JP2019535905A5 - - Google Patents
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- Publication number
- JP2019535905A5 JP2019535905A5 JP2019526557A JP2019526557A JP2019535905A5 JP 2019535905 A5 JP2019535905 A5 JP 2019535905A5 JP 2019526557 A JP2019526557 A JP 2019526557A JP 2019526557 A JP2019526557 A JP 2019526557A JP 2019535905 A5 JP2019535905 A5 JP 2019535905A5
- Authority
- JP
- Japan
- Prior art keywords
- adapter
- shadow ring
- ring
- adapter body
- present disclosure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000012212 insulator Substances 0.000 description 2
- 238000005477 sputtering target Methods 0.000 description 2
- 239000002826 coolant Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IN201611039546 | 2016-11-19 | ||
| PCT/US2017/061979 WO2018094024A1 (en) | 2016-11-19 | 2017-11-16 | Process kit having a floating shadow ring |
| US15/814,696 US10648071B2 (en) | 2016-11-19 | 2017-11-16 | Process kit having a floating shadow ring |
| US15/814,696 | 2017-11-16 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019535905A JP2019535905A (ja) | 2019-12-12 |
| JP2019535905A5 true JP2019535905A5 (enExample) | 2020-12-24 |
| JP7117300B2 JP7117300B2 (ja) | 2022-08-12 |
Family
ID=62144331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019526557A Active JP7117300B2 (ja) | 2016-11-19 | 2017-11-16 | 浮遊シャドウリングを有するプロセスキット |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10648071B2 (enExample) |
| JP (1) | JP7117300B2 (enExample) |
| KR (1) | KR102474786B1 (enExample) |
| CN (1) | CN110036136B (enExample) |
| TW (1) | TWI744417B (enExample) |
| WO (1) | WO2018094024A1 (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10886113B2 (en) | 2016-11-25 | 2021-01-05 | Applied Materials, Inc. | Process kit and method for processing a substrate |
| WO2020090164A1 (ja) * | 2018-10-30 | 2020-05-07 | 株式会社アルバック | 真空処理装置 |
| CN109735814B (zh) * | 2019-01-23 | 2023-12-22 | 北京北方华创微电子装备有限公司 | 磁控溅射反应腔室的冷却组件及其磁控溅射设备 |
| US11887878B2 (en) * | 2019-06-28 | 2024-01-30 | Applied Materials, Inc. | Detachable biasable electrostatic chuck for high temperature applications |
| US11361982B2 (en) * | 2019-12-10 | 2022-06-14 | Applied Materials, Inc. | Methods and apparatus for in-situ cleaning of electrostatic chucks |
| KR102791334B1 (ko) | 2019-12-31 | 2025-04-08 | 삼성전자주식회사 | 에지 링 및 이를 갖는 기판 처리 장치 |
| US11935728B2 (en) * | 2020-01-31 | 2024-03-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method of manufacturing a semiconductor device |
| US20210265137A1 (en) * | 2020-02-26 | 2021-08-26 | Intel Corporation | Reconditioning of reactive process chamber components for reduced surface oxidation |
| USD934315S1 (en) | 2020-03-20 | 2021-10-26 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| USD941372S1 (en) | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| US11339466B2 (en) * | 2020-03-20 | 2022-05-24 | Applied Materials, Inc. | Heated shield for physical vapor deposition chamber |
| USD941371S1 (en) | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| US11492697B2 (en) * | 2020-06-22 | 2022-11-08 | Applied Materials, Inc. | Apparatus for improved anode-cathode ratio for rf chambers |
| JP7223738B2 (ja) * | 2020-11-12 | 2023-02-16 | 株式会社アルバック | スパッタリング装置 |
| US20220178021A1 (en) * | 2020-12-08 | 2022-06-09 | Skytech Co., Ltd. | Wafer fixing mechanism and wafer pre-cleaning machine using the wafer fixing mechanism |
| TWI749956B (zh) * | 2020-12-18 | 2021-12-11 | 天虹科技股份有限公司 | 薄膜沉積裝置 |
| KR20230041917A (ko) | 2021-09-17 | 2023-03-27 | 삼성전자주식회사 | 건식 식각 장치 및 이를 이용한 웨이퍼 식각 시스템 |
| US12183559B2 (en) | 2021-10-22 | 2024-12-31 | Applied Materials, Inc. | Apparatus for temperature control in a substrate processing chamber |
| USD1066275S1 (en) | 2022-04-04 | 2025-03-11 | Applied Materials, Inc. | Baffle for anti-rotation process kit for substrate processing chamber |
| USD1049067S1 (en) * | 2022-04-04 | 2024-10-29 | Applied Materials, Inc. | Ring for an anti-rotation process kit for a substrate processing chamber |
| US20230357929A1 (en) * | 2022-05-05 | 2023-11-09 | Applied Materials, Inc. | Apparatus and methods to promote wafer edge temperature uniformity |
| CN120380193A (zh) * | 2022-07-08 | 2025-07-25 | 东曹Smd有限公司 | 用于物理气相沉积溅射应用的动态真空密封系统 |
| US20240018648A1 (en) * | 2022-07-14 | 2024-01-18 | Applied Materials, Inc. | Purge Ring for Reduced Substrate Backside Deposition |
| US12371790B2 (en) * | 2022-08-17 | 2025-07-29 | Sky Tech Inc. | Wafer carrier with adjustable alignment devices and deposition equipment using the same |
| USD1086087S1 (en) * | 2023-03-30 | 2025-07-29 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
| US20240384396A1 (en) * | 2023-05-18 | 2024-11-21 | Applied Materials, Inc. | Biased or floating process shield to reduce ion loss to control film deposition and improve step coverage |
| US12392023B1 (en) * | 2024-05-03 | 2025-08-19 | Applied Materials, Inc. | Methods and apparatus for depositing amorphous indium tin oxide film |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5922133A (en) * | 1997-09-12 | 1999-07-13 | Applied Materials, Inc. | Multiple edge deposition exclusion rings |
| US6296712B1 (en) * | 1997-12-02 | 2001-10-02 | Applied Materials, Inc. | Chemical vapor deposition hardware and process |
| US6589352B1 (en) | 1999-12-10 | 2003-07-08 | Applied Materials, Inc. | Self aligning non contact shadow ring process kit |
| JP4902051B2 (ja) * | 2001-03-30 | 2012-03-21 | キヤノンアネルバ株式会社 | バイアススパッタリング装置 |
| US7718045B2 (en) | 2006-06-27 | 2010-05-18 | Applied Materials, Inc. | Ground shield with reentrant feature |
| US7981262B2 (en) | 2007-01-29 | 2011-07-19 | Applied Materials, Inc. | Process kit for substrate processing chamber |
| US20080257263A1 (en) * | 2007-04-23 | 2008-10-23 | Applied Materials, Inc. | Cooling shield for substrate processing chamber |
| KR101571558B1 (ko) * | 2008-04-16 | 2015-11-24 | 어플라이드 머티어리얼스, 인코포레이티드 | 웨이퍼 프로세싱 증착 차폐 컴포넌트들 |
| US9834840B2 (en) * | 2010-05-14 | 2017-12-05 | Applied Materials, Inc. | Process kit shield for improved particle reduction |
| US20150170955A1 (en) * | 2013-12-17 | 2015-06-18 | Applied Materials, Inc. | Actively-cooled shadow ring for heat dissipation in plasma chamber |
| CN105506570B (zh) | 2014-10-16 | 2018-11-06 | 北京北方华创微电子装备有限公司 | 一种压环组件及物理气相沉积设备 |
-
2017
- 2017-11-16 JP JP2019526557A patent/JP7117300B2/ja active Active
- 2017-11-16 US US15/814,696 patent/US10648071B2/en active Active
- 2017-11-16 KR KR1020197017687A patent/KR102474786B1/ko active Active
- 2017-11-16 CN CN201780075172.7A patent/CN110036136B/zh active Active
- 2017-11-16 WO PCT/US2017/061979 patent/WO2018094024A1/en not_active Ceased
- 2017-11-17 TW TW106139809A patent/TWI744417B/zh active
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