PL2990155T3 - Kompozycja lutu bez ołowiu - Google Patents

Kompozycja lutu bez ołowiu

Info

Publication number
PL2990155T3
PL2990155T3 PL15185011T PL15185011T PL2990155T3 PL 2990155 T3 PL2990155 T3 PL 2990155T3 PL 15185011 T PL15185011 T PL 15185011T PL 15185011 T PL15185011 T PL 15185011T PL 2990155 T3 PL2990155 T3 PL 2990155T3
Authority
PL
Poland
Prior art keywords
lead
free solder
solder composition
composition
free
Prior art date
Application number
PL15185011T
Other languages
English (en)
Inventor
Jennie S Hwang
John Pereira
Alexandra M Mackin
Joseph C Gonsalves
Original Assignee
Antaya Tech Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Antaya Tech Corporation filed Critical Antaya Tech Corporation
Publication of PL2990155T3 publication Critical patent/PL2990155T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/04—Joining glass to metal by means of an interlayer
    • C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
    • C03C27/046—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of metals, metal oxides or metal salts only
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
    • B60Y2410/00—Constructional features of vehicle sub-units
    • B60Y2410/115—Electric wiring; Electric connectors
PL15185011T 2011-02-04 2012-02-01 Kompozycja lutu bez ołowiu PL2990155T3 (pl)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201161439538P 2011-02-04 2011-02-04
US201161540213P 2011-09-28 2011-09-28
EP15185011.2A EP2990155B1 (en) 2011-02-04 2012-02-01 Lead-free solder composition
EP12705540.8A EP2670560B1 (en) 2011-02-04 2012-02-01 Lead-free solder composition

Publications (1)

Publication Number Publication Date
PL2990155T3 true PL2990155T3 (pl) 2018-01-31

Family

ID=45755521

Family Applications (2)

Application Number Title Priority Date Filing Date
PL15185011T PL2990155T3 (pl) 2011-02-04 2012-02-01 Kompozycja lutu bez ołowiu
PL12705540T PL2670560T3 (pl) 2011-02-04 2012-02-01 Kompozycja lutu bez ołowiu

Family Applications After (1)

Application Number Title Priority Date Filing Date
PL12705540T PL2670560T3 (pl) 2011-02-04 2012-02-01 Kompozycja lutu bez ołowiu

Country Status (9)

Country Link
US (4) US8771592B2 (pl)
EP (2) EP2990155B1 (pl)
JP (4) JP2014509944A (pl)
CN (1) CN103476539B (pl)
CA (1) CA2825629A1 (pl)
MX (2) MX344239B (pl)
PL (2) PL2990155T3 (pl)
TW (3) TWI642510B (pl)
WO (1) WO2012106434A1 (pl)

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CN102196881B (zh) * 2008-10-24 2014-06-04 三菱电机株式会社 半导体装置
PL2990155T3 (pl) * 2011-02-04 2018-01-31 Antaya Tech Corporation Kompozycja lutu bez ołowiu
US9595768B2 (en) * 2011-05-03 2017-03-14 Pilkington Group Limited Glazing with a soldered connector
KR101438897B1 (ko) 2012-08-13 2014-09-17 현대자동차주식회사 유리용 무연솔더 조성물
EP3027347A2 (en) * 2013-07-31 2016-06-08 Antaya Technologies Corporation Electrical component having presoldered surface with flux reservoirs
CN104576252A (zh) * 2013-10-16 2015-04-29 斯玛特电子公司 表面贴着式保险丝及具有表面贴着式保险丝的结构
CN115139008B (zh) * 2015-05-15 2023-05-23 安波福技术有限公司 基于铟-锡-银的无铅焊料
JP6725971B2 (ja) * 2015-07-14 2020-07-22 日本板硝子株式会社 ガラス板モジュール
KR20170108766A (ko) * 2016-03-18 2017-09-27 헤베이 리신 테크놀로지 컴퍼니 리미티드 높은 연성을 가지는 무연 솔더 조성물
WO2018168858A1 (ja) * 2017-03-17 2018-09-20 富士電機株式会社 はんだ材
CN114071812A (zh) 2017-11-07 2022-02-18 中央硝子株式会社 车窗用玻璃组件
CN108326464A (zh) * 2018-03-13 2018-07-27 苏州塞澳电气有限公司 一种汽车玻璃专用的无铅焊锡
WO2020050120A1 (ja) * 2018-09-07 2020-03-12 セントラル硝子株式会社 車両窓用ガラスアッセンブリー
CN111250893A (zh) * 2020-03-12 2020-06-09 南通欢腾机电科技有限公司 一种无铅焊料、其制备方法、其应用及金属端子
CN111872596A (zh) * 2020-07-29 2020-11-03 昆山市宏嘉焊锡制造有限公司 一种铟、铅、银、锑低温钎焊料
US11383330B2 (en) 2020-09-21 2022-07-12 Aptiv Technologies Limited Lead-free solder composition
JP2022036898A (ja) * 2021-05-26 2022-03-08 内橋エステック株式会社 鉛フリーはんだ
CN117139917B (zh) * 2023-10-31 2024-03-08 苏州塞一澳电气有限公司 一种汽车玻璃用无铅焊料及其制备方法和应用

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Also Published As

Publication number Publication date
EP2990155A1 (en) 2016-03-02
US9975207B2 (en) 2018-05-22
EP2670560A1 (en) 2013-12-11
CA2825629A1 (en) 2012-08-09
US8771592B2 (en) 2014-07-08
CN103476539A (zh) 2013-12-25
TW201726291A (zh) 2017-08-01
TW201238696A (en) 2012-10-01
JP2014509944A (ja) 2014-04-24
MX356849B (es) 2018-06-15
US20140271343A1 (en) 2014-09-18
TWI642510B (zh) 2018-12-01
PL2670560T3 (pl) 2016-04-29
US20120222893A1 (en) 2012-09-06
US10105794B2 (en) 2018-10-23
TWI505897B (zh) 2015-11-01
JP2020040127A (ja) 2020-03-19
TWI583481B (zh) 2017-05-21
JP2016052684A (ja) 2016-04-14
BR112013019849A2 (pt) 2016-10-11
JP6846328B2 (ja) 2021-03-24
MX2013009014A (es) 2013-12-06
JP6928062B2 (ja) 2021-09-01
JP6243893B2 (ja) 2017-12-06
WO2012106434A1 (en) 2012-08-09
EP2990155B1 (en) 2017-09-27
JP2018039053A (ja) 2018-03-15
EP2670560B1 (en) 2016-01-13
US20170190004A1 (en) 2017-07-06
TW201538263A (zh) 2015-10-16
CN103476539B (zh) 2016-08-17
US20180207753A1 (en) 2018-07-26
MX344239B (es) 2016-12-07

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