JP2014509944A5 - - Google Patents

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Publication number
JP2014509944A5
JP2014509944A5 JP2013552598A JP2013552598A JP2014509944A5 JP 2014509944 A5 JP2014509944 A5 JP 2014509944A5 JP 2013552598 A JP2013552598 A JP 2013552598A JP 2013552598 A JP2013552598 A JP 2013552598A JP 2014509944 A5 JP2014509944 A5 JP 2014509944A5
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JP
Japan
Prior art keywords
weight
solder composition
copper
nickel
zinc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013552598A
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English (en)
Japanese (ja)
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JP2014509944A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2012/023492 external-priority patent/WO2012106434A1/en
Publication of JP2014509944A publication Critical patent/JP2014509944A/ja
Publication of JP2014509944A5 publication Critical patent/JP2014509944A5/ja
Pending legal-status Critical Current

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JP2013552598A 2011-02-04 2012-02-01 無鉛はんだ組成物 Pending JP2014509944A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161439538P 2011-02-04 2011-02-04
US61/439,538 2011-02-04
US201161540213P 2011-09-28 2011-09-28
US61/540,213 2011-09-28
PCT/US2012/023492 WO2012106434A1 (en) 2011-02-04 2012-02-01 Lead-free solder composition

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015231452A Division JP6243893B2 (ja) 2011-02-04 2015-11-27 無鉛はんだ組成物

Publications (2)

Publication Number Publication Date
JP2014509944A JP2014509944A (ja) 2014-04-24
JP2014509944A5 true JP2014509944A5 (enExample) 2015-08-13

Family

ID=45755521

Family Applications (4)

Application Number Title Priority Date Filing Date
JP2013552598A Pending JP2014509944A (ja) 2011-02-04 2012-02-01 無鉛はんだ組成物
JP2015231452A Active JP6243893B2 (ja) 2011-02-04 2015-11-27 無鉛はんだ組成物
JP2017217454A Active JP6846328B2 (ja) 2011-02-04 2017-11-10 無鉛はんだ組成物
JP2019207393A Active JP6928062B2 (ja) 2011-02-04 2019-11-15 無鉛はんだ組成物の製造方法

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2015231452A Active JP6243893B2 (ja) 2011-02-04 2015-11-27 無鉛はんだ組成物
JP2017217454A Active JP6846328B2 (ja) 2011-02-04 2017-11-10 無鉛はんだ組成物
JP2019207393A Active JP6928062B2 (ja) 2011-02-04 2019-11-15 無鉛はんだ組成物の製造方法

Country Status (9)

Country Link
US (4) US8771592B2 (enExample)
EP (2) EP2670560B1 (enExample)
JP (4) JP2014509944A (enExample)
CN (1) CN103476539B (enExample)
CA (1) CA2825629A1 (enExample)
MX (2) MX344239B (enExample)
PL (2) PL2670560T3 (enExample)
TW (3) TWI642510B (enExample)
WO (1) WO2012106434A1 (enExample)

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EP2704873B1 (en) * 2011-05-03 2022-02-09 Pilkington Group Limited Glazing with a soldered connector
KR101438897B1 (ko) 2012-08-13 2014-09-17 현대자동차주식회사 유리용 무연솔더 조성물
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CN108326464A (zh) * 2018-03-13 2018-07-27 苏州塞澳电气有限公司 一种汽车玻璃专用的无铅焊锡
JP7450843B2 (ja) * 2018-09-07 2024-03-18 セントラル硝子プロダクツ株式会社 車両窓用ガラスアッセンブリー
CN111250893A (zh) * 2020-03-12 2020-06-09 南通欢腾机电科技有限公司 一种无铅焊料、其制备方法、其应用及金属端子
CN111872596A (zh) * 2020-07-29 2020-11-03 昆山市宏嘉焊锡制造有限公司 一种铟、铅、银、锑低温钎焊料
US11383330B2 (en) 2020-09-21 2022-07-12 Aptiv Technologies Limited Lead-free solder composition
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CN117139917B (zh) * 2023-10-31 2024-03-08 苏州塞一澳电气有限公司 一种汽车玻璃用无铅焊料及其制备方法和应用

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