JP2011520034A5 - - Google Patents

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Publication number
JP2011520034A5
JP2011520034A5 JP2011507660A JP2011507660A JP2011520034A5 JP 2011520034 A5 JP2011520034 A5 JP 2011520034A5 JP 2011507660 A JP2011507660 A JP 2011507660A JP 2011507660 A JP2011507660 A JP 2011507660A JP 2011520034 A5 JP2011520034 A5 JP 2011520034A5
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Japan
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band
shield
cylindrical
ring
width
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JP2011507660A
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English (en)
Japanese (ja)
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JP2011520034A (ja
JP5762281B2 (ja
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Priority claimed from PCT/US2009/042387 external-priority patent/WO2009135050A2/en
Publication of JP2011520034A publication Critical patent/JP2011520034A/ja
Publication of JP2011520034A5 publication Critical patent/JP2011520034A5/ja
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JP2011507660A 2008-05-02 2009-04-30 Ｒｆ物理気相蒸着用処理キット Active JP5762281B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US5011208P 2008-05-02 2008-05-02
US61/050,112 2008-05-02
PCT/US2009/042387 WO2009135050A2 (en) 2008-05-02 2009-04-30 Process kit for rf physical vapor deposition

Publications (3)

Publication Number Publication Date
JP2011520034A JP2011520034A (ja) 2011-07-14
JP2011520034A5 true JP2011520034A5 (enExample) 2012-06-21
JP5762281B2 JP5762281B2 (ja) 2015-08-12

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ID=41255822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011507660A Active JP5762281B2 (ja) 2008-05-02 2009-04-30 Ｒｆ物理気相蒸着用処理キット

Country Status (6)

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US (2) US9123511B2 (enExample)
JP (1) JP5762281B2 (enExample)
KR (1) KR101511027B1 (enExample)
CN (1) CN102017077B (enExample)
TW (1) TWI494454B (enExample)
WO (1) WO2009135050A2 (enExample)

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CN111602235B (zh) * 2018-01-29 2025-03-14 应用材料公司 用于在pvd处理中减少颗粒的处理配件几何形状
CN110838429B (zh) * 2018-08-15 2022-07-22 北京北方华创微电子装备有限公司 腔体内衬、等离子体反应腔室和等离子体设备
US11361982B2 (en) * 2019-12-10 2022-06-14 Applied Materials, Inc. Methods and apparatus for in-situ cleaning of electrostatic chucks
CN113035679B (zh) * 2019-12-24 2023-09-29 中微半导体设备(上海)股份有限公司 一种等离子体处理装置
US11443921B2 (en) * 2020-06-11 2022-09-13 Applied Materials, Inc. Radio frequency ground system and method
CN113808900B (zh) * 2020-06-17 2023-09-29 中微半导体设备(上海)股份有限公司 一种等离子体处理装置及其约束环组件与方法
US11670492B2 (en) * 2020-10-15 2023-06-06 Applied Materials, Inc. Chamber configurations and processes for particle control
CN115074679B (zh) * 2021-03-11 2025-02-11 台湾积体电路制造股份有限公司 形成半导体结构的方法和物理气相沉积装置及方法
CN114446495B (zh) * 2022-01-18 2024-08-23 大连理工大学 一种面向等离子体带收集脱落物的倒置样品台
CN117012605A (zh) * 2022-04-29 2023-11-07 中微半导体设备(上海)股份有限公司 等离子体处理装置、隔离环及其制作方法
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