JP2006123001A5 - - Google Patents

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Publication number
JP2006123001A5
JP2006123001A5 JP2005050173A JP2005050173A JP2006123001A5 JP 2006123001 A5 JP2006123001 A5 JP 2006123001A5 JP 2005050173 A JP2005050173 A JP 2005050173A JP 2005050173 A JP2005050173 A JP 2005050173A JP 2006123001 A5 JP2006123001 A5 JP 2006123001A5
Authority
JP
Japan
Prior art keywords
solder
weight
copper
silicon
germanium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005050173A
Other languages
English (en)
Japanese (ja)
Other versions
JP4048288B2 (ja
JP2006123001A (ja
Filing date
Publication date
Priority claimed from GB0423860A external-priority patent/GB2406101C/en
Application filed filed Critical
Publication of JP2006123001A publication Critical patent/JP2006123001A/ja
Publication of JP2006123001A5 publication Critical patent/JP2006123001A5/ja
Application granted granted Critical
Publication of JP4048288B2 publication Critical patent/JP4048288B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2005050173A 2004-10-27 2005-02-25 はんだ Expired - Lifetime JP4048288B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0423860A GB2406101C (en) 2004-10-27 2004-10-27 Improvements in ro relating to solders

Publications (3)

Publication Number Publication Date
JP2006123001A JP2006123001A (ja) 2006-05-18
JP2006123001A5 true JP2006123001A5 (enExample) 2007-03-15
JP4048288B2 JP4048288B2 (ja) 2008-02-20

Family

ID=33515637

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005050173A Expired - Lifetime JP4048288B2 (ja) 2004-10-27 2005-02-25 はんだ

Country Status (17)

Country Link
US (2) US20060088439A1 (enExample)
EP (1) EP1815034B1 (enExample)
JP (1) JP4048288B2 (enExample)
KR (1) KR100886768B1 (enExample)
CN (1) CN100497693C (enExample)
AT (1) ATE417941T1 (enExample)
AU (1) AU2005298466B2 (enExample)
BR (1) BRPI0517384B1 (enExample)
DE (1) DE602005011848D1 (enExample)
DK (1) DK1815034T3 (enExample)
GB (1) GB2406101C (enExample)
IL (1) IL180932A (enExample)
MX (1) MX2007003369A (enExample)
MY (1) MY136213A (enExample)
NO (1) NO333370B1 (enExample)
RU (1) RU2356975C2 (enExample)
WO (1) WO2006045995A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8308053B2 (en) 2005-08-31 2012-11-13 Micron Technology, Inc. Microfeature workpieces having alloyed conductive structures, and associated methods
US7629249B2 (en) 2006-08-28 2009-12-08 Micron Technology, Inc. Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
CN103008903A (zh) * 2007-08-14 2013-04-03 株式会社爱科草英 无铅焊料组合物及使用它的印刷电路板与电子器件
CN101848787B (zh) * 2007-08-14 2013-10-23 株式会社爱科草英 无铅焊料组合物及使用它的印刷电路板与电子器件
CN102123820A (zh) * 2007-08-24 2011-07-13 株式会社东芝 接合用组合物
CN101554684A (zh) * 2009-05-19 2009-10-14 广州瀚源电子科技有限公司 一种无铅焊料的减渣方法
RU2441736C1 (ru) * 2010-11-24 2012-02-10 Открытое акционерное общество "Всероссийский институт легких сплавов" (ОАО "ВИЛС") Припой для пайки алюминия и его сплавов
JP6008101B2 (ja) * 2012-08-11 2016-10-19 千住金属工業株式会社 電力用はんだ
RU2662176C2 (ru) * 2014-04-30 2018-07-24 Нихон Супериор Ко., Лтд. Бессвинцовый припой
RU2584357C1 (ru) * 2014-11-26 2016-05-20 Открытое акционерное общество "Композит" (ОАО "Композит") Припой для пайки алюминия и его сплавов
BE1025771B1 (nl) * 2017-12-14 2019-07-08 Metallo Belgium Verbeterde koperproductiewerkwijze

Family Cites Families (30)

* Cited by examiner, † Cited by third party
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FR2612035B1 (fr) * 1987-03-03 1989-05-26 Loire Electronique Machine de soudage a l'etain avec pare-vague automatique, pour cartes a circuit imprime
TW251249B (enExample) * 1993-04-30 1995-07-11 At & T Corp
JP3107483B2 (ja) * 1993-07-13 2000-11-06 日本アルミット株式会社 無ないし低含鉛半田合金
US5410184A (en) * 1993-10-04 1995-04-25 Motorola Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same
US5520752A (en) * 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders
JPH0970687A (ja) * 1995-07-04 1997-03-18 Toyota Central Res & Dev Lab Inc 無鉛はんだ合金
WO1997009455A1 (en) 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
JP3874031B2 (ja) 1995-11-29 2007-01-31 内橋エステック株式会社 無鉛はんだ合金
KR980006783A (ko) 1996-05-13 1998-03-30 이. 힐러 윌리엄 저가의 위상 고정 모터 제어 방법 및 구조
JPH1071488A (ja) * 1996-08-29 1998-03-17 Mitsui Mining & Smelting Co Ltd 錫−銀系半田合金
KR19980068127A (ko) * 1997-02-15 1998-10-15 김광호 납땜용 무연 합금
JPH10314980A (ja) 1997-05-14 1998-12-02 Sony Corp はんだ材料
JP3719624B2 (ja) * 1997-06-07 2005-11-24 内橋エステック株式会社 電子部品実装用はんだ及び電子部品の実装方法
JPH11221694A (ja) 1998-02-06 1999-08-17 Hitachi Ltd 鉛フリーはんだを用いた実装構造体およびそれを用いた実装方法
CN1168571C (zh) * 1998-03-26 2004-09-29 斯比瑞尔社股份有限公司 无铅软钎焊料合金
JP2000141078A (ja) 1998-09-08 2000-05-23 Nippon Sheet Glass Co Ltd 無鉛ハンダ
JP2000153388A (ja) * 1998-09-14 2000-06-06 Murata Mfg Co Ltd はんだ付け物品
WO2000018536A1 (en) 1998-09-30 2000-04-06 Matsushita Electric Industrial Co., Ltd. Soldering material and electric/electronic device using the same
JP2000326088A (ja) * 1999-03-16 2000-11-28 Nippon Sheet Glass Co Ltd 無鉛ハンダ
JP3753168B2 (ja) 1999-08-20 2006-03-08 千住金属工業株式会社 微小チップ部品接合用ソルダペースト
JP2001071173A (ja) * 1999-09-06 2001-03-21 Ishikawa Kinzoku Kk 無鉛はんだ
JP2002248596A (ja) * 2001-02-27 2002-09-03 Toshiba Tungaloy Co Ltd 耐酸化性に優れる鉛レス半田ボール
JP2002373824A (ja) * 2001-04-11 2002-12-26 Miura Gokin Kogyosho:Kk 金属化プラスチックフィルムコンデンサの外部電極用無鉛合金
US20030021718A1 (en) * 2001-06-28 2003-01-30 Osamu Munekata Lead-free solder alloy
SG139507A1 (en) * 2001-07-09 2008-02-29 Quantum Chem Tech Singapore Improvements in or relating to solders
TW504427B (en) * 2001-09-25 2002-10-01 Honeywell Int Inc Composition, methods and devices for high temperature lead-free solder
KR100366131B1 (ko) * 2001-11-21 2002-12-31 이재옥 드로스 발생이 적은 저융점 무연땜납
RU2219030C1 (ru) * 2002-05-27 2003-12-20 Открытое акционерное общество "ГАЗ" Припой для низкотемпературной пайки
US7282175B2 (en) * 2003-04-17 2007-10-16 Senju Metal Industry Co., Ltd. Lead-free solder
GB2431412B (en) * 2005-10-24 2009-10-07 Alpha Fry Ltd Lead-free solder alloy

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