TWI222910B - Constituents of solder - Google Patents

Constituents of solder Download PDF

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Publication number
TWI222910B
TWI222910B TW092121256A TW92121256A TWI222910B TW I222910 B TWI222910 B TW I222910B TW 092121256 A TW092121256 A TW 092121256A TW 92121256 A TW92121256 A TW 92121256A TW I222910 B TWI222910 B TW I222910B
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TW
Taiwan
Prior art keywords
solder composition
weight
patent application
scope
item
Prior art date
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TW092121256A
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Chinese (zh)
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TW200505619A (en
Inventor
Cheng-Yi Liu
Shih-Chieh Hsu
Shen-Jie Wang
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Univ Nat Central
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Priority to TW092121256A priority Critical patent/TWI222910B/en
Priority to US10/709,990 priority patent/US20050031483A1/en
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Publication of TWI222910B publication Critical patent/TWI222910B/en
Publication of TW200505619A publication Critical patent/TW200505619A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C18/00—Alloys based on zinc
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/282—Zn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C

Abstract

A solder mixture is suitable for soldering between metal and nonmetal material's to improve the adhesive property between metal and nonmetal materials in soldering. The constituents of the solder mixture comprise Sn-Cr alloy as the major portion, and also contains other elements or compounds changing the character to makes the solder mixture have the ability to solder with great majority of materials.

Description

12229101222910

【發明所屬之技術領域】 本發明是有關於一種銲料組成物 種應用於if接各種材質之銲料組成物 【先前技術】 且特別是有關於 金屬 銲（ 性、 各式 他金 (Sn (Sn 上述 接（ 金屬 須先 黏 等 等 在干料（s ο 1 d e r )係為一種將兩種相同金屬材質 材質在低溫下作結構性連接的接著金屬材料，、同 soldering )技術具有電子封裝上所需求的高；軟 散熱性及接合的高可靠度，所以軟銲已廣泛地靡/用 電子零件之組裝及半導體的封裝技術上。 、在 一般傳統的銲料通常是以錫（Sn)為主體，再力 屬元素所組成之二元合金或多元合金，例如錫^ 土其 —Pb alloy )、錫銀合金（Sn —Ag aU〇y )、錫 人金 一 In alloy )及錫銀銅合金（Sn_Ag_Cu all〇y ) 3 金 之傳統銲料近年來已經大量地使用於接著某些”’ solder able )"的金屬物件。然而，對於大部份、二 材質及許多”不可銲接"之金屬材質進行銲接時，則非 f這些材質的表面鍍上一層金屬墊層，其通常會 著層（adhesive layer)，例如鈦（Ti)或鉻含 以及一層”可銲接"的金屬層，如銅（Cu )或鎳) 在目前之先進的半導體製程技術當中、，常常 晶圓片（s i 1 i con waf er )、玻璃（gl ass )、氦外對矽 (SiNx )、氧化矽（Si〇x )或是各式的散熱材料， 銲接的動作。值得注意的是，傳統銲料在回’行軟銲 ^ weflow)[Technical field to which the invention belongs] The present invention relates to a solder composition that is applied to solder compositions of various materials [prior art], and particularly to metal soldering (all kinds of other metals (Sn (Sn (Sn)) (The metal must be adhered first and so on. The dry material (s ο 1 der) is a kind of bonding metal material that structurally connects two identical metal materials at low temperature, the same as soldering technology.) High; soft heat dissipation and high reliability of bonding, so soft soldering has been widely used in the assembly of electronic components and semiconductor packaging technology. In general, traditional solder is usually tin (Sn) as the main body, and then Binary alloys or multi-component alloys composed of metal elements, such as tin ^ Tu-Pb alloy), tin-silver alloy (Sn-Ag aUy), tin-in gold-In alloy) and tin-silver-copper alloy (Sn_Ag_Cu all〇) y) 3 The traditional solder of gold has been widely used in recent years to follow some "'solderable" metal objects. However, for most, two materials and many "non-solderable" When welding with a metal material, the surface of these non-f materials is plated with a metal backing layer, which usually has an adhesive layer, such as titanium (Ti) or chromium and a "weldable" metal layer, such as Copper (Cu) or nickel) In the current advanced semiconductor process technology, wafers (si 1 i con wafer), glass (gl ass), helium external silicon (SiNx), silicon oxide (Si) x) or all kinds of heat-dissipating materials, soldering action. It is worth noting that the traditional solder is soft soldering in the back row ^ weflow)

第7頁 1222910 皇號 92121256 五、發明說明（2) 的過程中，需要使用助銲 面的氧化層（oxide laye；f )，並& 除接著材質之表 層之後在銲料乂)形成V孔洞，銲劑H，殘留物及去除氧化 料結構的強度。 、广v 01 d 將會破壞整個銲 為了避免上述問題，習知技術 · ^ s—…Li:开銲 料(一-Page 7 1222910 King No. 92121256 5. In the process of the invention description (2), it is necessary to use an oxide layer (oxide laye; f) on the soldering surface, and & in addition to the surface layer of the material, a V hole is formed in the solder 乂, Strength of flux H, residues and oxide structure. , Guang v 01 d will destroy the entire welding. In order to avoid the above problems, the conventional techniques · ^ s — ... Li: open the welding material (一-

^ 1 # t. ^ # 'Λ λ ΐ I 銲料具有表面容易快速氧 〖仁疋，此種活性 (ox.dat.on dross ) ^ ^ 缺點，並且此種活性銲料之1公2【111^山〇)較差等 (brushing)、震動（vibrati〇n)和 '二洗，^ 1 # t. ^ # 'Λ λ ΐ I solder has a surface that is prone to rapid oxygen oxidation. Ren. This kind of activity (ox.dat.on dross) ^ ^ Disadvantages, and this active solder 1 male 2 [111 ^ 山〇) poor brushing, vibrati〇n, and 'second wash,

Ultrasonic pressure )等機械活化，日^加壓 activation )之步驟，用以增加活 （Mchani cal 性，所以在進行銲接時將增加許多 ^料之塗佈性與反應 銲接所需的成本。 ^夕緊複的動作，因而提高 【發明内容】 因此，本發明的目的就是在提供一 用於金屬材質及非金屬材質之間^ 種銲料組成物，適 屬材質及非金屬材質之間於銲二眭=接，用以增加各種金 為了達到上述之目的，；J =著、性。 其主要包括：5〜2 0重量％之絡 ^私出一種銲料組成物， 質係選自於由錫（Sn)、録、） ’其餘重罝％之材 、n )、鉍（B i )、銦（I η )Ultrasonic pressure) steps such as mechanical activation and pressurization activation) are used to increase activity (Mchani cal properties), so when welding is carried out, the coating properties of many materials and the cost required for reactive welding are increased. Therefore, the object of the present invention is to provide a solder composition for metal materials and non-metal materials ^, which is suitable for welding between material and non-metal materials = In order to achieve the above purpose, J is used to increase various kinds of gold; J = Zhu, sex. It mainly includes: 5 ~ 20% by weight of ^ a solder composition, selected from the group consisting of tin (Sn) , Record,) 'The rest of the weight of the material, n), bismuth (B i), indium (I η)

11416twf1.ptc $ 8頁 1222910 案號92121256 年月日 修正 五、發明說明（3) 及此等組合 物。 依照本 包括0 · 0 1〜 素之混合物 依照本 包括0 . 0 1〜 之混合物 依照本 包括0. 01〜 合物，而此 (S m )、鈦 種材質。 依照本 包括0 . 0 1〜 (C u )及此 依照本 包括0. 01〜 依照本 包括0 . 0 1〜 (Co)、锰 依照本 包括0 . 0 1〜 為了達 之 群 族 成 組 所 施族 實鈦 佳之 較% 的量 务ο ^_ 施族 實凱 佳之 較% 的量 {av Jfhil 發ίο 施土 } 實稀IB 佳之II 較%(I 的量族 明重土 發G晞 d 錙 施質族施C施組施C， 實材成實錄實等實鎵的 佳之組佳之佳t此佳之目 較％所較%較 及較%之 的量合的量的e°(}的量述 明重组明重明：ln明重上 、 重Μ ^ ο o ^ rv o 種材質；以及不可避免之不純 例所述，上述之銲料組成物更 (IVB)金屬元素或其金屬元 例所述，上述之銲料組成物更 (VB)金屬元素或其金屬元素 例所述，上述之銲料組成物更 族（I I I B )元素或其元素之混 元素至少包括鈽（Ce)、釤 )及此等組合所組成族群之一 例所述，上述之銲料組成物更 ，其係選自於由銀（Ag)、銅 群之一種材質。 例所述，上述之銲料組成物更 Sb ) 〇 例所述，上述之銲料組成物更 ，其係選自於由鎳（N i )、鈷 合所組成族群之一種材質。 例所述，上述之銲料組成物更 Ga ) 〇 本發明又提出另一種銲料組成11416twf1.ptc $ 8 pages 1222910 Case No. 92121256 Amendment V. Description of Invention (3) and these compositions. According to the present, including a mixture of 0. 0 1 ~ prime. According to the present, including a mixture of 0. 01 to 1. According to the present, a mixture of 0.01 to 1 is included, and this (S m), titanium material. According to the book including 0.01 to 1 (C u) and this according to the book including 0.01 to 1 According to the book including 0.01 to 1 (Co), manganese according to the book including 0.01 to 1 The amount of Shizuishi Titanium is better than the amount of% ο ^ _ The amount of Shizuishi Kate is better than the amount of {% Jfhil 发 ίο Shi Tu} The amount of Rare IB is better than II (The amount of I ’s light weight G 晞 d 锱The quality group is C, group C is applied, the actual material is recorded, and the actual gallium is the best group. The best is the better. The better is the percentage, the percentage, the percentage, and the percentage. Obviously reorganized: ln clearly on the top, heavy ^ ο o ^ rv o kinds of materials; and as described in the unavoidable impure example, the above solder composition is more (IVB) metal element or its metal element example, the above The solder composition is more (VB) metal element or its metal element as described in the example, the above solder composition is more group (IIIB) element or its mixed element including at least 钸 (Ce), 钐) and combinations thereof According to an example of the group, the solder composition described above is further selected from a group consisting of silver (Ag) and copper. More thereof into Sb) the square embodiment, the above composition further solder, which is selected from consisting of nickel (N i), one material of the group consisting of cobalt bonded. According to the example, the above solder composition is more Ga) 〇 The present invention also proposes another solder composition

11416twf1.ptc 第9頁 1222910 _案號92121256_年月日__ 五、發明說明（4) 物，其主要包括：0.01〜5重量％之鉻（Cr);其餘重量 %之材質係選自於由錫（Sn )、鋅（Zn )、鉍（Bi )、銦 (I η )及該等組合所組成族群之一種材質；以及不可避免 之不純物。 依照本發明的較佳實施例所述，上述之銲料組成物更 包括0.01〜10重量％之材質，其係選自於由銀（Ag)、銅 (Cu )及此等組合所組成族群之一種材質。 依照本發明的較佳實施例所述，上述之銲料組成物更 包括0.01〜50重量％之銻（Sb)。 依照本發明的較佳實施例所述，上述之銲料組成物更 包括0.01〜5重量％之材質，其係選自於由鎳（Ni)、鈷 (Co )、錳（Μη )及此等組合所組成族群之一種材質。 依照本發明的較佳實施例所述，上述之銲料組成物更 包括0.01〜10重量％之鎵（Ga)。 基於上述，本發明之銲料組成物的主要成分係為鉻 (C r )，並利用鉻（C r )相對於氧有較高之親和性 (affinity)，且鉻（Cr)易於結合玻璃、金屬或半導體 基材之氧化層上的氧原子，如此將增加此鋅料組成物對於 大部份材質之可濕潤性，並可降低銲料組成物在融熔狀態 下與基材之間的表面能。此外，本發明之銲料組成物更可 添加稀土族（I I I B )、釩族（VB )、鈦族（I VB )及其他 諸如銀（Ag)、銅（Cu)、錄（Sb)、錄（Ni)、钻（Co )、錳（Μ η )及鎵（G a )等元素來調整銲料組成物的性 質，例如增加接合強度及降低熔點等。因此，藉由本發明11416twf1.ptc Page 9 1222910 _ Case No. 92121256_ Year Month Date __ V. Description of the invention (4), which mainly includes: 0.01 ~ 5% by weight of chromium (Cr); the rest of the material by weight is selected from A material of a group consisting of tin (Sn), zinc (Zn), bismuth (Bi), indium (I η), and these combinations; and unavoidable impurities. According to a preferred embodiment of the present invention, the above-mentioned solder composition further includes 0.01 to 10% by weight of a material selected from the group consisting of silver (Ag), copper (Cu), and combinations thereof. Material. According to a preferred embodiment of the present invention, the above solder composition further comprises 0.01 to 50% by weight of antimony (Sb). According to a preferred embodiment of the present invention, the above-mentioned solder composition further includes 0.01 to 5% by weight of a material selected from the group consisting of nickel (Ni), cobalt (Co), manganese (Mn), and combinations thereof. A material of the group. According to a preferred embodiment of the present invention, the above solder composition further comprises 0.01 to 10% by weight of gallium (Ga). Based on the above, the main component of the solder composition of the present invention is chromium (C r), and the use of chromium (C r) has a higher affinity with respect to oxygen, and chromium (Cr) is easily combined with glass and metal Or the oxygen atoms on the oxide layer of the semiconductor substrate. This will increase the wettability of this zinc composition to most materials and reduce the surface energy between the solder composition and the substrate in the molten state. In addition, the solder composition of the present invention can further add rare earth group (IIIB), vanadium group (VB), titanium group (I VB) and other materials such as silver (Ag), copper (Cu), copper (Sb), copper (Ni ), Diamond (Co), manganese (M η), and gallium (Ga) to adjust the properties of the solder composition, such as increasing the bonding strength and lowering the melting point. Therefore, with the present invention

11416twfl.ptc 第10頁 1222910 _案號92121256_年月日 修正_ 五、發明說明（5) 之銲料組成物，銲料之塗佈性更佳、適用性更廣且接合程 序可以更為簡化，而不同材質之間的接合強度亦可大幅提 昇。 為讓本發明之上述和其他目的、特徵、和優點能更明 顯易懂，下文特舉一較佳實施例，並配合所附圖式，作詳 細說明如下： 【實施方式】 本發明之較佳實施例提出兩種銲料組成物。首先，本 發明之較佳實施例的第一種銲料組成物其主要組成元素包 括：5〜20重量％之鉻（Cr)、剩餘重量％之錫（Sn)、 鋅（Ζ η )、鉍（B i )、銦（I η )或其兩個或多個以上之混 合物以及不可避免之不純物。 此外，本發明之較佳實施例的第一種銲料組成物更可 包括：0.01〜10重量％之鈦族（IVB)金屬元素或其金屬 元素之混合物、0. 0 1〜1 0重量％之釩族（VB )金屬元素或 其金屬元素之混合物、0.0 1s*〜20重量％之稀土族（IIIB) 元素或其元素之混合物（包含鑭系元素及锕系元素）、〇 · 01〜10重量％之銀（Ag )、銅（Cu )或其混合物、0. 01〜 50重量％之銻（Sb) 、0.01〜5重量％之鎳（Ni)、鈷 (Co)、錳（Μη)或其混合物或0.01〜10重量％之鎵（Ga )等。 ' 本發明之較佳實施例的第二種銲料組成物其主要組成 元素包括：0.01〜5重量％之鉻（Cr)、剩餘重量％之錫 (Sn)、鋅（Zn)、絲（Bi)、銦（In)或其兩個或多個11416twfl.ptc Page 10 1222910 _ Case No. 92121256_ Year Month Day Amendment _ V. The solder composition of the invention description (5), the solder has better coating properties, wider applicability, and the bonding process can be simplified, and The joint strength between different materials can also be greatly improved. In order to make the above and other objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is given below in conjunction with the accompanying drawings for detailed description as follows: [Embodiment] The best of the present invention The examples propose two solder compositions. First, the main components of the first solder composition of the preferred embodiment of the present invention include: 5 to 20% by weight of chromium (Cr), remaining weight of tin (Sn), zinc (Z η), and bismuth ( B i), indium (I η), a mixture of two or more thereof, and inevitable impurities. In addition, the first solder composition of the preferred embodiment of the present invention may further include: 0.01 to 10% by weight of a titanium group (IVB) metal element or a mixture of metal elements thereof, 0. 1 to 1 0% by weight Vanadium group (VB) metal element or a mixture of metal elements thereof, 0.0 1 s * to 20% by weight of a rare earth group (IIIB) element or a mixture of elements thereof (including lanthanides and actinides), 0.01 to 10 weight % Of silver (Ag), copper (Cu) or mixtures thereof, 0.01 to 50% by weight of antimony (Sb), 0.01 to 5% by weight of nickel (Ni), cobalt (Co), manganese (Μη) or Mixture or 0.01 to 10% by weight of gallium (Ga) and the like. '' The main components of the second solder composition of the preferred embodiment of the present invention include: 0.01 to 5% by weight of chromium (Cr), the remaining weight of tin (Sn), zinc (Zn), and wire (Bi) , Indium (In), or two or more

11416twf1.ptc 第11頁 1222910 _案號92121256_年月曰 修正_ 五、發明說明（6) 以上之混合物以及不可避免之不純物。 此外，本發明之較佳實施例的第二種銲料組成物更可 包括：0· 0 1〜1 0重量％之銀（Ag )、銅（Cu )或其混合 物、0.01〜50重量％之録（Sb) 、0.01〜5重量％之鎳 (N i )、鈷（C 〇 )、錳（Μ η )或其混合物或0 · 0 1〜1 0重量 %之鎵（Ga )。 本發明之銲料組成物的接合溫度大約介於1 0 0 °C〜5 5 0 °C之間。此外，本發明之銲料組成物若以鋅鉻合金 (Zn-Cr alloy)來取代錫鉻合金（Sn-Cr alloy)，用以 作為主要成分的話，則可讓本發明之銲料組成物其接合溫 度約在4 0 0 °C〜7 0 0 °C之間，故可適用於高溫度範圍的接合 程序。 就本發明之銲料組成物而言，當加熱銲料組成物至融 熔狀態時，由於本發明之銲料組成物中的鉻（C r )具有親 氧性，所以這些鉻（Cr )將會聚集到銲料的表面，並與接 合材質之氧化物或氧化層發生反應，而其他的組成元素亦 開始參與反應，因而改變銲料組成物與接合介質之間的表 面能。此外，本發明之鋅料組成物的銀（A g )會降低銲料 組成物於融熔狀態下的表面張力及銲接溫度，並增加接合 完成後的銲接強度。另外，本發明之銲料組成物的銅（Cu )可以增加銲料組成物的濕潤性（尤其是對含鐵材料）， 並可增加接合完成後之銲接強度。再者，本發明之銲料組 成物的鎵（Ga)有助於移除接合材質上的氧化層，並可降 低接合溫度，而其餘如錄（Sb)、鎳（Ni)、始（Co)、11416twf1.ptc Page 11 1222910 _ Case No. 92121256_ Year Month Amendment _ 5. Description of the invention (6) Mixtures of the above and unavoidable impurities. In addition, the second solder composition according to the preferred embodiment of the present invention may further include: 0. 01 to 10 wt% of silver (Ag), copper (Cu) or a mixture thereof, and 0.01 to 50 wt% (Sb), 0.01 to 5% by weight of nickel (N i), cobalt (Co), manganese (Mn), or a mixture thereof, or 0. 0 to 1 to 10% by weight of gallium (Ga). The bonding temperature of the solder composition of the present invention is approximately between 100 ° C and 55 ° C. In addition, if the solder composition of the present invention uses Zn-Cr alloy instead of Sn-Cr alloy as the main component, the solder composition of the present invention can be allowed to have a bonding temperature. Approx. 4 0 ° C ~ 7 0 ° C, so it can be used in the joining process of high temperature range. With regard to the solder composition of the present invention, when the solder composition is heated to a molten state, since chromium (C r) in the solder composition of the present invention has oxygen affinity, these chromium (Cr) will collect to The surface of the solder reacts with the oxide or oxide layer of the bonding material, and other constituent elements also begin to participate in the reaction, thus changing the surface energy between the solder composition and the bonding medium. In addition, the silver (Ag) of the zinc material composition of the present invention reduces the surface tension and soldering temperature of the solder composition in the molten state, and increases the soldering strength after the bonding is completed. In addition, the copper (Cu) of the solder composition of the present invention can increase the wettability of the solder composition (especially for iron-containing materials), and can increase the soldering strength after the bonding is completed. Furthermore, the gallium (Ga) of the solder composition of the present invention helps to remove the oxide layer on the bonding material, and can reduce the bonding temperature, and the rest such as (Sb), nickel (Ni), starting (Co),

11416twfl.ptc 第12頁 1222910 案號 92121256 曰 修正 五、發明說明（7) 鍾（Μη)等，除可改變鲜料組成物之接合溫度以外’更可 ΖΐΓΤ -V、、持.、、明 i廢。 增加銲料組成物之濕潤性及接合完成後的銲接強度。 本發明之銲料組成物可像膠水一樣直接接合至材質表 面，而不需要任何助銲劑。本發明之銲料組成物可良好地 接合至金屬材質、非金屬材質、含氧陶瓷材料、不含氧陶 瓷材料或高分子材料等的表面，並且銲料與銲料之間也具 有相當好的接合性。其中，本發明之銲料組成物可接合的 金屬材質包括銘（A1)、銅（Cu)、鐵（Fe)、不錢鋼 (stainless steel )、鎳（Ni )及鎳麟合金（NiPx) 等。此外，本發明之銲料組成物可接合的非金屬材質包括 氮化物（nitrides)、矽（Si)、玻璃、二五 族〜VB )等所有半導體材料。 ) 本發明之知料組成物乃是以鉻（C r )來取代鈦（τ i )，用以作為主體活化劑（active comp〇nent)，故不一 定需要再添加稀土，（ I丨IB )元素來保護主體活性劑，以 避免其與空氣中的氧接觸，故本發明之銲料组成 在含有氧氣的環境下與材質接合，而不需‘匕以， 銲接的動作時，將可以簡化銲料接合程序广換=”： 要更簡單的步驟，便可以在進行銲接的私你八兩 ί:;!，本發明=目同甚至更好的效果。 乡不上所w斗丄 知抖組成物以錫鉻合全f ςη — Γ alloy)為主體’並加入其它可幫肋改镞祕新从 r 如銀（Ag ) 鎳（Ni 鈷（Co u “η 、銅（CO 、銻（U、助改變性質的元素，例11416twfl.ptc Page 12 1222910 Case No. 92121256 Amendment V. Description of the Invention (7) Bell (Μη), etc. In addition to changing the joining temperature of the fresh ingredients composition, it is more possible to use ZΐΓΤ -V ,,,,,,,,, and i Waste. Increases the wettability of the solder composition and the soldering strength after the bonding is completed. The solder composition of the present invention can be directly bonded to the surface of the material like glue, without the need for any flux. The solder composition of the present invention can be well bonded to the surface of a metal material, a non-metal material, an oxygen-containing ceramic material, an oxygen-free ceramic material, or a polymer material, and the solder and the solder also have a relatively good bonding property. Among them, the metal materials that can be joined by the solder composition of the present invention include Ming (A1), copper (Cu), iron (Fe), stainless steel, nickel, and nickel-plated alloy (NiPx). In addition, the non-metallic materials to which the solder composition of the present invention can be joined include all semiconductor materials such as nitrides, silicon (Si), glass, and two or five groups (VB). ) The knowledge composition of the present invention uses chromium (C r) instead of titanium (τ i) as the main activator (active component), so it is not necessary to add a rare earth, (I 丨 IB) Element to protect the main active agent to prevent it from contacting with oxygen in the air, so the solder composition of the present invention is bonded to the material in an environment containing oxygen, without the need for a dagger. During soldering, solder bonding can be simplified Program wide change = ”: For simpler steps, you can perform welding in two places:;!, The present invention = the same or even better results. Tin-chromium alloy f ηη — Γ alloy) as the main body, and adding other new materials that can help the ribs to change the secrets such as silver (Ag) nickel (Ni cobalt (Co u "η, copper (CO, antimony (U, help change Elements of nature, example

11416twfl.ptc 第13頁 1222910 _案號92121256_年月日__ 五、發明說明（8) )、錳（Μη )或鎵（Ga )等，或上述元素之化合物，使得 本發明之銲料組成物將擁有與絕大部分材質相接合的能 力。再者，相較習知之以錫鈦合金（Sn-Ti alloy)為主 的銲料，本發明之銲料組成物具有較佳的塗佈性，並且銲 料表面光亮、平滑且具有低氧化性。如此一來，即使是表 面濕潤性不好的基材，藉由本發明之銲料組成物的其餘元 素或化合物的輔助，可以讓銲接溫度更低，接合介面強度 更高，銲料的適用性更廣。 雖然本發明已以一較佳實施例揭露如上，然其並非用 以限定本發明，任何熟習此技藝者，在不脫離本發明之精 神和範圍内，當可作些許之更動與潤飾，因此本發明之保 護範圍當視後附之申請專利範圍所界定者為準。11416twfl.ptc Page 13 1222910 _ Case No. 92121256_ Year Month Date __ 5. Description of the invention (8)), manganese (Mn) or gallium (Ga), etc., or a compound of the above elements makes the solder composition of the present invention Will have the ability to interface with most materials. Furthermore, compared with the conventional solders mainly composed of Sn-Ti alloy, the solder composition of the present invention has better coatability, and the surface of the solder is bright, smooth and has low oxidation. In this way, even with a substrate with poor surface wettability, with the aid of the remaining elements or compounds of the solder composition of the present invention, the soldering temperature can be lowered, the joint interface strength can be higher, and the solder's applicability can be wider. Although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make some changes and retouch without departing from the spirit and scope of the present invention. The scope of protection of the invention shall be determined by the scope of the attached patent application.

11416twfl.ptc 第14頁 1222910 案號92121256 年月日 修正11416twfl.ptc Page 14 1222910 Case No. 92121256 Revised

11416twfl.ptc 第15頁11416twfl.ptc Page 15

Claims (2)

1222910 _案號92121256_年月曰 修正_ 六、申請專利範圍 )、锰（Μ η )所組成之族群其中之一。 9 .如申請專利範圍第1項所述之銲料組成物，更包括 0.01〜10重量％之鎵（Ga)。 1 0 . —種銲料組成物，包括： 0· 01〜5重量％之鉻（Cr ); 其餘重量％之材質至少包括錫（Sn )、鋅（Zn )、鉍 (B i )、銦（I η )之組成物；以及 不可避免之不純物。 1 1 .如申請專利範圍第1 0項所述之銲料組成物，更包 括0· 0 1〜10重量％之材質，其係選自於銀（Ag )、銅（Cu )所組成之族群其中之一。 1 2.如申請專利範圍第1 0項所述之銲料組成物，更包 括0· 01〜50重量％之銻（Sb )。 1 3.如申請專利範圍第1 0項所述之銲料組成物，更包 括0· 0 1〜5重量％之材質，其係選自於鎳（Ni )、鈷（Co )、锰（Μ η )所組成之族群其中之一。 1 4.如申請專利範圍第1 0項所述之銲料組成物，更包 括0.01〜10重量％之鎵（Ga)。1222910 _ Case No. 92121256_ Years and months Amendment _ Sixth, the scope of patent application), manganese (M η) is one of the ethnic groups. 9. The solder composition according to item 1 of the scope of patent application, further comprising 0.01 to 10% by weight of gallium (Ga). 1.. — A solder composition, including: 0.01 to 5% by weight of chromium (Cr); the rest of the material by weight includes at least tin (Sn), zinc (Zn), bismuth (Bi), indium (I η); and inevitable impurities. 1 1. The solder composition described in item 10 of the scope of patent application, further comprising a material of 0. 01 to 10% by weight, which is selected from the group consisting of silver (Ag) and copper (Cu) one. 1 2. The solder composition as described in item 10 of the scope of patent application, further comprising 0.01 to 50% by weight of antimony (Sb). 1 3. The solder composition as described in item 10 of the scope of patent application, further comprising a material of 0. 01 to 5 wt%, which is selected from the group consisting of nickel (Ni), cobalt (Co), and manganese (Μη) ). 14. The solder composition according to item 10 of the scope of the patent application, further comprising 0.01 to 10% by weight of gallium (Ga). 11416twf2.ptc 第17頁11416twf2.ptc Page 17 1222910 中文 銲料組成物 發明名稱 英文 CONSTITUENTS OF SOLDER 姓名 (中文） 1. 劉正毓 2. 世杰 姓名 (英文） l.Cheng-Yi Liu 2.Shih-chieh Hsu 發明人 (共3人） (¾) 1.中華民國TW 2.中華民國TW 住居所 (中文: 1·桃園縣中壢市九和一街18號13樓之3 2.屏東市民學路26號 1.13FL-3, No. 18, Jiouhe 1st St., Jungli City, Taoyuan, Taiwan 320, R. 0· C· '2. No.26, Minsyue Rd., Pingtung City, Pingtung County 900, Taiwan 名稱或 姓名 (中文) 名稱或 (英文) 1·國立中央大學 1. National Central University 申請人 (共1人） /住居所 f業戶Ϊ) (中文) \lyN)x 所所文 居業 住營英 1.中華民國TW .·桃園縣中壢市五權里中大路300號（本地址與前向貴局申請者相同） Ν°·1222910 Chinese solder composition invention name in English CONSTITUENTS OF SOLDER Name (Chinese) 1. Liu Zhengyu 2. Shijie Name (English) l. Cheng-Yi Liu 2. Shih-chieh Hsu Inventor (3 people in total) (¾) 1. Republic of China TW 2. TW Residence (Chinese: 1 · 3 · 13th Floor, No.18 Jiuheyi Street, Zhongli City, Taoyuan County 2. Pingtung City Minsheng Road 26 1.13FL-3, No. 18, Jiouhe 1st St., Jungli City, Taoyuan, Taiwan 320, R. 0 · C · '2. No.26, Minsyue Rd., Pingtung City, Pingtung County 900, Taiwan Name or Name (Chinese) Name or (English) 1National Central University 1. National Central University Applicant (1 person in total) / Domicile (Family Business) (Chinese) \ lyN) x Office of Liberal Real Estate Business Yingying 1. TW TW. · Zhongli City, Taoyuan County 300 Quanli Zhongda Road (this address is the same as the previous applicant to your office) Ν ° · 300, Jungda Rd., Jungli City, Taoyuan, Taiwan 320, R. 〇. C 代表人l劉全生 (中文） 代表人 l.Chuan-Sheng Liu (英文）300, Jungda Rd., Jungli City, Taoyuan, Taiwan 320, R. 〇. C Representative l 刘全生 (Chinese) Representative l.Chuan-Sheng Liu (English) 第1頁page 1 六、申請專利範圍 1. 一種銲料組成物，包括： 5〜20重量％之鉻（Cr )； 其餘重量％之材質至少包括錫（Sn )、鋅（Zn )、鉍 (B i )、銦（I η )之組成物；以及 不可避免之不純物。 2 .如申請專利範圍第1項所述之銲料組成物，更包 括：0.01〜10重量％之鈦族（IVB)金屬元素或其金屬元 素之混合物。 3 .如申請專利範圍第1項所述之銲料組成物，更包 括：0.01〜10重量％之飢族（VB)金屬元素或其金屬元素 之混合物。 4.如申請專利範圍第1項所述之銲料組成物，更包 括：0 · 0 1〜2 0重量％之稀土族（I I I B )元素或其元素之混 合物。 5 .如申請專利範圍第4項所述之銲料組成物，其中該 稀土族（I I IB )元素至少包括鈽（Ce )、釤（Sm )、鈥 (Nd )、錙（Lu )所組成之族群其中之一。 6 .如申請專利範圍第1項所述之銲料組成物，更包括 0· 0 1〜10重量％之材質，其係選自於銀（Ag )、銅（Cu ) 所組成之族群其中之一。 7.如申請專利範圍第1項所述之銲料組成物，更包括 0· 01〜50重量％之銻（Sb )。 8 .如申請專利範圍第1項所述之銲料組成物，更包括 0· 01〜5重量％之材質，其係選自於鎳（Ni )、鈷（Co6. Scope of Patent Application 1. A solder composition comprising: 5 to 20% by weight of chromium (Cr); the rest of the material by weight includes at least tin (Sn), zinc (Zn), bismuth (Bi), indium ( I η); and inevitable impurities. 2. The solder composition according to item 1 of the scope of patent application, further comprising: 0.01 to 10% by weight of a titanium group (IVB) metal element or a mixture of metal elements thereof. 3. The solder composition according to item 1 of the scope of the patent application, further comprising: 0.01 to 10% by weight of a VB metal element or a mixture of metal elements thereof. 4. The solder composition according to item 1 of the scope of patent application, further comprising: 0. 0 1 to 20% by weight of a rare earth group (I I I B) element or a mixture of elements thereof. 5. The solder composition according to item 4 of the scope of patent application, wherein the rare earth group (II IB) element includes at least a group consisting of europium (Ce), europium (Sm), “(Nd), and europium (Lu) one of them. 6. The solder composition described in item 1 of the scope of patent application, further comprising a material of 0. 01 to 10% by weight, which is selected from one of the groups consisting of silver (Ag) and copper (Cu) . 7. The solder composition according to item 1 of the scope of patent application, further comprising 0.01 to 50% by weight of antimony (Sb). 8. The solder composition described in item 1 of the scope of the patent application, further comprising a material from 0.01 to 5% by weight, which is selected from the group consisting of nickel (Ni) and cobalt (Co 11416twf2.ptc 第16頁11416twf2.ptc Page 16
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TWI462712B (en) * 2011-05-13 2014-12-01

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