 应用材料公司 | 具有高沉积环及沉积环夹具的处理配件 |
| TWM534436U (en) * | 2015-07-03 | 2016-12-21 | Applied Materials Inc | Frame, multi-piece under substrate cover frame and processing chamber |
| US10103012B2 (en) * | 2015-09-11 | 2018-10-16 | Applied Materials, Inc. | One-piece process kit shield for reducing the impact of an electric field near the substrate |
| JP7225599B2 (ja) * | 2018-08-10 | 2023-02-21 | 東京エレクトロン株式会社 | 成膜装置 |
| US11961723B2 (en) * | 2018-12-17 | 2024-04-16 | Applied Materials, Inc. | Process kit having tall deposition ring for PVD chamber |
| CN110670049A (zh) * | 2019-11-19 | 2020-01-10 | 武汉新芯集成电路制造有限公司 | 一种气相沉积方法及装置 |
| TW202129045A (zh) * | 2019-12-05 | 2021-08-01 | 美商應用材料股份有限公司 | 多陰極沉積系統與方法 |
| US11339466B2 (en) * | 2020-03-20 | 2022-05-24 | Applied Materials, Inc. | Heated shield for physical vapor deposition chamber |
| CN111471976A (zh) * | 2020-05-21 | 2020-07-31 | 中国科学院半导体研究所 | 衬底托 |
| US11492697B2 (en) * | 2020-06-22 | 2022-11-08 | Applied Materials, Inc. | Apparatus for improved anode-cathode ratio for rf chambers |
| CN114717514B (zh) * | 2021-01-06 | 2023-12-15 | 鑫天虹(厦门)科技有限公司 | 薄膜沉积设备 |
| US20240186176A1 (en) * | 2022-12-02 | 2024-06-06 | Onto Innovation Inc. | Stage actuator particle shield |
| CN117305814A (zh) * | 2023-09-22 | 2023-12-29 | 上海中欣晶圆半导体科技有限公司 | 一种常压化学气相沉积用治具及其使用方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6174377B1 (en) * | 1997-03-03 | 2001-01-16 | Genus, Inc. | Processing chamber for atomic layer deposition processes |
| US20030049372A1 (en) * | 1997-08-11 | 2003-03-13 | Cook Robert C. | High rate deposition at low pressures in a small batch reactor |
| US6051122A (en) * | 1997-08-21 | 2000-04-18 | Applied Materials, Inc. | Deposition shield assembly for a semiconductor wafer processing system |
| JPH11229132A (ja) * | 1998-02-19 | 1999-08-24 | Toshiba Corp | スパッタ成膜装置およびスパッタ成膜方法 |
| CN1172022C (zh) * | 2001-10-11 | 2004-10-20 | 矽统科技股份有限公司 | 沉积过程的工作平台 |
| DE10392235T5 (de) * | 2002-02-14 | 2005-07-07 | Trikon Technologies Limited, Newport | Vorrichtung zur Plasmabearbeitung |
| US7670436B2 (en) * | 2004-11-03 | 2010-03-02 | Applied Materials, Inc. | Support ring assembly |
| US7579067B2 (en) * | 2004-11-24 | 2009-08-25 | Applied Materials, Inc. | Process chamber component with layered coating and method |
-
2007
- 2007-12-13 CN CN2007800470734A patent/CN101563560B/zh active Active
- 2007-12-13 JP JP2009543091A patent/JP5666133B2/ja active Active
- 2007-12-13 SG SG2011094000A patent/SG177902A1/en unknown
- 2007-12-13 KR KR1020097014871A patent/KR101504085B1/ko active Active
- 2007-12-13 WO PCT/US2007/087466 patent/WO2008079722A2/en not_active Ceased
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