EP1207539A1 - Glazing covered ferrite core electrode terminal of a surface mounting inductor - Google Patents

Glazing covered ferrite core electrode terminal of a surface mounting inductor Download PDF

Info

Publication number
EP1207539A1
EP1207539A1 EP00125175A EP00125175A EP1207539A1 EP 1207539 A1 EP1207539 A1 EP 1207539A1 EP 00125175 A EP00125175 A EP 00125175A EP 00125175 A EP00125175 A EP 00125175A EP 1207539 A1 EP1207539 A1 EP 1207539A1
Authority
EP
European Patent Office
Prior art keywords
ferrite core
layer
electrode terminal
core electrode
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP00125175A
Other languages
German (de)
French (fr)
Inventor
Joseph M.E. Hsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to EP00125175A priority Critical patent/EP1207539A1/en
Publication of EP1207539A1 publication Critical patent/EP1207539A1/en
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices

Definitions

  • the present invention relates to a ferrite core electrode terminal. More particularly, the present invention relates to a ferrite core electrode terminal of a surface mounting inductor.
  • a conventional ferrite core electrode terminal is coated by a silver paste. Since the surface of the ferrite core electrode terminal has a plurality of gas spacings, some gas spacings will remain between the ferrite core electrode terminal and the silver paste. The silver paste will release from the ferrite core electrode terminal under high temperatures. Furthermore, the surface of the silver paste will be uneven so that a further soldering result will be poor.
  • Object of the present invention is to provide a ferrite core electrode terminal in which the silver paste is firmly bonded to the surface and will not release from the ferrite core electrode terminal even at high temperatures.
  • a ferrite core electrode terminal which has a glazing covered layer between a silver paste layer and a ferrite core so that an electroplating solution will not enter the surface of the ferrite core.
  • a preferred embodiment of the glazing covered ferrite core electrode terminal according to the invention has a glazing covered layer, a silver paste layer, a nickel paste layer, a solder plated layer, and a solder paste layer to reinforce a ferrite core.
  • a glazing covered ferrite core electrode terminal comprises a ferrite core 1, a glazing covered layer 2 coated on a surface of the ferrite core 1, a silver paste layer 3 disposed on the glazing covered layer 2, a nickel plated layer 4 disposed on the silver paste layer 3, a solder plated layer 5 disposed on the nickel plated layer 4, and a solder paste layer 6 disposed on the solder plated layer 5.
  • the glazing covered ferrite core electrode terminal is processed by an infrared reflow method.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

A glazing covered ferrite core electrode terminal has a ferrite core (1), a glazing covered layer (2) coated on a surface of the ferrite core (1), a silver paste layer (3) disposed on the glazing covered layer (2), a nickel plated layer (4) disposed on the silver paste layer (3), a solder plated layer (5) disposed on the nickel plated layer (4), and a solder paste layer (6) disposed on the solder plated layer (5).

Description

  • The present invention relates to a ferrite core electrode terminal. More particularly, the present invention relates to a ferrite core electrode terminal of a surface mounting inductor.
  • A conventional ferrite core electrode terminal is coated by a silver paste. Since the surface of the ferrite core electrode terminal has a plurality of gas spacings, some gas spacings will remain between the ferrite core electrode terminal and the silver paste. The silver paste will release from the ferrite core electrode terminal under high temperatures. Furthermore, the surface of the silver paste will be uneven so that a further soldering result will be poor.
  • Object of the present invention is to provide a ferrite core electrode terminal in which the silver paste is firmly bonded to the surface and will not release from the ferrite core electrode terminal even at high temperatures.
  • The problem is solved by a ferrite core electrode terminal according to claim 1 which has a glazing covered layer between a silver paste layer and a ferrite core so that an electroplating solution will not enter the surface of the ferrite core. A preferred embodiment of the glazing covered ferrite core electrode terminal according to the invention has a glazing covered layer, a silver paste layer, a nickel paste layer, a solder plated layer, and a solder paste layer to reinforce a ferrite core.
  • A preferred embodiment of the present invention will now be described in detail as illustrated in the accompanying drawing in which:
  • FIG. 1 is a schematic view illustrating a ferrite core of a preferred embodiment coated by a glazing covered layer; and FIG. 2 is a sectional assembly view of a glazing covered ferrite core electrode terminal of a preferred embodiment in accordance with the present invention.
  • Referring to FIGS. 1 to 3, a glazing covered ferrite core electrode terminal comprises a ferrite core 1, a glazing covered layer 2 coated on a surface of the ferrite core 1, a silver paste layer 3 disposed on the glazing covered layer 2, a nickel plated layer 4 disposed on the silver paste layer 3, a solder plated layer 5 disposed on the nickel plated layer 4, and a solder paste layer 6 disposed on the solder plated layer 5.
  • The glazing covered ferrite core electrode terminal is processed by an infrared reflow method.

Claims (2)

  1. A glazing covered ferrite core electrode terminal comprising a ferrite core (1) and a silver paste layer (2),
    characterized in that
    a glazing covered layer (2) is coated on the surface of the ferrite core (1) and the silver paste layer (3) is disposed on the glazing covered layer (2).
  2. A glazing covered ferrite core electrode terminal according to claim 1,
    characterized in that
    a nickel plated layer (4) is disposed on the silver paste layer (3),
    a solder plated layer (5) is disposed on the nickel plated layer (4), and
    a solder paste layer (6) is disposed on the solder plated layer (5).
EP00125175A 2000-11-18 2000-11-18 Glazing covered ferrite core electrode terminal of a surface mounting inductor Ceased EP1207539A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP00125175A EP1207539A1 (en) 2000-11-18 2000-11-18 Glazing covered ferrite core electrode terminal of a surface mounting inductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP00125175A EP1207539A1 (en) 2000-11-18 2000-11-18 Glazing covered ferrite core electrode terminal of a surface mounting inductor

Publications (1)

Publication Number Publication Date
EP1207539A1 true EP1207539A1 (en) 2002-05-22

Family

ID=8170414

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00125175A Ceased EP1207539A1 (en) 2000-11-18 2000-11-18 Glazing covered ferrite core electrode terminal of a surface mounting inductor

Country Status (1)

Country Link
EP (1) EP1207539A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140138155A1 (en) * 2011-05-03 2014-05-22 Pilkington Group Limited Glazing with a soldered connector
CN107225336A (en) * 2017-07-18 2017-10-03 中国工程物理研究院流体物理研究所 A kind of welding method of ferrite and metal
US9975207B2 (en) 2011-02-04 2018-05-22 Antaya Technologies Corporation Lead-free solder composition

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4930865A (en) * 1972-07-20 1974-03-19
JPS6117475A (en) * 1984-07-05 1986-01-25 旭化成株式会社 Method of directly bonding metal member to ceramic member
JPH07201603A (en) * 1993-12-28 1995-08-04 Koa Corp Electrode structure for electronic device and its formation
JPH09115772A (en) * 1995-10-19 1997-05-02 Mitsubishi Materials Corp External electrode for chip electronic component
JPH11340053A (en) * 1998-05-29 1999-12-10 Taiyo Yuden Co Ltd Surface mounted coil part
US6027008A (en) * 1997-05-14 2000-02-22 Murata Manufacturing Co., Ltd. Electronic device having electric wires and method of producing same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4930865A (en) * 1972-07-20 1974-03-19
JPS6117475A (en) * 1984-07-05 1986-01-25 旭化成株式会社 Method of directly bonding metal member to ceramic member
JPH07201603A (en) * 1993-12-28 1995-08-04 Koa Corp Electrode structure for electronic device and its formation
JPH09115772A (en) * 1995-10-19 1997-05-02 Mitsubishi Materials Corp External electrode for chip electronic component
US6027008A (en) * 1997-05-14 2000-02-22 Murata Manufacturing Co., Ltd. Electronic device having electric wires and method of producing same
JPH11340053A (en) * 1998-05-29 1999-12-10 Taiyo Yuden Co Ltd Surface mounted coil part

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 11 26 December 1995 (1995-12-26) *
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 09 30 September 1997 (1997-09-30) *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9975207B2 (en) 2011-02-04 2018-05-22 Antaya Technologies Corporation Lead-free solder composition
US20140138155A1 (en) * 2011-05-03 2014-05-22 Pilkington Group Limited Glazing with a soldered connector
US9595768B2 (en) * 2011-05-03 2017-03-14 Pilkington Group Limited Glazing with a soldered connector
CN107225336A (en) * 2017-07-18 2017-10-03 中国工程物理研究院流体物理研究所 A kind of welding method of ferrite and metal
CN107225336B (en) * 2017-07-18 2019-07-30 中国工程物理研究院流体物理研究所 A kind of welding method of ferrite and metal

Similar Documents

Publication Publication Date Title
US6496384B1 (en) Circuit board assembly and method of fabricating same
US6411516B1 (en) Copper slug pedestal for a printed circuit board
EP0893514A3 (en) Aqueous solution for forming metallic complex, tin-silver alloy plating solution, and method of plating with said plating solution
US6292083B1 (en) Surface-mount coil
EP0945880A2 (en) Surface-mount coil
EP1207539A1 (en) Glazing covered ferrite core electrode terminal of a surface mounting inductor
US6197434B1 (en) Glazing covered ferrite core electrode terminal of a surface mounting inductor
CN113079651A (en) Method for realizing automatic welding on PCB and steel mesh for PCB printing
CA2008284A1 (en) Multi-layer ceramic substrate with solder dam on connecting pattern
JPH10135048A (en) Rectangular chip inductor
JP3097415B2 (en) Coil parts
KR200188836Y1 (en) Glazing covered ferrite core electrode terminal of a surface mounting inductor
US5737043A (en) Liquid crystal display panel holding metal fixture
JP2736589B2 (en) Contact and manufacturing method thereof
JP2004200154A (en) Circuit board connecting terminal
JP3743358B2 (en) choke coil
US20010022236A1 (en) Substrate for power semiconductor modules with through-plating of solder and method for its production
CN115360563B (en) Integrated welding method and system for inner and outer conductors of microwave assembly
KR200217691Y1 (en) Glazing covered ferrite core electrode terminal of a surface mounting inductor
JP4371605B2 (en) Battery with terminal
JP4101890B2 (en) Technology to connect points on this card to the metal substrate that supports the printed circuit electronic card
JPH07192937A (en) Metallic-pin fixing structure of ferrite part, inductor using metallic-pin fixing structure and manufacture of inductor
JPS6225856Y2 (en)
CN115770972A (en) CGA soft solder cylinder and preparation method thereof
JPH0740534B2 (en) Inductance device manufacturing method

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

17P Request for examination filed

Effective date: 20021022

AKX Designation fees paid

Designated state(s): DE ES FR GB IE

17Q First examination report despatched

Effective date: 20061030

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED

18R Application refused

Effective date: 20070402